00196962-04-BA-SX12-V2-EN.pdf - 第122页

3 Technical data and assemblies User manual SIPLACE SX1/SX2 3.5 Placement head From software version SC 706.1 SP1 Version 10/2014 122 3.5.5.1 Description This sophisticated placement head consists of tw o pla c ement hea…

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User manual SIPLACE SX1/SX2 3 Technical data and assemblies
From software version SC 706.1 SP1 Version 10/2014 3.5 Placement head
121
3.5.5 SIPLACE TwinStar for high precision IC placement
3
Fig. 3.5 - 9 SIPLACE TwinStar for high precision IC placement
3
(1) Pick&Place module 1 (P&P1) - the TwinStar consists of 2 Pick&Place modules
(2) Pick&Place module 2 (P&P2)
(3) DP axis
(4) Z axis drive
(5) Incremental distance measuring system for the Z axis
3 Technical data and assemblies User manual SIPLACE SX1/SX2
3.5 Placement head From software version SC 706.1 SP1 Version 10/2014
122
3.5.5.1 Description
This sophisticated placement head consists of two placement heads of the same type coupled to-
gether. Both heads work using the Pick&Place principle. The TwinStar is suitable for processing
complex and large components. Two components are picked up by the placement head, optically
centered on the way to the placement position and rotated into the necessary placement angle.
They are then placed gently and accurately onto the PCB with a controlled blast of air.
New nozzles (type 5xx) have been developed for the TwinStar. With an adapter you can also use
the nozzles of type 4xx from the Pick&Place head and nozzles of type 8xx and 9xx from the Col-
lect&Place heads.
User manual SIPLACE SX1/SX2 3 Technical data and assemblies
From software version SC 706.1 SP1 Version 10/2014 3.5 Placement head
123
3.5.5.2 Technical data
SIPLACE TwinStar (TH)
with component camera type 33
(fine pitch camera)
with component camera type 25
(flip chip camera)
Component range
*a
0402 to SO, PLCC, QFP, BGA, special
components, bare dies, flip-chips
0201 to SO, PLCC, QFP, sockets,
plugs, BGA, special components, bare
dies, flip-chips, shields
Component specs
*b
Max. height
*c
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
*d
25 mm
0.3 mm
0.15 mm
0.35 mm
0.2 mm
1.0 mm x 0.5 mm
55 mm x 45 mm (single measurement)
For use with two nozzles:
50 mm x 50 mm or 69 mm x 10 mm
For use with one nozzle (multiple measure-
ment):
78 mm x 78 mm or 110 mm x 10 mm
up to 200 mm x 125 mm (with restrictions)
100 g
25 mm
0.25 mm
0.1 mm
0.14 mm
0.08 mm
0.6 mm x 0.3 mm
16 mm x 16 mm (single measurement)
55 mm x 55 mm (multiple measure-
ment)
100 g
Programmable set-down
force
1.0 N - 15 N
2.0 N - 70 N
*e
1.0 N - 15 N
2.0 N - 70 N
e
Nozzle types
*f
5xx (standard)
4xx + adapter
8xx + adapter
9xx + adapter
gripper
5xx (standard)
4xx + adapter
8xx + adapter
9xx + adapter
gripper
Nozzle spacing for P&P
heads
70.8 mm 70.8 mm
X/Y accuracy
*g
± 26 µm / 3σ, ± 35 µm / 4σ ± 22 µm / 3σ, ± 30 µm / 4σ
Angular accuracy ± 0.05° / 3σ, ± 0.07°/ 4σ ± 0.05° / 3σ, ± 0.07° / 4σ
Illumination level 6 6
Possible illumination level
settings
256
6
256
6
*)a Please note that the placeable component range is also affected by the pad geometry, the customer-specific standards, the
component packaging tolerances and the component tolerances.
*)b If the MultiStar and TwinStar are combined in the same placement area, the maximum component height may be restricted .
*)c Max. component height 45 mm available on request, with Very High Force Pick&Place (VHF) and nozzle type 508.
*)d If standard nozzles are used
*)e SIPLACE Very High Force Twin Star (VHF TH).
*)f Over 300 different nozzles and 100 gripper types are available, with an extensive nozzle database available online.
*)g The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the conditions set out
in the SIPLACE scope of service and supply.