印刷机通用说明书(中英文版） 450+.pdf - 第57页

- 57 - 9 ， 在 图 3-15 中 调 节 Led1 、 LED2 的 亮 度 ， 使 Mark 和周围 背景颜色 区 分开 ，一直 调到 Mark 点轮廓 清晰， 黑白 分 明方可 。然后 点击 [ 自 动查 找 ] 按 钮， 系统 会 自动 捕 捉到 Mark 点，点 击 [ 确 定 ] 完 成 Mark 点的 抓 捕， 回 到图 3-13 界面。 Adjust th e brightness of Led1 and LED…

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图 3-16 钢网 Mark 点的匹配，匹配完成后点击[确定]
Pix 3-16 the matching of stencil mark point. Click “确定”（ok）button after the matching
is finished.
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-
9
，在图
3-15
中调节
Led1
、
LED2
的亮度，使
Mark
和周围背景颜色区分开，一直调到
Mark
点轮廓清晰，黑白分明方可。然后点击[自动查找]按钮，系统会自动捕捉到 Mark 点，点击[确
定]完成 Mark 点的抓捕，回到图 3-13 界面。
Adjust the brightness of Led1 and LED2 in the interface of Pix 3-15. Distinguish the mark
point from the background color until the outline of mark point is clear, black and white.
Click “ 自动查找”(automatic searching )button, the system will automatically capture mark
point. Click “
确定
”
（
ok
）
button to finish the image capture and return to the interface in the Pix 3-13.
10
．钢网和
PCB
的
Mark
点匹配完成后在图
3-13
界面上点击
[
确认
]
按钮进入图
3-14
界面，
再点击[ 是 ]按钮回到主界面，至此，完成 Mark 点的匹配。
Click “
确定
”
（
ok
）
button after the matching of stencil mark point and PCB mark point is
finished and it will enter into the interface in pix 3-14. Click “是”（yes）button to return to main
interface. Then the mark point matching is finished.
3.2.4 刮刀压力和速度的选择 Selection of the pressure and speed of the scraper
刮刀的压力及刮刀速度是钢网印刷中两个重要的工艺参数。
The two parameters of the pressure and speed of the scraper in the stencil
printing are very important.
刮刀速度：选取的原则是刮刀的速度和锡膏的粘稠度及
PCB
板上
SMD
的最小引脚间距
有关，选择锡膏的粘稠度大，则刮刀的速度要低，反之亦然。对刮刀速度的选择，一般先从
较小压力开始试印，慢慢加大，直到印出好的焊膏为止。速度范围为
15
～
50mm/s
。在印刷
细间距时应适当降低刮刀速度，一般为 15～30mm/s，以增加锡膏在窗口处的停滞时间，从
而增加
PCB
焊盘上的锡膏；印刷宽间距元件时速度一般为
30
～
50mm/s
。（＞
0.5mm pitch
为宽间距，＜
0.5mm pitch
为细间距〕
Scraper speed: The selection of scraper speed is related to the solder paste viscosity
and the min pin space of the SMD on PCB board. The viscosity of solder paste is higher,
the speed of scraper is lower and vise versa. For the selection of scraper speed, do the trial
printing with small pressure in general. And add the pressure slowly until print the good
solder paste. The speed range is 15～50mm/s. Lower the scraper speed in order to add the
delay time in entrance for solder paste so that to add the solder paste on the bonding pad of
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-
PCB when print the narrow space and the speed is 15～30mm/s in general. The printing
speed for the large space component is 30～50mm/s. (＞0.5mm pitch is large space，＜
0.5mm pitch is narrow space
）
本机器刮刀速度允许设置范围为 0～200mm/s。
The allowed scope of scraper speed is 0～200mm/s.
刮刀压力：压力直接影响印刷效果，压力以保证印出的焊膏边清晰，表面平整厚度适宜为准。压
力太小，锡膏量不足，产生虚焊；压力太大，导致锡膏连 接，会产生桥接。因此刮刀压力一般是设定为
0.5
～
10kg
。
Scrape pressure: The pressure has direct influence on the printing performance. The
suitable pressure is the one that can insure the clear edge, even surface and good
thickness of the printing solder paste. Too little pressure and insufficient solder paste will
lead to empty solder. Too much pressure will bring about solder paste connection and
bridging. So the scrape pressure is set from 0.5kg to 10kg.
3.2.5
脱模速度和脱模长度
Speed and length of demoulding
脱模速度：指印刷后的基板脱离模板的速度，在焊膏与模板完全脱离之前，分离速度要
慢，待完全脱离后，基板可以快速下降。慢速分离有利于焊膏形成清晰边缘，对细间距的印刷尤其重要。一般
设定为3mm/s，太快易破坏锡膏形状。
本机器允许设置范围为 0～20mm/s。
Demoulding speed: It is the speed after the printed base board separates from the
template. Before the solder paste separates from the template completely, the separation
speed need be slow. After completed separation, the base board can decline fast. Slow
separation speed is good for the clear edge formation of solder paste. It is very crucial for
the narrow space printing. Generally, the speed is set at 3mm/s. If the speed is too fast, the
shape of solder paste will be damaged.
The allowed scope of demouding speed is 0～20mm/s.
PCB 与模板的分离时间：即印刷后的基板以脱板速度离开模板所需要的时间。时间过长，
易在模板底面残留焊膏，时间过短，不利于焊膏的站立。一般控制在
1
秒左右。
Separation time for the PCB and template: It is the time for the printed base board
separates from template with stripper plate speed. Too much time, it is easy to remain the
solder paste on the bottom side of template. Too little time, it is not good for the standing of
solder paste. The speed is controlled at about 1 second in general.