00191913-01.pdf - 第505页

User Manual SIPLACE 80S-20/F4 11 Station extensions / hardware Software version SR.406.xx 02/2000 Issue US 11.9 Flux dispenser unit 503 11 Fig. 1 1.9 - 8 Editing the fluxing package form list (1) H ighligh t the line (2)…

100%1 / 564
11 Station extensions / hardware User Manual SIPLACE 80S-20/F4
11.9 Flux dispenser unit Software version SR.406.xx 02/2000 Issue US
502
Volume: 11
– The volume of flux to be applied for the current component in (µl).
– You can enter flux volumes from 1 µl to 100 µl.
– We recommend the following values as a guideline:
6 mm x 6 mm component => 8 µl flux
10 mm x 10 mm component => 10-15 µl flux
Holding time: 11
– The time for which the component must be held in the flux after placement.
– This may be set to 0 to 500/100 sec, which corresponds to 0 to 5 seconds.
Comment: 11
– Here you can enter a comment about the component.
11
Å Click on OK to confirm your input.
Å Click on Accept to save the edited package form list.
PLEASE NOTE
You can enter up to 25 package forms on the station computer. 11
Å To edit a component, simply highlight the line containing that component (see Fig. 11.9 - 8).
Å Click on the Edit button in order to edit an existing package form.
User Manual SIPLACE 80S-20/F4 11 Station extensions / hardware
Software version SR.406.xx 02/2000 Issue US 11.9 Flux dispenser unit
503
11
Fig. 11.9 - 8 Editing the fluxing package form list
(1) Highlight the line
(2) ‘Edit’ button
(3) Input boxes
11
Å Edit the data as described for Add.
Å Click on OK to confirm your input.
Å Click on Accept to save the edited package form list.
11
311 111 211
11 Station extensions / hardware User Manual SIPLACE 80S-20/F4
11.9 Flux dispenser unit Software version SR.406.xx 02/2000 Issue US
504
11.9.7.3 Editing the flux parameters
Å Select the “Parameters” menu to enter data for the fluxing process.
11
Fig. 11.9 - 9 Editing the flux parameters
11
Waiting time for the PCB conveyor 11
– The time for which the PCB remains in the station until it undergoes further placement. This
ensures that the flux dries reliably, and the component cannot “float away”.
– This time is measured from the last flip-chip component to be placed,
– and can be set to between 0 and 40 seconds.
PLEASE NOTE
Setting this waiting time can have a detrimental effect on line utilization. 11
11