KE-750_MAINTE.pdf - 第109页

3.12 BOC Mark Recognition Operation timing The figure below shows the operation timing of X-Y axes of t he main unit and of the recognition unit for BOC mark recognition. To next action X-Y axes Recognition unit Camera c…

3.11 Part Recognition Process

Part recognition using the VCS is performed as shown below:

START

Recognition result, received?

Sends the switch command to the

VCS camera for recognition

Moves the X-Y, Z, and θ axes to the

part recognition unit.

Completes component pick.

Turns on the VCS light.

Sends the part recognition command

to the part recognition unit.

Completes the direct interruption from

the part recognition unit, and waiting

communication reception.

Turns off the VCS light.

Other operations

Obtains the mount coordinate with

which part recognition correction has

been completed.

Moves the X-Y, and θ axes to the

mount coordinate.

Performs mounting.

Moves the X-Y, and θ axes to the coordinate

before part recognition correction.

Waits the result of recognition from the

recognition unit.

End

YES

*1: The coordinates of the axes when part recognition are

as follows:

*2: No action is expected in many cases where mounting is

performed in sequence with the general head which

performs pick and mount with the IC dedicated.

X-Y axes

Z axis

θ axis

The rotating center of the IC head is placed at

the recognition center for the VCS camera.

At the bottom end of the nozzle, and (10 mm

+ part height) from the board surface.

The most nearest direction of the part when

mounted from 0, 90, 180, or 270 degree with

respect to the direction where the direction of

the picked part matches the Y axis direction

of the VCS camera's image.

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3.12 BOC Mark Recognition

Operation timing

The figure below shows the operation timing of X-Y axes of the main unit and of

the recognition unit for BOC mark recognition.

To next action

X-Y axes

Recognition

unit

Camera change Image recognition Mark recognition

① When BOC recognition operation is started, the X-Y axes are started to

move to the BOC mark recognition position, and, at the same time, the

camera switch command to the BOC camera is sent to the recognition unit.

At this time, the BOC light turns on.

② When movement to the BOC mark recognition position is complete, the

BOC mark recognition command of the recognition unit is sent.

③ When the image recognition completion signal from the recognition unit is

received, the X-Y axes is started to move to the recognition position of the

next mark. After that, the mark recognition process is continued with the

recognition unit.

④ When the result of recognition from the recognition unit is received, the

camera switch command is sent again.

⑤ Steps ② to ④ are repeated until the last BOC mark. When the image of

the last BOC mark is obtained, the BOC light is turned off.

⑥ Waits the result of the image recognition of the last BOC mark from the

recognition unit, and performs the next action.

Recognition sequence

The sequence of BOC mark recognition is different between the BOC mark

recognition per board and the BOC mark recognition per circuit, and they are

performed as follows:

- For the BOC recognition per board

BOC mark recognition is performed from BOC mark position No.1, to No.2, to

No.3 which are shown as the board data.

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- For the BOC recognition per circuit

From circuit No.1, in the same manner as for the BOC recognition per board,

BOC mark recognition is performed per circuit. When recognition of all BOC

marks on the circuit is complete, BOC recognition process of the next circuit is

performed in ascending order of the circuit numbers.

The circuit numbers for non-matrix split boards, the order of the number is the

one for the circuit location input from the board data input.

The circuit numbers for matrix split boards, it is to be counted in an increasing

order of the X axis at the side of the circuit close to the machine origin of the X

axis. This is repeated in increasing order of the Y axis from the machine origin

side of the Y axis. For 4 by 4 matrix split boards, the circuit numbers are as

shown below.

Fiducial mark correction algorithm

In case of 3-point BOC mark

When points M1, M2, and M3 shown as (○) in the figure above are the BOC

mark coordinates in the board data, and when the actual coordinates obtained

by the recognition of each point are M1', M2', and M3' shown as (●), obtain

point P' (■) which is the actual mount coordinate with respect to point P (□)

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