KE-2070_2080 動作説明書.pdf - 第5页
R e v 1 . 00c 动作说明书 iii 3-14-3 共面测定可能的元件外形尺寸 .......................................................................................................................... 3-76 3-14-4 共面分割测定动作 ...............................…
Rev1.00c
动作说明书
ii
3-6 芯片跳起检测..............................................................................................................................................3-32
3-6-1 概要..................................................................................................................................................................................3-32
3-6-2 判定方法 ........................................................................................................................................................................3-32
3-7 真空同步时间..............................................................................................................................................3-35
3-7-1 元件类别的分类..........................................................................................................................................................3-35
3-7-2 吸附时的真空同步时间...........................................................................................................................................3-35
3-7-3 贴装时的真空同步时间 <1>.................................................................................................................................3-37
3-7-4 向废弃箱之外废弃元件时的真空同步时间 <1>..........................................................................................3-38
3-7-5 向废弃箱废弃元件时的真空同步时间 <1>....................................................................................................3-39
3-8 激光识别动作..............................................................................................................................................3-40
3-9 激光识别异常..............................................................................................................................................3-43
3-10 供料器的驱动............................................................................................................................................3-45
3-11 ＶＣＳ识别动作...........................................................................................................................................3-49
3-11-1 部元件图像识别，贴装动作时间曲线 ...........................................................................................................3-50
3-11-2 照明动作说明 ............................................................................................................................................................3-51
3-11-3 各照明装置的最大电流值....................................................................................................................................3-54
3-11-4 元件分类的照明无效值.........................................................................................................................................3-55
3-11-5 大型视觉元件识别样子的控制..........................................................................................................................3-56
3-11-6 大型视觉元件高度控制.........................................................................................................................................3-57
3-11-7 大型视觉元件和已贴装元件的元件高度限制.............................................................................................3-60
3-11-8 实效元件外形尺寸 ..................................................................................................................................................3-61
3-11-9 分割识别控制 ............................................................................................................................................................3-62
3-11-10 分割识别时的分割间隔 ......................................................................................................................................3-63
3-11-11 动态分割识别..........................................................................................................................................................3-64
3-11-12 分割识别时的方式................................................................................................................................................3-65
3-12 ＢＯＣ标识识别..........................................................................................................................................3-66
3-12-1 动作时间......................................................................................................................................................................3-66
3-12-2 识别顺序......................................................................................................................................................................3-67
3-12-3 指定标记的修正方法 .............................................................................................................................................3-68
3-12-4 OCC（Offset Correction Camera）的说明 ..................................................................................................3-71
3-13 坏标记检测 ................................................................................................................................................3-73
3-13-1 坏标记检测.................................................................................................................................................................3-73
3-14 共面测定 .....................................................................................................................................................3-74
3-14-1 共面测定方法 ............................................................................................................................................................3-74
3-14-2 共面测定时的 XY 轴动作 .....................................................................................................................................3-75
Rev1.00c
动作说明书
iii
3-14-3 共面测定可能的元件外形尺寸..........................................................................................................................3-76
3-14-4 共面分割测定动作..................................................................................................................................................3-76
3-14-5 测定模式的变换.......................................................................................................................................................3-77
3-14-6 共面测定方式的不同.............................................................................................................................................3-77
3-14-7 共线测定方式............................................................................................................................................................3-78
4 机器部的说明...............................................................................................................................4-1
4-1 人机部的构成................................................................................................................................................4-1
4-2 人机部的功能................................................................................................................................................4-1
5 机器控制部的说明.....................................................................................................................5-1
5-1 各基板的功能................................................................................................................................................5-2
5-1-1 CPU 基板 ..........................................................................................................................................................................5-2
5-1-2 POSITION 控制板..........................................................................................................................................................5-4
5-1-3 IEEE1394A 板 ..................................................................................................................................................................5-4
5-1-4 接口桥基板......................................................................................................................................................................5-4
5-1-5 SAFETY 基板、CARRY 基板 ...................................................................................................................................5-5
5-1-6 ＢＡＳＥ−ＦＥＥＤＥＲ基板、温度传感器基板......................................................................................................5-6
5-1-7 Ｉ／Ｏ 控制器基板（４０００１９４３）...................................................................................................................5-8
5-1-8 贴装头主基板 .................................................................................................................................................................5-8
5-1-9 操作基板（４０００１９５２）....................................................................................................................................5-15
5-1-10 ＬＩＧＨＴ ＣＴＲＬ基板.................................................................................................................................................5-16
5-1-11 ＩＰ−Ｘ３Ｒ机板............................................................................................................................................................5-18
5-2 马达的控制方式.........................................................................................................................................5-19
5-2-1 XY 轴的控制方式 .......................................................................................................................................................5-19
5-2-2 Ｚ，θ 轴的控制方式 ................................................................................................................................................5-21
5-2-3 基板传送部的控制方式...........................................................................................................................................5-22
6 故障处理.........................................................................................................................................6-1
6-1 元件贴装..........................................................................................................................................................6-1
Rev1.00c
动作说明书
1-
1
图
14-1-1
主机正面图
图
14-1-2
主机
背
面图
1 电气装备部概要
1-1 电气装备部的布局
1. 图像用监视器、2. 信号灯、3. 液晶监视器
4. HOD
5. 操作面板
[正面：LCD 监视器、操作电路板]
[反面：操作开关电路板]
6. 贴片头装置
[贴片头主电路板组、贴片头中继电路板组、Z/θ 轴伺服
放大器、HMS、点传感器 选购件：坏板标记阅读器]
7. OCC 摄像机，垂直照明电路板组（左，右）、角度照明
电路板（左，右）
8. 键盘
9. 鼠标
10. 电源开关
11. 现在未使用
12. IDE I/F FDD（选购件）
13. HDD
14. 控制装置
[CPU板、位置运动控制板、总线桥接板、IEEE1394A
板、XY RELAY电路板、SAFETY 电路板、
BASE-FEEDER电路板、I/O CTRL电路板、LIGHT CTRL
电路板、IP-X3R 电路板、c-PCI BACK BOARD、VME
BACK BOARD、
选购件：N-VERIFY I/F 电路板、I-CX 电路板]
15. XY 轴 AC 伺服放大器
16. 真空泵（选购件）
17. 5 相步进驱动器
（用于支撑台电动机、
选购件：用于传送通路宽度自动调整电动机]
18. CARRY
中继电路板
19. XY 伺服用变压器
20. 电源装置
21. UPS（不间断电源）
22. DC 电源用变压器
23. 断路器
24. AC 输入装置