印刷机通用说明书(中英文版） 450+.pdf - 第59页

- 59 - 本机器用脱模长度来控制此变量，一般设定为 0 .5 ～ 2mm 。本机器允许设置范围为 0 ～ 10mm 。 The p rinter con trol this variate by th e de moulding length which is set at 0.5 ～ 2mm. The allowed scope for this printer is 0 ～ 10mm. 3.3 试生产 Tri al produ…

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PCB when print the narrow space and the speed is 15～30mm/s in general. The printing

speed for the large space component is 30～50mm/s. (＞0.5mm pitch is large space，＜

0.5mm pitch is narrow space

）

本机器刮刀速度允许设置范围为 0～200mm/s。

The allowed scope of scraper speed is 0～200mm/s.

刮刀压力：压力直接影响印刷效果，压力以保证印出的焊膏边清晰，表面平整厚度适宜为准。压

力太小，锡膏量不足，产生虚焊；压力太大，导致锡膏连接，会产生桥接。因此刮刀压力一般是设定为

0.5

～

10kg

。

Scrape pressure: The pressure has direct influence on the printing performance. The

suitable pressure is the one that can insure the clear edge, even surface and good

thickness of the printing solder paste. Too little pressure and insufficient solder paste will

lead to empty solder. Too much pressure will bring about solder paste connection and

bridging. So the scrape pressure is set from 0.5kg to 10kg.

3.2.5

脱模速度和脱模长度

Speed and length of demoulding

脱模速度：指印刷后的基板脱离模板的速度，在焊膏与模板完全脱离之前，分离速度要

慢，待完全脱离后，基板可以快速下降。慢速分离有利于焊膏形成清晰边缘，对细间距的印刷尤其重要。一般

设定为3mm/s，太快易破坏锡膏形状。

本机器允许设置范围为 0～20mm/s。

Demoulding speed: It is the speed after the printed base board separates from the

template. Before the solder paste separates from the template completely, the separation

speed need be slow. After completed separation, the base board can decline fast. Slow

separation speed is good for the clear edge formation of solder paste. It is very crucial for

the narrow space printing. Generally, the speed is set at 3mm/s. If the speed is too fast, the

shape of solder paste will be damaged.

The allowed scope of demouding speed is 0～20mm/s.

PCB 与模板的分离时间：即印刷后的基板以脱板速度离开模板所需要的时间。时间过长，

易在模板底面残留焊膏，时间过短，不利于焊膏的站立。一般控制在

秒左右。

Separation time for the PCB and template: It is the time for the printed base board

separates from template with stripper plate speed. Too much time, it is easy to remain the

solder paste on the bottom side of template. Too little time, it is not good for the standing of

solder paste. The speed is controlled at about 1 second in general.

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本机器用脱模长度来控制此变量，一般设定为 0.5～2mm。本机器允许设置范围为 0～

10mm。

The printer control this variate by the demoulding length which is set at 0.5

～

2mm. The

allowed scope for this printer is 0～10mm.

3.3 试生产 Trial production

在以上准备工作做完以后，即可进行 PCB 板的试印刷。操作方法是：

Can do the trial printing of the PCB board after above preparations are finished. The

operation methods are as following:

单击主工具栏中的

[ ]

按钮，出现图

3-18

界面，在该界面上勾选显示调节窗口，

然后点击[确定]按钮回到软件主界面。

Click the “ ”(production setting) button in the mail tool bar. The interface in the

Pix 3-18 will be displayed. Select “显示调节窗口” (display adjustment window) and

click “确定”（ok）button to come back to the main interface of the software.

2. 在软件主界面上点击[ ]按钮，接下来按软件提示操作进入生产模式，机器在完成

PCB 运输，定位，取像，Z 轴上升到印刷位置后，出现图 3-18 画面。

Click “ ” (start) button in the main interface of the software. According to the

software instructions, it will enter production mode. The interface in the pix 3-18 will

be displayed after the finish of the PCB transmission, positioning and image capture

and the Z axis lift up to the printing location.

3. 在 3-18 界面下，检查 PCB 是否和钢网紧贴，要求是 PCB 刚好挨着钢网，否则需调节

Z 轴高度，直到满足要求。检查 PCB 焊盘是否和钢网网孔重合，如不重合，则需要调

整平台

、

，直到重合为止。

Check whether the PCB is against stencil in the interface of pix 3-18. The PCB need

be against stencil. Otherwise operator need adjust the height of Z axis until the PCB

is against stencil. Check whether PCB bonding pad and stencil hole is overlapped. If

not, please adjust the X,Y1,Y2 of platform until PCB bonding pad and stencil hole is

overlapped.

在图 3-18 界面下安装刮刀，注意：刮刀片安装前应检查其刀口是否平直，有无缺损。

Assemble the scraper in the interface of pix 3-13. Please check whether the blade

is even, straight and damaged before assembling the scraper blade.

4. 以上工作完成后点击[确定]按钮，完成第一块 PCB 的印刷。

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Click “

确定

”

（

）

button after above preparation are finished. Then the printing of the

first PCB are finished.

5. 如印刷结果不符合质量要求，应重新进行参数设置或在主界面上点击[ ]按钮进入

图 3-19 界面输入平台及印刷误差补偿值，直到印刷结果满足质量要求，方可正式开始

生产。

If the printing performance can not meet the quality requirement, operator need reset

the parameter or click “ ” (production setting) button to enter the interface of pix

3-19. Input the error compensation value of platform and printing in that interface

until printing performance can not meet the quality requirement and then can start

the production officially.

6. 锡膏印刷质量要求：

The quality requirement of solder paste printing.

本机器设定锡膏厚度在 0.1—0.3mm 之间、焊膏覆盖焊盘的面积在 75%以上即满足质

量要求。

The thickness of solder paste for this printer need be 0.1—0.3mm.There are

above 75% solder paste printed on the bonding pad.