KE-750_MAINTE.pdf - 第84页

⑫ XY Moves by adding the offset of Δ X and Δ Y which is the result of the laser measurement of the R head. After move ment is complete, vacuum check is performed to detect whether or not the part is picked. If no part st…

3.5 Pick/mount operation (KE-760)

Simultaneous pick and alternate mount by two heads on KE-760 (0° pick- 0°

mount)

No. Drive axis Operation

①

XY Moves from the mount position to the pick position.

②

LZ, RZ Moves down from the top standby position for part pick.

③

LZ, RZ After picking the part, moves up to the laser measurement height. After moved

up, vacuum check is performed to detect whether the part is set. If no part

status is detected, check is performed again by Measure Once command using

laser. If no part status is detected again, re-pick is performed with the number

of retries specified for part data.

④

Lθ, Rθ

Pre-rotate (normally, 30°) is performed while the Z axis is moving up.

⑤

XY Moves from the pick position to the theoretical coordinate of the mount position.

⑥

Lθ, Rθ

Laser measurement (150° rotation) is performed when XY is moving. When a

laser error occurs, laser measurement is performed again by setting the

pre-rotate angle to 40°. When the same error occurs again, the part is

discharged. When a correct measurement result is obtained, and when the

chip rise detection is set on, an operation for the detection is performed by

adjusting the Z axis to the chip rise detection height.

⑦

LZ, RZ Immediately after the laser measurement, moves from the laser measurement

height to the standby position at the top.

⑧

Lθ, Rθ

Immediately after the laser measurement of each head, rotates for the mount

angle which is the measured result plus Δθ.

⑨

After moving to the theoretical coordinate, moves by the offset of ΔX and ΔY

which is the result of the laser measurement of the L head. After movement is

complete, vacuum check is performed to detect whether or not the part is

picked. If no part status is detected, the Z axis is moved up. Then, the part is

adjusted to the laser height, and check is performed again by Measure Once

command using laser. If no part status is detected again, the part is

discharged and re-pick is performed.

⑩

LZ After stopping X and Y, the L head moves down immediately for mounting.

⑪

LZ The L head moves from the mount height to the standby position at the top.

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⑫

Moves by adding the offset of ΔX and ΔY which is the result of the laser

measurement of the R head. After movement is complete, vacuum check is

performed to detect whether or not the part is picked. If no part status is

detected, the Z axis is moved up. Then, the part is adjusted to the laser

height, and check is performed again by Measure Once command using laser.

If no part status is detected again, the part is discharged and re-pick is

performed.

⑯

RZ After stopping X and Y, the R head moves down immediately for mounting.

⑰

RZ The R head moves from the mount height to the standby position at the top.

⑱

XY Moves from the mount position to the pick position.

⑲

Lθ, Rθ While X and Y are moving, returns each θ axis from the mount angle to 0°.

The figure below shows the production operation sequence. t in the figure is thickness of the

element.

Top surface of

the board

① First, at the pick position, the distance between the tip of the nozzle and the surface of the board

(the same as the top surface of the part to be picked) is 13 mm.

② Moves down by 13.5 mm to pick the part (13 mm + 0.5 mm of pushing amount which is a default

value and changeable as part data).

③ Moves up by (23 + t/2) mm so that the center (middle level) of the part is placed at the same level

as the laser surface which is 22.5 mm. This movement is a default setting, and it can be

changed as part data.

④ After measured by LA, moves down by (9.5 - t/2) mm so that the bottom tip of the part is set at 13

mm height.

⑤ Moves down by 13.5 mm which is the distance between the top surface of the board and the

bottom tip of the part, plus 0.5 mm (default value) which is nozzle pushing amount.

⑥ Moves up by (13.5 - t) mm so that the bottom tip of the nozzle is set 13 mm above the top

surface of the board.

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KE-760 Picture Recognition Mount

No. Drive axis Operation

①

XY Moves from the mount position to the pick position.

②

RZ Moves down from the top standby position to the pick height for part pick.

③

RZ After picking the part, moves the bottom surface of the part up to the standby

position at the top. After moved up, vacuum check is performed to detect

whether the part is set. If no part status is detected, re-pick is performed with

the number of retries specified for part data.

④

XY Moves the R head from the pick position to the vision recognition camera.

⑤

Rθ

At the same time when the X and Y axes start to move, rotate for the mount

angle.

⑥

RZ After the movement of the vision recognition camera is complete, the Z axis is

moved down so that the bottom tip of the part is set at the recognition height.

⑦

VCS Picture recognition and computation are performed.

⑧

RZ After vision recognition, the Z axis is moved up so that the bottom tip of the part

is moved from the recognition height to the standby position at the top.

⑨

XY After vision recognition, moves to the theoretical coordinate for the mount.

⑩

After moving to the theoretical coordinate, moves by the offset of ΔX and ΔY

which is the result of the vision recognition computation. (Correction)

⑪

Rθ Rotates by the offset of Δθ which is the result of the vision recognition

computation.

⑫

After correcting X, Y, and θ, moves down for mount. Immediately before

moving down, vacuum check is performed to detect whether or not the part is

picked. If no part status is detected, the part is discharged and re-pick is

performed.

⑬

RZ The R head moves from the mount height to the standby position at the top.

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