印刷机通用说明书(中英文版） 450+.pdf - 第11页

- 11 Closed-hoop printing head  橡胶刮刀 Rubber scrape r  真空腔 Vacuum cha mber  真空平台 （印 刷 0.4 — 0.6 mm 厚薄板时 选用） Vacuum ta ble (It can be used to p rint t he 0 .4 — 0.6mm boards )  三段式轨道 Three-stage rail 1.2 技 术参 数 Paramet…

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programmed to control the dry, wet or vacuum cleaning. The cleaning time
interval can be free to choose. It can clean all the solder paste inside the board
holes and insure the printing quality.
组合式万用工作台，可依 PCB 基板大小设定安置顶针和真空吸腔(选配)，使装夹更
加快速、便捷。
There is composite worktable which can set a thimble and vacuum chamber
(optional) according to the size of PCB baseboard. It makes the fixture
assembling more fast and easy.
多功能的板处理装置，可自动定位夹持各种尺寸和厚度的
PCB
板，带有可移动的
磁性顶针和真空平台及真空腔，有效地克服板的变形，确保印刷均匀。
There is a multifunctional device to deal with boards. The device can
automatically positioning and pick up various size and thickness PCB boards. It
has mobile magnetic thimble, vacuum platform and vacuum chamber, which can
avoid board deformation effectively and insure the even of printing.
具有
“
Windows 7
视窗
”
操作界面和丰富的软件功能，具有良好的人机对话环境，
操作简单、方便、易学、易用。
Windows 7 operation interface and abundant software functions. Good man-
machine dialogue environment, simple operation. It is easy to learn and operate.
具有对故障自诊断声、光报警和提示故障原因功能。
Sound and light alarm function. It can indicate the reason of the fault.
无论单
/
双面
PCB
基板均可作业。
Can deal with the PCB base board no matter it is single side or double side.
可完美印刷
0.3mm
间距的焊盘。
It can print 0.3mm spacing bonding pad perfectly.
2D
检测功能及
SPC
系统（标配）。
2D inspection and SPC system (standard).
选项：以下功能如用户需要选用，请与和田古德自动化设备有限公司联系，只要在基本配置的价
格上增加下面选项的价格，即可满足您的要求。
Option: The following functions can be selected after you connect with our company.
The extra fee need be charged on the base of the basis configuration expense.
闭环式印刷头
- 11
Closed-hoop printing head
橡胶刮刀
Rubber scraper
真空腔
Vacuum chamber
真空平台（印刷
0.4—0.6mm
厚薄板时选用）
Vacuum table (It can be used to print the 0.4—0.6mm boards )
三段式轨道
Three-stage rail
1.2
技术参数 Parameters
注：技术参数认具体机型为准
notes
：
The technical parameters are subject to the specific model
PCB参数 PCB parameter
最大板尺寸 (X x Y) Maximum board size（X x Y）
450mm x 350mm
最小板尺寸 (Y x X) Minimum board size（X x Y）
50mm x 50mm
PCB厚度 PCB thickness
0.4mm~6mm
翘曲量 Warpage
≤对角线1% ≤1%Diagonal
最大板重量 Maximum board weight
3Kg
板边缘间隙 Board margin gap
构形至 3 mm Configuration to 3mm
最大底部间隙 Maximum bottom gap
20mm
传送速度 Transfer speed
1500mm/s(Max)
距地面的传送高度 Transfer height from the ground
900±40mm
传送轨道方向 Transfer orbit direction
左 – 右、右 – 左、左 – 左、右 – 右 L-R,R-L,L-L,R-R
传输方式 Transfer mode
一段式轨道 One stage orbit
PCB夹持方法 PCB damping method
手动调节板厚
manual adjustment plate thickn
ess
软件可调弹性侧压（选项：一、底部多点局部真空；二、底部整体吸腔式真空；
三、边缘锁定基板夹紧）
Software adjustable elastic side pressure (options: 1. Bottom multi-
point local vacuum; 2. Bottom integral cavity vacuum; 3. Edge locking
substrate clamping)
板支撑方法 Support method
磁性顶针+等高块（选项一、真空腔体；选项二、专用的工件夹具）
技术参数 Technical parameters
- 12
Magnetic thimble + Equal high block(Optional:1.vacuum
suction cavity;2.special workpiecefixture)
印刷参数 Printing parameters
印刷头
Printing head
悬浮式智能印刷头 Floating intelligent printing head
模板框架尺寸 Template frame size
470mm x 370mm~737 mm x 737 mm
最大印刷区域(X x Y) Maximum printing area
（X x Y）
450mm x 350mm
刮刀类型 Scraper type
钢刮刀/胶刮刀(角度45°/55°/60°按印刷工艺匹配选择)
Steel scraper/Glue scraper（Angel 45°/50°/60° matching
the printing process）
刮刀长度 Scraper length
220mm~500mm
(optional with length of 220mm-500mm)
刮刀高度 Scraper height
65±1mm
刮刀片厚度 Scraper thickness
0.25mm Diamond-like carbon涂层
0.25mm Diamond-like carbon coating
印刷模式 Printing mode
单或双刮刀印刷 Single or double scraper printing
脱模长度 Demoulding length
0.02 mm - 12 mm
印刷速度 Printing speed
0 ~ 200 mm/s
印刷压力 Printing pressure
0.5kg - 10Kg
印刷行程 Printing stroke
±200 mm（从中心） (From the center)
清洗参数 Cleaning parameters
清洗方式 Cleaning mode
1、滴淋式清洗系统；2、干、湿、真空三种模式
1. Drip cleaning system; 2. Dry, wet and vacuum modes
清洗擦拭板长度 Length of cleaning and wiping plate
380mm/500mm（可选配300mm，450mm）
(optional with 300mm, 450mm)
影像参数 Image parameters
影像视域 (FOV) Field of view
8mm x 6mm
平台调整范围 Platform adjustment range
X:±5.0mm,Y:±7.0mm,θ:±2.0°
基准点类型 Benchmark point type
标准形状基准点 (见SMEMA 标准)，焊盘 /开孔
Standard shape benchmark point（SMEMA standard），
solder pad/openings