00196962-04-BA-SX12-V2-EN.pdf - 第108页
3 Technical data and assemblies User manual SIPLACE SX1/SX2 3.5 Placement head From software version SC 706.1 SP1 Version 10/2014 108 3.5.1.1 Description The SIPLACE Sp eedSt ar (C& P20) functions according to the Co…
User manual SIPLACE SX1/SX2 3 Technical data and assemblies
From software version SC 706.1 SP1 Version 10/2014 3.5 Placement head
107
3
Fig. 3.5 - 2 SIPLACE SpeedStar - function group part 2
(1) C&P component camera, type 23, 6 x 6, digital
(2) Intermediate distributor board
(3) Star motor
(4) Handle
(5) Component sensor
(6) Star with 20 nozzles
3 Technical data and assemblies User manual SIPLACE SX1/SX2
3.5 Placement head From software version SC 706.1 SP1 Version 10/2014
108
3.5.1.1 Description
The SIPLACE SpeedStar (C&P20) functions according to the Collect&Place principle, i.e. twenty
components are picked up by the placement head within a single cycle. At the pick-up and place-
ment position the component sensor checks that the component is present at the nozzle. On their
way to the placement position the components are optically centered and rotated into the required
placement angle. Finally forced air sets down the component gently and accurately on the board.
The C&P20 head makes a significant increase in the placement head performance possible and
therefore in the performance of the placement machine. The compact design of the C&P20 head
also facilitates very short cycle times. In this case, the star axis is at an angle to the PCB level.
This geometry allows the segments to be arranged in a very small space.
The component camera is still integrated into the C&P20 head. This saves additional traveling
distances to external centering cameras. Each segment also has its own DP drive for rotating the
nozzle. The nozzles are therefore no longer rotated into the correct position at a single head sta-
tion. They can be rotated into their placement position at any time and independently of one an-
other.
Each segment has a separate vacuum generator. This greatly reduces the time taken to switch
between vacuum and air kiss. It also allows a vacuum check to be carried out in the holding circuit
for each individual nozzle.
The Z drive for the segments is implemented with a linear motor with linear path measuring sys-
tem, and is thus extremely precise. In the pick-up/placement position, the Z drive moves the seg-
ments up or down in the vertical direction.
User manual SIPLACE SX1/SX2 3 Technical data and assemblies
From software version SC 706.1 SP1 Version 10/2014 3.5 Placement head
109
3.5.1.2 Technical data SIPLACE SpeedStar (C&P20)
3
SIPLACE SpeedStar (C&P20)
with component camera
type 23
with component camera type 41
Component range
*a
*)a Please note that the placeable component range is also affected by the pad geometry, the customer-spe-
cific standards, the component packaging tolerances and the component tolerances.
01005 to 2220, Melf, SOT,
SOD
03015 mmto 2220, Melf, SOT,
SOD, Bare-Die, Flip-Chip
Component spec.
Max. height
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
4 mm
0.25 mm
0.1 mm
0.4 mm
0.2 mm
0.4 mm x 0.2 mm
6 mm x 6 mm
1 g
4 mm
0.08 mm
0.03 mm
0.10 mm
0.05 mm
0.12 mm x 0.12 mm
6 mm x 6 mm
1 g
Programmable set-down
force
1.5 - 4.5 N 1.5 - 4.5 N
Nozzle types 10xx, 11xx, 12xx 10xx, 11xx, 12xx
X/Y accuracy
*b
*)b The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the
conditions set out in the SIPLACE scope of service and supply.
± 41 µm/3σ
± 55 µm/4σ
± 41 µm/3σ
± 55 µm/4σ
Angular accuracy ± 0.5° / 3σ
± 0.7° / 4σ
± 0.5° / 3σ
± 0.7° / 4σ
Illumination level 5 5
Possible illumination
level settings
256
5
256
5