2500_Users_Manual.pdf - 第444页

UniSite Us er Manual Technica l Review iii Figure 5-3. Beam Air Holes .. ................. ................. ................. ................. ... 5-11 Figure 5-4. Power Supplies... ................. ................. …

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ii Technical Review UniSite User Manual
Figure 3-18. Commands Available from the Options Pull-down Menu..3-
28
Figure 3-19. Selecting Security Options.....................................................3-29
Figure 3-20. Password Screen for System Operators...............................3-30
Figure 3-21. Configuring Operating Preferences.....................................3-31
Figure 3-22. Selecting “Add Kit” from the Main Screen.........................3-32
Figure 3-23. Kits are a Series of Tasks in a Single Job..............................3-33
Figure 3-24. Edit Kit Screen.........................................................................3-34
Figure 3-25. Naming the First Task in the Kit..........................................3-34
Figure 3-26. Adding the Second Task to the Kit ......................................3-35
Figure 3-27. Sample Message Presented to System Operator when Kit Is Run
3-36
Figure 3-28. Selecting the Batch File Command.......................................3-38
Figure 4-1. Overview of the Procedure for Starting a Task......................4-3
Figure 4-2. TaskLink Operator Screen.........................................................4-5
Figure 4-3. Enter Your Name on the Security Screen................................4-6
Figure 4-4. TaskLink Main Operator Screen...............................................4-6
Figure 4-5. Configuring Blocks on a Programming Module....................4-8
Figure 4-6. Configuration Box Compartments...........................................4-9
Figure 4-7. Configuration Box Lid—Optional Configurations for 28-pin Module.
4-10
Figure 4-8. Installing a Programming Module.........................................4-12
Figure 4-9. Adjusting the Track Width — Turning the knob clockwise
opens all three track sections together. .....................................................4-13
Figure 4-10. Final Track Adjustment.........................................................4-14
Figure 4-11. Closeup View of Input Track with 8-pin 150-mil Device
Keeper Bar Assembly Installed ..................................................................4-15
Figure 4-12. 8-pin 150-mil SOIC Device Keeper Bar Assembly Mounted in
the Input Track..............................................................................................4-16
Figure 4-13. Chuck Selection Chart............................................................4-16
Figure 4-14. Adjusting High and Low Air Pressure................................4-17
Figure 4-15. Threading New Labels in the Dot Matrix Printer..............4-19
Figure 4-16. Threading Labels in the Thermal Printer............................4-21
Figure 4-17. Installing Devices in the Tube Holder................................. 4-23
Figure 4-18. Main Operator Screen in TaskLink......................................4-23
Figure 4-19. Choosing a Process From Those Presented on the Screen 4-24
Figure 4-20. Checking the Sumcheck.........................................................4-25
Figure 4-21. Setting Pass Limit and Parts Per Tube.................................4-25
Figure 4-22. Aligning Beam to the Device ................................................4-27
Figure 4-23. Aligning Device to the Module ............................................4-28
Figure 4-24. Checking the Front-to-Back Alignment (looking from the
perspective of the input track)....................................................................4-29
Figure 4-25. Device too Close to the Front................................................4-30
Figure 4-26. Device too Close to the Back.................................................4-30
Figure 4-27. DIP Device Alignment...........................................................4-32
Figure 4-28. TaskLink Status Screen During Device Processing...........4-33
Figure 4-29. Task Session Summary Screen..............................................4-34
Figure 4-30. Kits are a Series of Tasks in a Single Job..............................4-35
Figure 4-31. Overview: Running a Kit (the number by each screen refers to
the number of the step describing it on the previous page.................... 4-37
Figure 4-32. Track Air Adjustment Knob..................................................4-38
Figure 5-1. Optic and Microswitch Locations ............................................5-3
Figure 5-2. High and Low Pressure Air Lines..........................................5-10
UniSite User Manual Technical Review iii
Figure 5-3. Beam Air Holes.........................................................................5-11
Figure 5-4. Power Supplies..........................................................................5-14
Figure 5-5. Missing Character Dots in Label Printout.............................5-22
Figure 5-6. Adjusting Label Calibration....................................................5-25
Figure 5-7. Print Shift (affects vertical position).......................................5-26
Figure 5-8. Label Calibration (affects horizontal position).....................5-26
Figure 5-9. Thermal Printer Ribbon Path..................................................5-29
Figure 5-10. Diagnostics Command Tree..................................................5-30
Figure 5-11. Inserting the Hood Interlock Switch....................................5-31
Figure 5-12. Optic and Microswitch Locations ........................................5-33
Figure 5-13. Adjusting the Dot Matrix Printer ADC Optic During Calibration
5-35
Figure 5-14. Thermal Printer, Front View, Showing the ADC Label Optic.
5-37
Figure 5-15. Locations of the Solenoids Under the Main Plate..............5-38
Figure 5-16. Solenoids on the Beam (test numbers shown)....................5-39
Figure 5-17. Location of the Motors...........................................................5-41
Figure 5-18. Recommended Orientation of Pin 1 for DIP and PLCC Devices
5-45
Figure 5-19. Interior View of the 2500’s Base............................................5-47
Figure 5-20. Print Head LEDs on Handler Controller Board.................5-47
Figure 5-21. Position of the 78-pin Connector on the Mass Storage Module
5-52
Figure 5-22. Test Points on the MSM 78-pin Connector .........................5-53
Figure 5-23. Removing the Ribbon Cassette.............................................5-58
Figure 5-24. Installing a New Dot Matrix Printer Ribbon Cassette.......5-58
Figure 5-25. Threading the Ribbon in the Thermal Printer....................5-59
Figure 5-26. Location of the Lead Screw and the Carriage.....................5-63
Figure 5-27. Adjusting the Track Height...................................................5-64
Figure 5-28. Input and Output Track Funnel Adjustment.....................5-65
Figure 5-29. Adjusting the Track Width Cables.......................................5-66
Figure 6-1. Power-up Failures (page numbers are in parentheses).........6-7
Figure 6-2. The Beam Does Not Pick Up the Device Correctly (page
numbers are in parentheses).........................................................................6-8
Figure 6-3. The Beam Does Not Insert the Device Correctly into the
Programming Module (page numbers are in parentheses) .....................6-9
Figure 6-4. Programming Failures (page numbers are in parentheses)6-10
Figure 6-5. Label Printing Problems, Dot Matrix Printer (page numbers are
in parentheses).............................................................................................. 6-11
Figure 6-6. Label Application Problems, Dot Matrix Printer (page numbers
are in parentheses)........................................................................................6-12
Figure 6-6 (continued). Label Application Problems, Dot Matrix Printer
(page numbers are in parentheses)............................................................6-13
Figure 6-7. The Beam Does Not Deliver the Device Correctly (page
numbers are in parentheses).......................................................................6-14
Figure 7-1. Opening the Power Input Assembly to Access the Fuse......7-2
Figure 7-2. Removing the Fuse.....................................................................7-2
Figure 7-3. Location of the Main Plate Screws...........................................7-3
Figure 7-4. Polarity of the Cables on the Programming Electronics Assembly
7-4
Figure 7-5. Remove the Module Clamp Assembly Screws ......................7-5
Figure 7-6. Lower the Clamp Assembly and Remove the Retaining Bar7-6
Figure 7-7. Programming Electronics Assembly Alignment ...................7-6
iv Technical Review UniSite User Manual
Figure 7-8. Input and Output Orbital Assemblies.....................................7-8
Figure 7-9. Note the Wire Colors and Positions.........................................7-9
Figure 7-10. Align the Slit in the Collar with the Slit in the Spindle.....7-10
Figure 7-11. Removing the Print Drive Motor (Dot Matrix Printer shown;
Thermal Printer similar)..............................................................................7-12
Figure 7-12. Removing the Print Head......................................................7-13
Figure 7-13. Remove the Track Springs.....................................................7-15
Figure 7-14. Remove the Track Springs.....................................................7-16
Figure 7-15. Removing the Air Cylinder...................................................7-18
Figure 7-16. Right Lead Screw Bearing Assembly...................................7-22
Figure 7-17. Beam Cable and Switch Locations.......................................7-26
Figure 7-18. Baffle Plate Reinstallation......................................................7-27
Figure 7-19. Removing the DIP Module from the Circuit Board...........7-29
Figure 7-20. Removing the Retaining Block .............................................7-29
Figure 7-21. Removing or installing the Contact Set...............................7-30
Figure 7-22. Removing the Configuration Blocks....................................7-31
Figure 7-23. Removing the Programming Block......................................7-31
Figure 7-24. Removing the Device Ejector Pin and Spring.....................7-32
Figure 7-25. Removing the Contact Set.....................................................7-32
Figure 7-26. Replacing the Defective Pins.................................................7-34
Figure 7-27. Pin Insulation Block in the Programming Module............7-35
Figure 7-28. PLCC Programming Module (Exploded View).................7-37
Figure 7-29. Test Site Clamp Assembly.....................................................7-39
Figure 7-30. Carriage Assembly .................................................................7-41
Figure 7-31. Input Assembly.......................................................................7-43
Figure 7-32. Output Tube Clamp Assembly.............................................7-48
Figure 7-33. Beam Assembly.......................................................................7-50
Figure 7-34. Main Plate Assembly..............................................................7-55
Figure 7-35. Thermal Printer Assembly ....................................................7-59
Figure C-1. ProMaster 2500 Wiring Diagram............................................ C-2
Figure C-2. ProMaster 2500 Handler Controller Board Layout (not to scale)
C-3
Figure D-1. An Example of ASCII Binary Format ....................................D-5
Figure D-2. An Example of TI SDSMAC Format......................................D-7
Figure D-3. An Example of Formatted Binary Format...........................D-10
Figure D-4. An Example of Formatted Binary Format...........................D-11
Figure D-5. An Example of Spectrum Format.........................................D-12
Figure D-6. An Example of ASCII Octal and Hex Formats...................D-19
Figure D-7. An Example of RCA Cosmac Format..................................D-21
Figure D-8. An Example of Fairchild Fairbug.........................................D-22
Figure D-9. An Example of MOS Technology Format...........................D-23
Figure D-10. An Example of Motorola EXORciser Format...................D-24
Figure D-11. An Example of Intel Intellec 8/MDS Format ...................D-25
Figure D-12. An Example of Signetics Absolute Object Format...........D-26
Figure D-13. An Example of Tektronix Hex Format..............................D-27
Figure D-14. An Example of Motorola EXORmacs Format ..................D-28
Figure D-15. An Example of Intel MCS-86 Hex Object..........................D-29
Figure D-16. An Example of HP 64000 Absolute Format......................D-31
Figure D-17. An Example of TI SDSMAC Format..................................D-33
Figure D-18. An Example of JEDEC Full Format....................................D-38
Figure D-19. An Example of JEDEC Kernel Mode Format....................D-46
Figure D-20. An Example of Tektronix Extended Format.....................D-47
Figure D-21. An Example of Motorola S3 Format..................................D-49