M20_Ope_E.pdf - 第162页

Chapter 5 Libraries 5-12  Details of Vision Processing Modes Mode Applicable Compon ents Chip CPL Standard c hip components such as chip resistor, chip capacitor, network resistor, MELF resistor, MELF diode, etc. Electr…

100%1 / 518
Chapter 5 Libraries
5-11
Special shaped components
CPL Process
● CPL Process One pair of opposing edges are straight.
Multi-scan camera 1.25 to 40 mm sq.
Top&Bottom-edge search:
Right&Left-edge search:
Blob Process
● Blob Process One or more blobs (may be a termination) reflect light.
Multi-scan camera 1.25 to 40 mm sq.
One blob
(horizontal)
One blob
(vertical)
Two blobs
(horizontal)
Two blobs
(vertical)
Three blobs (horizontal) Three blobs (vertical)
Four blobs (corners) Four blobs (midpoints)
Chapter 5 Libraries
5-12
Details of Vision Processing Modes
Mode Applicable Components
Chip CPL Standard chip components such as chip resistor, chip
capacitor, network resistor, MELF resistor, MELF diode, etc.
Electrolytic Capacitor Components with two reflective ends, such as electrolytic
capacitor.
Edge-midpoint Search
(for old data/special
component)
Process speed is fastest, but rotation accuracy will be a little
bit lower than CPL.
This was used for standard chip before CPL is added.
Thinking of old data, when image error happened, retry will
be done by CPL process.
To create a new data, use this mode if CPL mode is not
available. Components of 3mm or more in size.
Overall Chip Process
(for old data/special
component)
Practically rectangular components (aspect ratio should be
1:1.5 or more). For heavy loading process of this, process time
will be longer.
To create a new data, use this mode if CPL mode is not
available.
Corner Search
(for special component)
Components with four right angles. Use this mode if CPL
mode is not available, especially for such special component
that can be recognized at corners only.
Edge-midpoint
Search(Non Recovery)
(for old data/special
component)
“Edge-midpoint Search” without Auto-recovery by CPL.
To create a new data, use this mode if CPL mode is not
available. Components of 3mm or more in size.
Glass Melf
Cylindrical-shape-glass-encapsulated components with
two reflective electrodes at the ends.
This is used for components with two reflective electrodes
at the ends.
Transistor Top Transistors with one lead on one side, and two or three leads
on the other side. The transistor is viewed with the one lead
upward on the monitor.
Right The transistor is viewed with the one lead rightward on the
monitor.
Bottom The transistor is viewed with the one lead downward on the
monitor.
Left The transistor is viewed with the one lead leftward on the
monitor.
Pow. Tr. Top Power transistors with one flat lead (large electrode) on one
side, and 2 or 3 leads on the other side. The transistor is
viewed with the one flat lead upward on the monitor.
Right The power transistor is viewed with the one flat lead
rightward on the monitor.
Bottom The power transistor is viewed with the one flat lead
downward on the monitor.
Left The power transistor is viewed with the one flat lead leftward
on the monitor.
Terminat. Four-termination search
(X)
Components with four or more leads. There must be at least
two leads on either side. The numbers of leads are not
checked. It is viewed with the X-directional leads on the
monitor.
Four-termination search
(Y)
Components with four or more leads. There are at least two
leads on either side. The numbers of leads are not checked. It
is viewed with the Y-directional leads on the monitor.
Chapter 5 Libraries
5-13
Mode Applicable Components
Blob One Blob (horizontal) Components whose only the largest blob is processed. The
length is horizontally viewed on the monitor.
One Blob (vertical) The length is vertically viewed on the monitor.
Two Blobs (horizontal) Components whose the largest and the second largest blobs
are processed. The blobs are horizontally viewed on the
monitor.
Two Blobs (vertical) The blobs are vertically viewed on the monitor.
Three Blobs (horizontal) Components with the three largest blobs are processed. Angle
calculation is made using the rightmost blob and leftmost one
of the three on the monitor.
Three Blobs (vertical) Angle calculation is made using the uppermost blob and
lowermost one of the three on the monitor.
Four Blobs (corners) Components with the four largest blobs are processed. Angle
calculation is made using two pairs of diagonally located
blobs of the four on the monitor.
Four Blobs (midpoints) Angle calculation is made using two pairs of vertically and
horizontally located blobs of the four on the monitor.
Blobs (horizontal) Components with all the blobs are processed. Image
processing is made with blobs in horizontal direction.
Blobs (vertical) Image processing is made with blobs in vertical direction.
CPL X Angle calculation is made from upper and lower edges.
Center is determined from the surrounding lines.
Y Angle calculation is made from right and left edges. Center is
determined from the surrounding lines.
top Angle calculation is made from top edge. Center is
determined from the surrounding lines.
right Angle calculation is made from right edge. Center is
determined from the surrounding lines.
bottom Angle calculation is made from bottom edge. Center is
determined from the surrounding lines.
left Angle calculation is made left edge. Center is determined
from the surrounding lines.
SOP X SOP components with X-directional leads and four or more
leads on either side. The number of leads is checked.
Y SOP components with Y-directional leads and four or more
leads on either side. The number of leads is checked.
SOJ X SOJ components with X-directional leads and four or more
leads on either side. The number of leads is checked.
Y SOJ components with Y-directional leads and four or more
leads on either side. The number of leads is checked.
PLCC PLCC
LCC LCC
QFP QFP
BGA Matrix BGA components with matrix balls. Multi-view process is
possible.
Staggered BGA components with staggered balls. Multi-view process is
possible.
Perimeter-matrix BGA components with perimeter-matrix balls. Multi-view
process is possible.
Perimeter-staggered BGA components with perimeter-staggered balls. Multi-view
process is possible.