印刷机通用说明书(中英文版） 450+.pdf - 第3页
- 3 目 录 Content 第一章 系统描述 页码 Chapter 1 System description Page 1.1 功能特性 ······· ···· ······ ······ ··· 9 Function 1.2 技术参数 ····· ··· ······ ······ ······ 11 Parameters 1.3 外形尺寸 ····· ··· ······ ······ ······ 15 Overall di…
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目 录
Content
第一章 系统描述 页码
Chapter 1 System description Page
1.1 功能特性·························· 9
Function
1.2 技术参数·························· 11
Parameters
1.3 外形尺寸·························· 15
Overall dimension
1.4 系统主要组成部分······················ 15
System main sections
1.5 工作原理·························· 19
Working principles
第二章 设备吊装、安装与调试····················20
Chapter 2 Equipment installation and debugging
2.1 吊装安全作业························ 20
Safe lifting operation
2.2 开箱···························· 28
Open the equipment
2.3 操作环境·························· 29
Operating environment
2.4 设备安置及高度调整····················· 30
Equipment location and height adjustment
2.5 电源气源·························· 30
Power and air power
2.6 工控机控制系统安装····················· 31
Installation of the industrial computer control system
2.7软件安装·························· 32
Software installation
第三章 生产工作流程······················· 34
Chapter 3 Production working flow
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3.1 开机前检查························· 34
Check before turning on the equipment
3.2 开始生产前准备······················· 35
Preparation before production
3.3试生产····························59
Trial production
3.4生产流程图··························63
Production flow
第四章 操作系统说明······················· 65
Chapter 4 Introduction of the operation system
4.1 系统启动·························· 65
System start-up
4.2 主窗口组成························· 65
Main window components
第五章报警处置·························· 91
Chapter 5 Alarm disposal
5.1 机器报警项目·························91
Equipment alarm items
5.2 机器报警项目解释以及处置方法·················91
Explanation of equipment alarm items and the solutions
第六章2D锡膏检测操作说明·····················101
Chapter 6 Operating introduction of 2D solder paste test
第七章新增部分功能介绍说明···················· 111
Chapter 7 Introduction of the new functions
7.1 名词解释···························111
Noun explanation
7.2 软件操作步骤·························114
Software operation steps
第八章选配项介绍说明························120
Chapter 8 introduction of optional items
8.1 压力检测···························120
Pressure detection
8.2锡膏余量检测························· 124
Solder paste margin detection
8.3自动加锡功能························· 129