KE-2070_2080 動作説明書.pdf - 第4页
R e v 1 . 00c 动作说明书 ii 3-6 芯片跳起检测 .............................................................................................................................. ................3-32 3-6-1 概 要 ............................…
Rev1.00c
动作说明书
i
目 录
1 电气装备部概要..........................................................................................................................1-1
1-1 电气装备部的布局......................................................................................................................................1-1
2 各驱动轴（X，Y，Z，θ 轴）的说明 .............................................................................2-1
2-1 Y 轴 ....................................................................................................................................................................2-1
2-1-1 组成.....................................................................................................................................................................................2-1
2-1-2 性能.....................................................................................................................................................................................2-1
2-1-3 故障检测（外部编码器的断线检测） ................................................................................................................2-2
2-2 X 轴....................................................................................................................................................................2-2
2-2-1 组成.....................................................................................................................................................................................2-2
2-2-2 性能.....................................................................................................................................................................................2-3
2-2-3 故障检测（外部编码器的断线检测） ................................................................................................................2-3
2-3 贴装元件用的贴装头轴（Z，θ 轴）................................................................................................2-3
2-3-1 LNC60 轴...........................................................................................................................................................................2-4
2-3-2 IC 贴装头轴 .....................................................................................................................................................................2-6
3 关于各项功能...............................................................................................................................3-1
3-1 原点复归动作................................................................................................................................................3-1
3-1-1 X，Y，Z，θ 轴 ............................................................................................................................................................3-1
3-1-2 支撑台原点复归动作...................................................................................................................................................3-3
3-2 基板传送..........................................................................................................................................................3-4
3-2-1 传送电动机......................................................................................................................................................................3-5
3-2-2 支撑台................................................................................................................................................................................3-6
3-2-3 基板传送同步时间图...................................................................................................................................................3-9
3-3 吸嘴更换动作..............................................................................................................................................3-11
3-3-1 有θ修正时 ...................................................................................................................................................................3-11
3-3-2 无θ修正时 ...................................................................................................................................................................3-12
3-3-3 激光测定........................................................................................................................................................................3-13
3-4 激光识别、ＶＣＳ识别元件的安装流程............................................................................................3-14
3-4-1 激光识别元件的安装流程......................................................................................................................................3-14
3-4-2 VCS 识别元件的贴装流程 .....................................................................................................................................3-14
3-5 Zθ轴动作.....................................................................................................................................................3-15
3-5-1. Z 轴的速度分类 .........................................................................................................................................................3-15
3-5-2. Z 轴的动作行程 .........................................................................................................................................................3-17
3-5-3. Z 轴的速度比，加速度比......................................................................................................................................3-26
3-5-4. θ轴的速度比................................................................................................................................................................3-30
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3-6 芯片跳起检测..............................................................................................................................................3-32
3-6-1 概要..................................................................................................................................................................................3-32
3-6-2 判定方法 ........................................................................................................................................................................3-32
3-7 真空同步时间..............................................................................................................................................3-35
3-7-1 元件类别的分类..........................................................................................................................................................3-35
3-7-2 吸附时的真空同步时间...........................................................................................................................................3-35
3-7-3 贴装时的真空同步时间 <1>.................................................................................................................................3-37
3-7-4 向废弃箱之外废弃元件时的真空同步时间 <1>..........................................................................................3-38
3-7-5 向废弃箱废弃元件时的真空同步时间 <1>....................................................................................................3-39
3-8 激光识别动作..............................................................................................................................................3-40
3-9 激光识别异常..............................................................................................................................................3-43
3-10 供料器的驱动............................................................................................................................................3-45
3-11 ＶＣＳ识别动作...........................................................................................................................................3-49
3-11-1 部元件图像识别，贴装动作时间曲线 ...........................................................................................................3-50
3-11-2 照明动作说明 ............................................................................................................................................................3-51
3-11-3 各照明装置的最大电流值....................................................................................................................................3-54
3-11-4 元件分类的照明无效值.........................................................................................................................................3-55
3-11-5 大型视觉元件识别样子的控制..........................................................................................................................3-56
3-11-6 大型视觉元件高度控制.........................................................................................................................................3-57
3-11-7 大型视觉元件和已贴装元件的元件高度限制.............................................................................................3-60
3-11-8 实效元件外形尺寸 ..................................................................................................................................................3-61
3-11-9 分割识别控制 ............................................................................................................................................................3-62
3-11-10 分割识别时的分割间隔 ......................................................................................................................................3-63
3-11-11 动态分割识别..........................................................................................................................................................3-64
3-11-12 分割识别时的方式................................................................................................................................................3-65
3-12 ＢＯＣ标识识别..........................................................................................................................................3-66
3-12-1 动作时间......................................................................................................................................................................3-66
3-12-2 识别顺序......................................................................................................................................................................3-67
3-12-3 指定标记的修正方法 .............................................................................................................................................3-68
3-12-4 OCC（Offset Correction Camera）的说明 ..................................................................................................3-71
3-13 坏标记检测 ................................................................................................................................................3-73
3-13-1 坏标记检测.................................................................................................................................................................3-73
3-14 共面测定 .....................................................................................................................................................3-74
3-14-1 共面测定方法 ............................................................................................................................................................3-74
3-14-2 共面测定时的 XY 轴动作 .....................................................................................................................................3-75
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3-14-3 共面测定可能的元件外形尺寸..........................................................................................................................3-76
3-14-4 共面分割测定动作..................................................................................................................................................3-76
3-14-5 测定模式的变换.......................................................................................................................................................3-77
3-14-6 共面测定方式的不同.............................................................................................................................................3-77
3-14-7 共线测定方式............................................................................................................................................................3-78
4 机器部的说明...............................................................................................................................4-1
4-1 人机部的构成................................................................................................................................................4-1
4-2 人机部的功能................................................................................................................................................4-1
5 机器控制部的说明.....................................................................................................................5-1
5-1 各基板的功能................................................................................................................................................5-2
5-1-1 CPU 基板 ..........................................................................................................................................................................5-2
5-1-2 POSITION 控制板..........................................................................................................................................................5-4
5-1-3 IEEE1394A 板 ..................................................................................................................................................................5-4
5-1-4 接口桥基板......................................................................................................................................................................5-4
5-1-5 SAFETY 基板、CARRY 基板 ...................................................................................................................................5-5
5-1-6 ＢＡＳＥ−ＦＥＥＤＥＲ基板、温度传感器基板......................................................................................................5-6
5-1-7 Ｉ／Ｏ 控制器基板（４０００１９４３）...................................................................................................................5-8
5-1-8 贴装头主基板 .................................................................................................................................................................5-8
5-1-9 操作基板（４０００１９５２）....................................................................................................................................5-15
5-1-10 ＬＩＧＨＴ ＣＴＲＬ基板.................................................................................................................................................5-16
5-1-11 ＩＰ−Ｘ３Ｒ机板............................................................................................................................................................5-18
5-2 马达的控制方式.........................................................................................................................................5-19
5-2-1 XY 轴的控制方式 .......................................................................................................................................................5-19
5-2-2 Ｚ，θ 轴的控制方式 ................................................................................................................................................5-21
5-2-3 基板传送部的控制方式...........................................................................................................................................5-22
6 故障处理.........................................................................................................................................6-1
6-1 元件贴装..........................................................................................................................................................6-1