KE-750_MAINTE.pdf - 第134页
- 131 - 2. Problems caused by mount program entered Symptom Cause Remedy There is an offset in XY and θ axes. (In particular, small-sized parts such as SOT and square chips). This can occur for part data of SOT, etc., if…
- 130 -
Symptom Cause Remedy
There is an
offset among XY
and θ when
mounting using
adhesive. (In
particular, for
medium-size
parts such as
aluminum
electrolytic
capacitors,
tantalum
capacitors, and
trimmers)
Medium-sized tall parts such as aluminum
electrolytic capacitors, tantalum
capacitors, and trimmers are likely to roll.
And, this is also affected by warp and size
of the board. Warp of the board when
mounting is a repulsion force of Z upward
movement, resulting in an offset. The
offset is mainly found in θ axis.
It is better to apply much adhesive.
On the mounter, install a backup pin
under the board around where the
parts are mounted to prevent board
warp. If this is not effective
enough, change the lift up speed to
medium or low after mounting.
There is an
offset in XY and
θ axis when
placement on
cream solder.
(When this
occurs with all
parts.)
For cream soldering, different from the
case of adhesive, there is little effect with
printing offset because of wide pat.
However, for soldering, leaving time and
viscosity after printing largely affect the
performance. The conditions of the
leaving time and the viscosity cannot be
the same because of the difference in type
of the solder, humidity of the leaving time,
and environmental conditions.
Check that the solder is dried out
before mounting.
There is an
offset in XY and
θ axis when
placement on
cream solder.
(In particular,
medium-sized
parts such as
aluminum
electrolytic
capacitors,
tantalum
capacitors, and
trimmers.)
This is also affected by dry soldering.
However, in this case, the same as the
adhesive, thickness and size of the board
affect the performance. Warp of the
board when mounting is a repulsion force
of Z upward movement, resulting in an
offset. In some case, it jumps.
Install a backup pin under the board
around where the parts are
mounted to prevent board warp. If
this is not effective enough, change
the lift up speed to medium or low
after mounting.
- 131 -
2. Problems caused by mount program entered
Symptom Cause Remedy
There is an
offset in XY and
θ axes. (In
particular,
small-sized parts
such as SOT
and square
chips).
This can occur for part data of SOT, etc., if
incorrect part size (width and depth) or
incorrect feeding direction is entered. In
this case, a laser error also occurs. (Error
code 98)
For part size, if the dimensions at a
feeding angle of 0 degree has been
entered, but it is set for 90 degrees, enter
the width and depth of setting of 0 degree.
If not, the mounter will measure first the
longer side of the part, and the minimum
width of the shadow cannot be measured.
Then, an error occurs. Even if it can be
measured and mounting is performed, an
offset will occur because of inaccurate
measurement data used.
Check the part data so that the
feeding angle is set correctly as part
dimensions.
There is an
offset in XY and
θ axes.
There is an offset caused by incorrect
measured value where the laser height for
the laser measurement is not set correctly.
In some cases, this can be indicated as a
laser error.
For the laser height of the laser
measurement, it is automatically computed
according to the part type and part height
in the part data. This will occur when
either of them is set incorrectly.
Check the part type and part height
of the part data, and also the laser
measurement height. For a
special shaped part which does not
indicate the part type, check the
appropriate value for the
measurement height by manual
control (laser control), and enter that
value for the part data.
There is an
offset in XY
axes.
There is a difference in the distance of
BOC marks between their centers from
the mark coordinate value of the board
data. Mount displacement results in an
offset of right angle or in longer/shorter XY
axes. The distance between the centers
of the mark may be large when the set
value is larger than the measured value on
the machine. It is smaller when opposite.
Measure the distance between the
centers of the mark by camera
teaching. (If possible, use a
2-dimensional measuring
instrument.) Then, compare the
measured value with the set value.
Check by loading the board before
mounting so that the mount pattern
matches by mount tracking.
There is an
offset in θ axis.
There is an offset in pick position. For
the part whose pick position is easy to slip
such as square chip resistors, network
resistors, etc., when the nozzle diameter is
small but the part size is large, an offset
will occur when rotating if the part is
displaced and picked.
Check first the pick position. If
some cases, consider the use of a
specially ordered nozzle.
- 132 -
3. Problems caused by cramp state of the board on the board carriage
Symptom Cause Remedy
There is an
offset in XY and
θ axes.
(Specific area of
the board or
entire board)
The side cramp of the board is insufficient,
and there is a play in vertical direction.
The board moves in XYZ directions during
production.
Load the board by manual control,
and check that there is no play
upwards and downwards of the
board when it is cramped. If there
is play, readjust the mount position
of the rail guide shaft. (See QA
table: Carriage No.4.)
There is an
offset in XY and
θ axes.
(Around the
center of the
board)
There is a large space between the
backup pin and the bottom surface of the
board when the board is cramped, and the
board vibrates up and down when
mounting. This is likely to occur with a
large thin board.
Check the space between the
backup pin and the bottom surface
of the board. If it is too large,
readjust the height of the backup
pin. (See QA table: Carriage
No.8.)
There is an
offset in XY and
θ axes.
(Specific area of
the board)
The top surface of the board is not flat,
and this can occur when the part does not
gently touch the board but it is roughly
brought onto the board when mounting.
Check that the height of the top
surface of the CAL block and of the
top surface of the board is set within
the specified value. (See QA table:
Carriage No.10.) This can also be
checked with the HMS.
There is an
offset in XY and
θ axes. (Entire
board)
The clearance between the fiducial pin
and the positioning hole of the board is too
large, and the vibration during production
moves the board.
Change the positioning of the board
from pin fiducial to pattern fiducial.
There is an
offset in XY and
θ axes. (Entire
board)
There is too much play of the fiducial pin. Check that the play of the fiducial
pin is within the specified value.
(See QA table: Carriage No.5.)
There is an
offset in XY and
θ axes. (Entire
board)
When carrying in the board, deceleration
immediately before touching the stopper is
not effective, and the part is displaced by
the shock.
Check that there is no displacement
before and after board carriage. If
there an offset, change the position
of the STOP sensor, and adjust so
that the deceleration is carried out
correctly. (See QA table: Carriage
No.1.)
There is an
offset in XY and
θ axes. (Entire
board)
The shock caused by the upward and
downward movement of the backup table,
and by cramping and decramping, the
already mounted parts or normally
mounted part is displaced.
Readjust the speed control of
upward and downward movement of
the backup table. Readjust also
the orifice of the shock absorber.
(See QA table: Carriage No.4.)
There is an
offset in XY and
θ axes. (Entire
board)
When pattern fiducial is used, the shock of
the X cramp and Y cramp displace the part
previously mounted.
Check the depressure valve of the X
and Y cramps and the adjustment
value of the speed controller. (See
QA table: Carriage No.13 and
No.14.)
There is an
offset in Y axes.
(Entire board)
When patter fiducial is used, the
protruding amount of the Y pusher is
insufficient, and the part does not touch
the board. Or, carriage width is set too
large.
Perform readjustment if the
protruding amount of the Y pusher
is less than the specified value.
(See QA table: Carriage No.14.)