印刷机通用说明书(中英文版） 450+.pdf - 第109页
- 109 - 11 点击生产设置，打开生产设置界面，把 2D 检测选项选上，并点击确定保存设置。 Click “ 生产设置 ”(pr oduction settin g) button and enter into the int erface of produc tion setting. Select “2D 检测 ” (2D inspection) and Click “ 确定 ”(ok) button to s ave the…
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8
输入要检测的
PCB
上锡膏可以合格通过的覆盖率，本机器设定焊膏覆盖焊盘的面积在
60%以上即满足质量要求(即合格分析锡膏/焊盘：0.6)。
Input the cover rate which can pass the inspection for the solder paste printed on the PCB. If
there are above 60% solder paste printed on the bonding pad, then it can meet the printing
quality requirement. (The qualified rate: solder paste/bonding pad: 0.6)
9 如图 6-7，点击确定，完成 2D 检测点的建立、增加的动作及参数设置。
Click “确定”（ok）button, then finish the build of 2D inspection spot, movement add and
parameter setting. See pix 6-7.
10
点击确定，保存已更改的数据。如图
6-8
Click “确定”（ok）button to save the changed data. See pix 6-8.Pix 6-8(click
“确定” （ok）button after setting the 2D inspection)
图
6-8
（
2D
检测设置完确定
- 109
-
11
点击生产设置，打开生产设置界面，把
2D
检测选项选上，并点击确定保存设置。
Click “生产设置”(production setting) button and enter into the interface of production setting.
Select “2D检测” (2D inspection) and Click “确定”(ok) button to save the setting.
图
6-9
（生产设置界面）
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Pix 6-9(production setting interface)
12 点击开始按钮 进入生产状态。印刷完成后，显示检测界面。
Click “ ” (start) button to start production. The inspection interface will
display after the printing has been finished
图 6-10（检测界面）Pix 6-10(inspection interface)