印刷机通用说明书(中英文版） 450+.pdf - 第35页
- 34 - 第三章 生产工作流 程 Chapter 3 Productio n flow 3.1 开机前 检查 Check before turning on the equipment 检查所输 入电源 的电压、 气源的 气压是否 符合要 求； Checking all the inpu t voltage of the power a nd p ressure of the air power m eets the requi…
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第三章 生产工作流程
Chapter 3 Production flow
3.1
开机前检查 Check before turning on the equipment
检查所输入电源的电压、气源的气压是否符合要求；
Checking all the input voltage of the power and pressure of the air power meets
the requirements.
检查机器各接线是否连接好；
Check whether all lines are connected.
检查设备是否良好接地；
Check whether the equipment is grounded.
检查气动系统是否漏气，空气输入口过滤装置有无积水，是否正常工作。
Check whether pneumatic system leaks and whether there is water in the air input
port filter and normally work.
检查机器各传送皮带松紧是否适宜；
Check whether the transmission belt is loose.
检查是否有无关的碎物留在电控箱内，电控箱内各接线插座是否插接良好；
Check whether there is residue inside the electric control case and whether all the
sockets are connected.
检查有无工具等物遗留在机器内部；
Check whether there is any tool lost inside the equipment.
根据所要印刷的 PCB 板要求，准备好相应的网板和锡膏；
Prepare the stencil and solder paste according to the requirements of the PCB
board printing.
检查磁性顶针是否按所要生产的 PCB 尺寸大小摆放到工作台板上;
Check whether the magnetic thimble is put on the worktable according to size of
PCB board.
检查清洗用卷纸有无装好，检查酒精箱的液位（液面应超出液位感应器）；
Check whether the rolled paper is installed and the liquid level inside the alcohol
tank (Liquid level should be beyond the liquid level sensor).
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3.2.2 锡膏准备 Solder paste preparation
1)
在
SMT
中，焊膏的选择是影响产品质量的关键因素之一。不同的焊膏决定了允许印刷的
最高速度，焊膏的粘度、润湿性和金属粉粒大小等性能参数都会影响最后的印刷品质。
The quality of the solder paste is one of the critical factors which will affect the
quality of the production in SMT industry. The difference of the solder paste can
determine the highest speed of printing. The viscosity and wettability of the solder
paste and the size of the metal particle etc. also will affect the quality of the
production.
2) 对焊膏的选择应根据清洗方式、元器件及电路板的可焊性、焊盘的镀层、元器件引脚
间距、用户的需求等综合起来考虑。
Selecting the solder paste need consider the cleaning method, weldability of the
component and circuit board, bonding pad coating, the space of the component pin
and operator need.
3) 锡膏选定后，应根据所选锡膏的使用说明书要求使用。
Use the solder paste according to the help manual of the selected solder paste.
4)
在使用之前必须搅拌均匀，直至锡膏成浓浓的糊状并用刮刀挑起能够很自然的分段落
下即可使用。
Mix the solder paste fully until it is very thick and can drop segmentedly and naturally
when it is stirred up.
5) 锡膏从冰柜中取出不能直接使用，必须在室温 25℃左右回温（具体使用根据说明书而
定）；锡膏温度应保持与室温相同才可开瓶使用
Operator can not use the solder paste directly when it is taken out from the freezer. It
can be used after the warming up in the room temperature which is about 25℃.(see
the help manual of the solder paste ). The solder paste container can be open when
the temperature of solder paste and room temperature is the same.
6) 使用时应将锡膏均匀地刮涂在刮刀前面的模板上，且超出模板开口位置，保证刮刀运
动时能将锡膏通过网板开口印到 PCB 板的所有焊盘上。
Spread the solder paste evenly on the template which is assembled before the
scraper. The solder paste need be spread beyond the open position of the template
to insure that scraper can print the solder paste on all of the bonding pads of the
PCB boards through the stencil open position.