印刷机通用说明书(中英文版） 450+.pdf - 第17页

- 17 Function: B ase board edge holding system f ix th e base b oard and lift it to a higher level to get t he best holding fo rce. E dge holding system uses the soft ware t o control and adjust the pressure to match th …

- 17

Function: Base board edge holding system fix the base board and lift it to a higher level to

get the best holding force. Edge holding system uses the software to control and

adjust the pressure to match thickness of the programmed base board. This solution

can help the top holding system to hold the base board firmly. It can support the best

connection between the template and base board and insure the Effective

precipitation of the solder paste and improve the printing quality.

1.4.3

图像捕捉系统

Image capture system

组成：包括 CCD 运动部分和 CCD—Camera 装置（摄像头、光源）及高分辨率显示器等，

由视觉系统软件进行控制。

Component: It includes the CCD movement, CCD-Camera device (camera, light source)

and high resolution screen etc.. Control by the visual system software.

功能：上视/下视视觉系统，独立控制与调节的照明，高速移动的镜头确保快速、精确地进行

PCB 和钢网板对准，无限制的图像模式识别技术具有 0.01mm 的辩识精度。

Function: Up/down visual system, independent controllable and adjustable lighting, high

speed mobile lens which can insure the make the PCB and stencil aligned fast and

accurate. Unlimited image pattern recognition technology reaches 0.01mm recognition

accuracy.

1.4.4

钢网自动定位及其清洁系统

Stencil automatically positioning

and the cleaning system

1.4.4.1 钢网自动定位系统 Stencil automatically positioning

组成：包括网板移动装置及网板固定装置等。

Component: It includes stencil mobile device and stencil fixed device etc..

功能：只需输入钢网 MARK 点位置就可以自动定位,更方便用户不同大小钢网的灵活更换.

适用的钢网夹持装置,可支持钢网最小为 370x470mm （ 470 左右方向放置), 最大为 737× 737mm, 厚度

20~40mm.

Function: Inputting the stencil mark location can positioning automatically and it is

convenient for operator to replace different sizes of stencil. The stencil holding device can

hold the Min. stencil whose size is 370x470mm (470 left and right direction placed) and

Max. stencil whose size is 737×737mm and thickness is 20~40mm

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1.4.4.2

钢网清洗系统

擦拭组件

Stencil cleaning system-wipe component

组成：包括真空管、文丘里管、鼓风机、清洗液储存和喷洒装置、卷纸装置、升降气缸等。

网板清洗装置被安装在视觉系统后面，通过视觉系统拖动清洗系统移动，自动清洗网板底面。

进行清洗时清洗卷纸上升并且贴着模板底面移动，用过的清洗纸被不断地绕到另一滚筒上。清

洗间隔时间可自由选择，清洗行程可根据印刷行程自行设定。进行湿洗时，当储存罐中清洗液

不够时，系统出现报警显示，此时应将其充满清洗液。干、湿、真空洗周期可自由调节。

Component: It includes vacuum tube, venturi tube, blower, liquid restore and spraying

device, paper roller, lifting cylinder etc.. Stencil cleaning device is assembled behind the

visual system. Cleaning system will remove by the dragging from visual system. The

bottom of the stencil will be cleaned automatically.

The cleaning roller paper lift up and remove on the bottom of the template when do the

cleaning. The used cleaning paper will roll to another roller continually. The cleaning

interval can be selected freely. The cleaning movement can be set on the base of the

printing movement. Doing the wet cleaning, the system will alarm if there is not enough

cleaning liquid in the restore container. Then operator need full the container with cleaning

liquid. The cycle of the dry/wet/vacuum cleaning can be adjustedfreely.

功能：

自动有效的分离式清洗结构，大功率风机加文丘里真空发生装置抽真空，喷射系统加可编程

的喷洒清洗液，干﹑湿﹑真空三种清洗方式,并可任意选择自由组合，用户可根据实际需求设

定清洗周期﹑时间及速度等参数，长短擦拭纸通用

拆卸方便

节约资源；加强型的真空栅

充

分利用风机效率, 彻底清除网板孔中的残留锡膏，保证印刷品质。

Function: Automatic, effective and separating cleaning structure. High power fan and

venture vacuum device do the vacuum pump. Spraying system, programmed spraying

cleaning liquid and three cleaning methods (dry/wet/vacuum). These can be selected and

combined freely. Operator can set the cleaning cycle, time, speed etc according to the

actual need. General paper is easy to assemble and disassemble and it can save resource.

Enhanced vacuum gate and good fan can removed the remaining solder paste in the hole

on the stencil. It can insure the printing quality.