印刷机通用说明书(中英文版） 450+.pdf - 第10页
- 10 programmed to control the dry , wet or vacuum cleaning. The cleaning t ime interval can b e free to ch oose. It can clean all the solder past e inside the board holes and insure the printing quali ty . 组 合 式 万 用 工…
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第一章 系统描述
Chapter 1 System description
1.1
功能特性 Function
先进的上视
/
下视视觉系统，独立控制与调节的照明，高速移动的镜头，精确地进行
PCB
与模板的对准，确保印刷精度为±
0.02mm
。
Advanced up/down visual system, independent controllable and adjusted lighting,
high speed mobile camera lens, precisely alignment for the PCB and template
and make sure that the printing accuracy is ±0.02mm.
高精度伺服马达驱动及 PC 控制，确保印刷之稳定性和精密度，无限制的图像模式
识别技术具有±0.01mm 重复定位精度。
High accurate servo motor and PC control which can insure the stability and
precision of the printing. Unlimited image pattern recognition technology has the
repeated positioning accuracy for ±0.01mm.
直线马达闭环印刷头
，具有特殊设计的高刚性结构，刮刀压力、速度、行程均由电脑智能
控制，维持印刷质量的均匀稳定；刮刀横梁经过特殊优化结构设计，轻巧且外形美
观。
The linear motor closed-loop printing head has a specially designed high rigidity
structure. The pressure, speed and stroke of the scraper are intelligently
controlled by the computer Control, maintain the printing quality of uniform and
stable; scraper beam through special optimization structure design, light and
beautiful appearance
可选择人工/自动网板底面清洁功能。自动、无辅助的网板底面清洁功能，可编程控
制干式、湿式或真空清洗，清洗间隔时间可自由选择，能彻底清除网孔中的残留锡
膏，保证印刷品质。
The bottom of the board can be cleaned by manual or automatically. The clean
function for the bottom of board is automatic and without assists. It can be
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programmed to control the dry, wet or vacuum cleaning. The cleaning time
interval can be free to choose. It can clean all the solder paste inside the board
holes and insure the printing quality.
组合式万用工作台，可依 PCB 基板大小设定安置顶针和真空吸腔(选配)，使装夹更
加快速、便捷。
There is composite worktable which can set a thimble and vacuum chamber
(optional) according to the size of PCB baseboard. It makes the fixture
assembling more fast and easy.
多功能的板处理装置，可自动定位夹持各种尺寸和厚度的
PCB
板，带有可移动的
磁性顶针和真空平台及真空腔，有效地克服板的变形，确保印刷均匀。
There is a multifunctional device to deal with boards. The device can
automatically positioning and pick up various size and thickness PCB boards. It
has mobile magnetic thimble, vacuum platform and vacuum chamber, which can
avoid board deformation effectively and insure the even of printing.
具有
“
Windows 7
视窗
”
操作界面和丰富的软件功能，具有良好的人机对话环境，
操作简单、方便、易学、易用。
Windows 7 operation interface and abundant software functions. Good man-
machine dialogue environment, simple operation. It is easy to learn and operate.
具有对故障自诊断声、光报警和提示故障原因功能。
Sound and light alarm function. It can indicate the reason of the fault.
无论单
/
双面
PCB
基板均可作业。
Can deal with the PCB base board no matter it is single side or double side.
可完美印刷
0.3mm
间距的焊盘。
It can print 0.3mm spacing bonding pad perfectly.
2D
检测功能及
SPC
系统（标配）。
2D inspection and SPC system (standard).
选项：以下功能如用户需要选用，请与和田古德自动化设备有限公司联系，只要在基本配置的价
格上增加下面选项的价格，即可满足您的要求。
Option: The following functions can be selected after you connect with our company.
The extra fee need be charged on the base of the basis configuration expense.
闭环式印刷头
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Closed-hoop printing head
橡胶刮刀
Rubber scraper
真空腔
Vacuum chamber
真空平台（印刷
0.4—0.6mm
厚薄板时选用）
Vacuum table (It can be used to print the 0.4—0.6mm boards )
三段式轨道
Three-stage rail
1.2
技术参数 Parameters
注：技术参数认具体机型为准
notes
：
The technical parameters are subject to the specific model
PCB参数 PCB parameter
最大板尺寸 (X x Y) Maximum board size（X x Y）
450mm x 350mm
最小板尺寸 (Y x X) Minimum board size（X x Y）
50mm x 50mm
PCB厚度 PCB thickness
0.4mm~6mm
翘曲量 Warpage
≤对角线1% ≤1%Diagonal
最大板重量 Maximum board weight
3Kg
板边缘间隙 Board margin gap
构形至 3 mm Configuration to 3mm
最大底部间隙 Maximum bottom gap
20mm
传送速度 Transfer speed
1500mm/s(Max)
距地面的传送高度 Transfer height from the ground
900±40mm
传送轨道方向 Transfer orbit direction
左 – 右、右 – 左、左 – 左、右 – 右 L-R,R-L,L-L,R-R
传输方式 Transfer mode
一段式轨道 One stage orbit
PCB夹持方法 PCB damping method
手动调节板厚
manual adjustment plate thickn
ess
自动调节板厚
Automatic adjustment of plate thickness
软件可调弹性侧压（选项：一、底部多点局部真空；二、底部整体吸腔式真空；
三、边缘锁定基板夹紧）
Software adjustable elastic side pressure (options: 1. Bottom multi-
point local vacuum; 2. Bottom integral cavity vacuum; 3. Edge locking
substrate clamping)
板支撑方法 Support method
磁性顶针+等高块（选项一、真空腔体；选项二、专用的工件夹具）
技术参数 Technical parameters