00196962-04-BA-SX12-V2-EN.pdf - 第136页
3 Technical data and assemblies User manual SIPLACE SX1/SX2 3.7 PCB conveyor system From software version SC 706.1 SP1 Version 10/2014 136 PCB warp age in the direction of transp ort + PC B thickness < 5.5 mm. Be ndin…
User manual SIPLACE SX1/SX2 3 Technical data and assemblies
From software version SC 706.1 SP1 Version 10/2014 3.7 PCB conveyor system
135
3.7.5 Definition of PCB warpage
3.7.5.1 PCB warpage on the conveyor
PCB warpage across the direction of travel max. 1 % of the PCB diagonal, but not exceeding 2 mm
3
Fixed clamped edge
Movable clamping device
Printed circuit board
Conveyor side wall
3 Technical data and assemblies User manual SIPLACE SX1/SX2
3.7 PCB conveyor system From software version SC 706.1 SP1 Version 10/2014
136
PCB warpage in the direction of transport + PCB thickness < 5.5 mm. Bending up of board edge
max. 2.5 mm.
3
3
Fixed clamped edge
Conveyor belt
PCB transport direction
Front board edge
Front board edge
Left conveyor belt
Right conveyor belt
PCB transport direction
User manual SIPLACE SX1/SX2 3 Technical data and assemblies
From software version SC 706.1 SP1 Version 10/2014 3.7 PCB conveyor system
137
3.7.5.2 PCB warpage during placement
A warpage of 2 mm can lead to problems focussing on local fiducials and ink spots in the middle
of the PCB. The digital camera's focus is 2 mm. When all the tolerances are taken into account,
this value is reduced to 1.5 mm. Also note that the component height is reduced by the warpage.
3
3
PCB warpage down, max. 0.5 mm
3
Use magnetic pin supports to achieve this value.
Movable clamping device
Fixed clamped edge
Printed circuit board
Conveyor side wall
Printed circuit board
Magnetic pin
support
Movable clamping device
Fixed clamped edge
Conveyor side wall
0.5 mm