KE-750_MAINTE.pdf - 第87页
Speed and acceleration for the θ axis to rotate for lazer measurement Speed and acceleration for the θ axis to rotate for outside-lazer measurement Low speed 50 385 20 5 279.9 Medium speed 93 1328 37 18 150.68 High speed…
3.6 Z/θ operation classification, speed, and acceleration by part types
Typical partDown Up Down Up
Measurement
Outside-measurement
Type No.
Part type
Minimum part width (W)
1005
1608
2125 3216
ss mini, s mini
SOT23
Square chip
network resistor
Melf
SOT
PLCC
SOJ
J-lead socket
Gull-wing socket
Socket with bumper
One-way lead connector
SOP
TSOP
HSOP
Two-way lead connector
QFP
BGA
BQFP
Aluminum electrolytic capacitor
Tantalum capacitor
Trimmer capacitor
GaAsFET
Others
TYPE 1
TYPE 0
TYPE 0
TYPE 2
TYPE 9
TYPE 0
TYPE 2
TYPE 9
TYPE 0
TYPE 0
TYPE 2
TYPE 9
TYPE 4
TYPE 3
TYPE 4
TYPE 5
TYPE 0
TYPE 2
TYPE 9
TYPE 9
0.5≦W＜0.8
0.8≦W＜1.25
1.25≦W＜2.5
2.5≦W＜20
20≦W＜50
0.5≦W＜2.5
2.5≦W＜20
20≦W＜50
0.5≦W＜1.25
1.25≦W＜2.5
2.5≦W＜20
20≦W＜50
0.5≦W＜50
0.5≦W＜5
5≦W＜50
0.5≦W＜50
0.5≦W＜3.2
3.2≦W＜33.5
33.5≦W
＜50
0.5≦W＜50
Medium speed
Medium speed
High speed
High speed
High speed
High speed
High speed
High speed
Medium speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
Medium speed
Medium speed
Medium speed
Medium speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
Medium speed
Medium speed
Medium speed
Medium speed
Medium speed
Medium speed
Medium speed
High speed
High speed
High speed
High speed
Medium speed
Medium speed
Medium speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
High speed
Low speed
Medium speed
Low speed
Low speed
High speed
High speed
High speed
Low speed
High speed
High speed
High speed
High speed
Low speed
High speed
High speed
Low speed
High speed
High speed
High speed
Low speed
Medium speed
Medium speed
Medium speed
Medium speed
High speed
High speed
Low speed
High speed
Z axis at pick Z axis at mount
Speed classification of Z and θ axes
θ axis
Speed classification of the Z and θ axes
when centering is set for laser
Down Up Down Up
Type No.
Part type
Minimum part width (W)
PLCC
SOJ
J-lead socket
Gull-wing socket
Socket with bumper
One-way lead connector
SOP
TSOP
HSOP
Two-way lead connector
QFP
BGA
BQFP
GaAsFET
Aluminum electrolytic capacitor
TYPE 7
TYPE 6
TYPE 7
W≦50
W≦50
W≦50
High speed
High speed
High speed
High speed
High speed
High speed
Medium speed
Low speed
Low speed
High speed
High speed
Medium speed
Medium speed
Medium speed
Medium speed
Z axis at pick Z axis at mount
Speed classification of Z and θ axes
θ axis
Speed classification of the Z and θ axes
when centering is set for vision
NOTE 1: For the speed of the Z axis to move up for pick, the speed is changed to medium when the part size exceeds 8 × 8 mm.
NOTE 2: For the θ speed outside-measurement, including vision recognition, the speed is changed to low when the part size exceeds 20 × 20 mm.
Speed and acceleration for the Z axis to move down for part pick
Cover open
20
1200
206.6
Low speed
37.2
3720
20
112.1
Medium speed
74.4
7440
40
61
High speed
186
18600
100
30.4
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio (ratio % to high speed)
Operating time (ms), Stroke 9.5 mm
KE-750
standard
machine
Cover open
20
1200
286.6
Low speed
43.2
4320
20
135
Medium speed
97.2
9720
45
65.5
High speed
216
21600
100
35
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio (ratio % to high speed)
Operating time (ms), Stroke 13.5 mm
KE-760
standard
machine
Cover open
30
1500
333.3
Low speed
75
7500
25
135.3
Medium speed
180
18000
60
62.2
High speed
300
30000
100
41.3
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio (ratio % to high speed)
Operating time (ms), Stroke 23.5 mm
KE-750
20-mm
application
machine
Cover open
30
1500
333.3
Low speed
75
7500
25
135.3
Medium speed
180
18000
60
62.2
High speed
300
30000
100
41.3
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio (ratio % to high speed)
Operating time (ms), Stroke 23.5 mm
KE-760
20-mm
application
machine
Speed and acceleration for the Z axis to move up for part pick
Cover open
20
1200
372.6
Low speed
60
6000
20
128.6
Medium speed
120
12000
40
69.3
High speed
300
30000
100
33.7
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio (ratio % to high speed)
Operating time (ms), Stroke 17.8 mm
KE-750
standard
machine
Cover open
20
1200
482.7
Low speed
60
6000
20
165.3
Medium speed
135
13500
45
79
High speed
300
30000
100
41.1
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio (ratio % to high speed)
Operating time (ms), Stroke 23.3 mm
KE-760
standard
machine
Cover open
30
1500
444
Low speed
75
7500
25
179.6
Medium speed
180
18000
60
80.6
High speed
300
30000
100
52.4
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio (ratio % to high speed)
Operating time (ms), Stroke 31.8 mm
KE-750
20-mm
application
machine
Cover open
30
1500
470.6
Low speed
75
7500
25
190.3
Medium speed
180
18000
60
85.1
High speed
300
30000
100
55.1
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio (ratio % to high speed)
Operating time (ms), Stroke 33.8 mm
KE-760
20-mm
application
machine
Speed classification of the Z and θ axes of KE-750/760
- 83 -
Speed and acceleration for the θ axis to rotate for lazer measurement
Speed and acceleration for the θ axis to rotate for outside-lazer measurement
Low speed
50
385
20 5
279.9
Medium speed
93
1328
37 18
150.68
High speed
250
7500
100
63.25
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio
(ratio % to high speed L: Speed, R: Acceleration)
Operating time (ms), Stroke 150 deg
KE-750/760
LAHD head
LA head
LAIC head
Low speed
150
7500
60 50
28.3
40
50
60
70
80
90
100
110
120
130
140
Medium speed
150
7500
60 50
28.3
40
50
60
70
80
90
100
110
120
130
140
High speed
250
15000
100
20
28.3
34.7
40.7
46.7
52.7
58.7
64.7
70.7
76.7
82.7
88.7
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio
(ratio % to high speed L: Speed, R: Acceleration)
Operating time (ms) Stroke
Stroke
Stroke
Stroke
Stroke
Stroke
Stroke
Stroke
Stroke
Stroke
Stroke
Stroke
30
60
90
120
150
180
210
240
270
300
330
360
deg
deg
deg
deg
deg
deg
deg
deg
deg
deg
deg
deg
KE-750/760
LAHD head
LA head
LAIC head
Encoder:
2000 ppr
Resolution:
0.02 deg/pls
Speed and acceleration for the θ axis to rotate when centering is set for vision
Low speed
500
30000
100 50
28.3
40.7
52.7
64.7
76.6
88.7
100.7
112.7
124.7
136.7
148.7
160.7
Medium speed
500
30000
100 50
28.3
40.7
52.7
64.7
76.6
88.7
100.7
112.7
124.7
136.7
148.7
160.7
High speed
500
60000
100
20.3
32.3
44.3
56.3
68.3
80.3
92.3
104.3
116.3
128.3
140.3
152.3
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio
(ratio % to high speed L: Speed, R: Acceleration)
Operating time (ms) Stroke
Stroke
Stroke
Stroke
Stroke
Stroke
Stroke
Stroke
Stroke
Stroke
Stroke
Stroke
30
60
90
120
150
180
210
240
270
300
330
360
deg
deg
deg
deg
deg
deg
deg
deg
deg
deg
deg
deg
KE-760
LAIC head
Encoder:
18000 ppr
Resolution:
0.005 deg/pls
Speed and acceleration for the Z axis to move down for part mount
Cover open
20
1200
206.6
Low speed
12.6
1260
20
311.5
Medium speed
25.2
2520
40
160.7
High speed
63
6300
100
70.3
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio (ratio % to high speed)
Operating time (ms), Stroke 9.5 mm
KE-750
standard
machine
Cover open
20
1200
286.6
Low speed
18
1800
20
310
Medium speed
40.5
4050
45
143.3
High speed
90
9000
100
70
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio (ratio % to high speed)
Operating time (ms), Stroke 13.5 mm
KE-760
standard
machine
Cover open
30
1500
333.3
Low speed
37.5
3750
25
260.7
Medium speed
90
9000
60
114.4
High speed
150
15000
50
72.6
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio (ratio % to high speed)
Operating time (ms), Stroke 23.5 mm
KE-750
20-mm
application
machine
Cover open
30
1500
333.3
Low speed
37.5
3750
25
260.7
Medium speed
90
9000
60
114.4
High speed
150
15000
50
72.6
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio (ratio % to high speed)
Operating time (ms), Stroke 23.5 mm
KE-760
20-mm
application
machine
Speed and acceleration for the Z axis to move up for part mount
Cover open
20
1200
372.6
Low speed
60
3000
20 10
120.7
Medium speed
120
6000
40 20
79.3
High speed
300
30000
100
33.7
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio
(ratio % to high speed L: Speed, R: Acceleration)
Operating time (ms), Stroke 17.8 mm
KE-750
standard
machine
Cover open
20
1200
482.7
Low speed
60
3000
20 10
175.3
Medium speed
135
6750
45 23
89
High speed
300
30000
100
41.1
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio
(ratio % to high speed L: speed, R: acceleration)
Operating time (ms), Stroke 23.3 mm
KE-760
standard
machine
Cover open
30
1500
10 5
444
Low speed
60
3000
20 10
232
Medium speed
120
6000
40 20
126
High speed
300
30000
100
52.4
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio
(ratio % to high speed L: speed, R: acceleration)
Operating time (ms), Stroke 31.8 mm
KE-750
20-mm
application
machine
Cover open
30
1500
10 5
470.1
Low speed
60
3000
20 10
245.3
Medium speed
135
6750
45 23
120.1
High speed
300
30000
100
55.1
Speed (Kpps)
Acceleration (Kpps
2
)
Speed ratio
(ratio % to high speed L: speed, R: acceleration)
Operating time (ms), Stroke 33.8 mm
KE-760
20-mm
application
machine
- 84 -
3.7 Chip Rise Detection
3.7.1 Outline
After picking the part, chip rise detection is performed immediately after the
laser measurement which is started together with the movement of X/Y axes.
For the chip rise detection, the Z axis is moved to the height obtained from the
thickness of the part being picked, and whether the part is picked is scanned
with the laser. Whether to perform the chip rise detection can be set using the
part data or the setup data. When the chip rise detection is performed, there
may be a delay in the cycle time depending on the distance of the X/Y
movement or the method of pick.
3.7.2 Detection
Chip rise detection is mainly applied to square chip parts and Melf parts.
Scanning for detection is performed by adjusting the laser height using the
value which is the part thickness t entered as the part data multiplied by a
constant 1.25.
Part size
Horizontal
rise
Normal pick Vertical rise Slant rise
Laser height
When part pick is performed normally, Status 64 (No Component) is returned as
data. When a chip rise occurs, the laser is obstructed with the part, and a
status other than 64 is returned. In this case, the part is rejected being
detected as chip rise.
- 85 -