印刷机通用说明书(中英文版） 450+.pdf - 第58页

- 58 - PCB when print the narrow sp ace and the sp eed is 15 ～ 30mm/s in general. The printing speed for the large space co mponent is 30 ～ 50mm/s. ( ＞ 0.5mm pitch is large space ，＜ 0.5mm pit ch is narrow space ）本机器刮刀速…

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，在图

3-15

中调节

Led1

、

LED2

的亮度，使

Mark

和周围背景颜色区分开，一直调到

Mark

点轮廓清晰，黑白分明方可。然后点击[自动查找]按钮，系统会自动捕捉到 Mark 点，点击[确

定]完成 Mark 点的抓捕，回到图 3-13 界面。

Adjust the brightness of Led1 and LED2 in the interface of Pix 3-15. Distinguish the mark

point from the background color until the outline of mark point is clear, black and white.

Click “ 自动查找”(automatic searching )button, the system will automatically capture mark

point. Click “

确定

”

（

）

button to finish the image capture and return to the interface in the Pix 3-13.

．钢网和

PCB

的

Mark

点匹配完成后在图

3-13

界面上点击

[

确认

]

按钮进入图

3-14

界面，

再点击[ 是 ]按钮回到主界面，至此，完成 Mark 点的匹配。

Click “

确定

”

（

）

button after the matching of stencil mark point and PCB mark point is

finished and it will enter into the interface in pix 3-14. Click “是”（yes）button to return to main

interface. Then the mark point matching is finished.

3.2.4 刮刀压力和速度的选择 Selection of the pressure and speed of the scraper

刮刀的压力及刮刀速度是钢网印刷中两个重要的工艺参数。

The two parameters of the pressure and speed of the scraper in the stencil

printing are very important.

刮刀速度：选取的原则是刮刀的速度和锡膏的粘稠度及

PCB

板上

SMD

的最小引脚间距

有关，选择锡膏的粘稠度大，则刮刀的速度要低，反之亦然。对刮刀速度的选择，一般先从

较小压力开始试印，慢慢加大，直到印出好的焊膏为止。速度范围为

～

50mm/s

。在印刷

细间距时应适当降低刮刀速度，一般为 15～30mm/s，以增加锡膏在窗口处的停滞时间，从

而增加

PCB

焊盘上的锡膏；印刷宽间距元件时速度一般为

～

50mm/s

。（＞

0.5mm pitch

为宽间距，＜

0.5mm pitch

为细间距〕

Scraper speed: The selection of scraper speed is related to the solder paste viscosity

and the min pin space of the SMD on PCB board. The viscosity of solder paste is higher,

the speed of scraper is lower and vise versa. For the selection of scraper speed, do the trial

printing with small pressure in general. And add the pressure slowly until print the good

solder paste. The speed range is 15～50mm/s. Lower the scraper speed in order to add the

delay time in entrance for solder paste so that to add the solder paste on the bonding pad of

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PCB when print the narrow space and the speed is 15～30mm/s in general. The printing

speed for the large space component is 30～50mm/s. (＞0.5mm pitch is large space，＜

0.5mm pitch is narrow space

）

本机器刮刀速度允许设置范围为 0～200mm/s。

The allowed scope of scraper speed is 0～200mm/s.

刮刀压力：压力直接影响印刷效果，压力以保证印出的焊膏边清晰，表面平整厚度适宜为准。压

力太小，锡膏量不足，产生虚焊；压力太大，导致锡膏连接，会产生桥接。因此刮刀压力一般是设定为

0.5

～

10kg

。

Scrape pressure: The pressure has direct influence on the printing performance. The

suitable pressure is the one that can insure the clear edge, even surface and good

thickness of the printing solder paste. Too little pressure and insufficient solder paste will

lead to empty solder. Too much pressure will bring about solder paste connection and

bridging. So the scrape pressure is set from 0.5kg to 10kg.

3.2.5

脱模速度和脱模长度

Speed and length of demoulding

脱模速度：指印刷后的基板脱离模板的速度，在焊膏与模板完全脱离之前，分离速度要

慢，待完全脱离后，基板可以快速下降。慢速分离有利于焊膏形成清晰边缘，对细间距的印刷尤其重要。一般

设定为3mm/s，太快易破坏锡膏形状。

本机器允许设置范围为 0～20mm/s。

Demoulding speed: It is the speed after the printed base board separates from the

template. Before the solder paste separates from the template completely, the separation

speed need be slow. After completed separation, the base board can decline fast. Slow

separation speed is good for the clear edge formation of solder paste. It is very crucial for

the narrow space printing. Generally, the speed is set at 3mm/s. If the speed is too fast, the

shape of solder paste will be damaged.

The allowed scope of demouding speed is 0～20mm/s.

PCB 与模板的分离时间：即印刷后的基板以脱板速度离开模板所需要的时间。时间过长，

易在模板底面残留焊膏，时间过短，不利于焊膏的站立。一般控制在

秒左右。

Separation time for the PCB and template: It is the time for the printed base board

separates from template with stripper plate speed. Too much time, it is easy to remain the

solder paste on the bottom side of template. Too little time, it is not good for the standing of

solder paste. The speed is controlled at about 1 second in general.

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本机器用脱模长度来控制此变量，一般设定为 0.5～2mm。本机器允许设置范围为 0～

10mm。

The printer control this variate by the demoulding length which is set at 0.5

～

2mm. The

allowed scope for this printer is 0～10mm.

3.3 试生产 Trial production

在以上准备工作做完以后，即可进行 PCB 板的试印刷。操作方法是：

Can do the trial printing of the PCB board after above preparations are finished. The

operation methods are as following:

单击主工具栏中的

[ ]

按钮，出现图

3-18

界面，在该界面上勾选显示调节窗口，

然后点击[确定]按钮回到软件主界面。

Click the “ ”(production setting) button in the mail tool bar. The interface in the

Pix 3-18 will be displayed. Select “显示调节窗口” (display adjustment window) and

click “确定”（ok）button to come back to the main interface of the software.

2. 在软件主界面上点击[ ]按钮，接下来按软件提示操作进入生产模式，机器在完成

PCB 运输，定位，取像，Z 轴上升到印刷位置后，出现图 3-18 画面。

Click “ ” (start) button in the main interface of the software. According to the

software instructions, it will enter production mode. The interface in the pix 3-18 will

be displayed after the finish of the PCB transmission, positioning and image capture

and the Z axis lift up to the printing location.

3. 在 3-18 界面下，检查 PCB 是否和钢网紧贴，要求是 PCB 刚好挨着钢网，否则需调节

Z 轴高度，直到满足要求。检查 PCB 焊盘是否和钢网网孔重合，如不重合，则需要调

整平台

、

，直到重合为止。

Check whether the PCB is against stencil in the interface of pix 3-18. The PCB need

be against stencil. Otherwise operator need adjust the height of Z axis until the PCB

is against stencil. Check whether PCB bonding pad and stencil hole is overlapped. If

not, please adjust the X,Y1,Y2 of platform until PCB bonding pad and stencil hole is

overlapped.

在图 3-18 界面下安装刮刀，注意：刮刀片安装前应检查其刀口是否平直，有无缺损。

Assemble the scraper in the interface of pix 3-13. Please check whether the blade

is even, straight and damaged before assembling the scraper blade.

4. 以上工作完成后点击[确定]按钮，完成第一块 PCB 的印刷。