SIPLACE Vision Customer_en.pdf - 第201页

Waiting time at placement To guarantee a floating of conductive glue below the DIE’ s or dr ying of flux at placement it is useful to program severa l x00ms wait ing time down at placement. Air kiss at placement (or retu…

Dynamic profile for Pickup

Here are the special positioning characteristics for the special modes of pickup head cycle set. (Dynamic profile have to be selected for SC/MC SW 502. and

onwards.

Movement downwards:

1 - Downwards Pickup standard: Dynamic profile for Pickup with contact (2N) at comp.. (ca. 15 comp.’s per Lin. feeder to learn pickup height).

17 - Downwards Pickup contactless: Dynamic profile for Pickup without contact (0 N) at comp.. (Learn pickup height at 1

access

(of C&P 20/12/6) and than suck at the 2

pickup the comp. ‚to the floating nozzle’.

21 - Downwards Pickup with minimal. force: Dynamic profile for Pickup with TWIN-head and only 1N pickup force.

22 - Downwards Pickup with very low force: Dynamic profile for Pickup with TWIN and 0,5-0,9N –special setting of TWIN head required-

35 – Downwards Pickup 01005 contactless Dynamic profile for Pickup WITHOUT Contact (0N) for 04x02mm (01005) component.

Movement upwards:

1 - Upwards Pickup standard:Dynamic profile start with full acceleration upwards.

3 - Upwards Pickup slow start: Dynamic profile with slow speed for the first ~1mm (~20ms). This cause that the holding force for the

comp. on the nozzle is fully available at upwards acceleration. the comp. wont drop down.

4 - Upwards Pickup creep start: Dynamic profile with slow speed for approx. the first 2 mm (~100ms) required for start upwards at Pickup

from Surftape.

23 - Upwards Pickup with very low force: Dynamic profile for Pickup with TWIN and 0,5-0,9N

-special setting of the TWIN head (pickup & placement force have to be identical).

Pickup force

The Pickup force could be programmed but all values larger 2N are ignored. 1N could be used for TWIN head with Dynamic profile 21. (Pickup force of 0,5-

0,9N are a special construction (SOKO) with a special adjusted TWIN-head)

Waiting time at Pickup

This is used for a very special pickup procedure – the pickup from a Surftape feeder.

This feeder requires approx. 250ms until the reject needle touches the component – than start the pickup procedure on Z-Axis

Pickup mode

“WITH contact“ This standard mean that the head touch on the comp. in feeder with a pickup force of 2 N (except TWIN).

“WITHOUT contact” 0201 that the head learn at the 1

access to track the pickup height & at the 2

pickup the comp. is suck. with a distance of ~ 0,1mm

“WITHOUT contact” 01005 same sequence but the Z-axis is more sensible adjusted (necessary? Please test)

Dynamic profiles for Placement

Here are the special positioning characteristics for the force at placement head cycle set.

Movement downwards:

5 - Downward placement standard: Dynamic profile for Placement with standard force (2N) on comp..

(approx. 15 PCB’s per place pos. to learn Placement height). /at 604 the 1

PCB than only tiny

corrections for ‚steady height’).

6 - Downward place with slow ‘braking’: Dynamic profile for placement with 2N & slowly movement in pos. (~1mm) e.g. for BGA balls in

filling mat.

7 - Downward placement w. place.force: Dynamic profile for place with 3-5N (TWIN 3-10N).

For large contact areas in (dried) solder paste.

8 - Downward place w.place force&slow ‚braking’: Dynamic profile combination of ’7' & ’6'. e.g. for ~1mm high centering pins with increased force.

25- Downward place w. very high force: Dynamic profile for Place. with TWIN-head with 11-15N. (26 same Force with slow move in pos.)

26- at Option HIGH FORCE: Dynamic profile for Placement with HIGH FORCE TWIN-head with 16-30N.

27- Downward place w. minimal Force: Dynamic profile for Place with TWIN & with 1N. same red. force like at pickup

28- Downward place w. minimal Force &slow ‚braking’: same Force like with profile 27 but additional with slow movement in position.

29- Downward place w. very low Force Dynamic profile for Place w. TWIN & with 0.5-0.9N special arranged TWIN

(former Low force nozzle).

30- Downward place w. very low Force & slow brak. Dynamic profile for Place w. TWIN with 0.5-0.9N special arranged TWIN & with slow

move into position.

31- Downward place smooth Dynamic profile for Place with C&P for very sensitive 06x03mm(0201) components refer to 2N

32- Downward place smooth for Centering Pin Dynamic profile (for Place with TWIN for comp. with center. pin & place. force 2N) not realized

up to 604/701??

33 - Downward place 01005 Dynamic profile for Place of 04x02mm (01005) comp.’s with ’adopted force [34 is 33 & w slow

move in pos.]

Movement upwards:

9 - Upwards Placement standard: Dynamic profile start with full acceleration Upwards.

10 - Upwards Place slow start: Dynamic profile with slow speed for the first ~1mm (~20ms). This cause that the comp. is not

taken from the PCB with the nozzle at Upwards acceleration if the holding force on the PCB is

extremely low

24 - Upwards Placement with very low Force: Dynamic profile for Placement with TWIN if the placement force of 0,5-0,9N have to be used.

-special setting of the TWIN head (pickup & placement force than identical) (see 29/30 &22).

Component shape

Advanced Handling I

Placement process 0201 (see body) requires

Contact less Pickup with Dynamic profile 17 & fitting nozzles 906/ 902 & comp.-Sensoroption on C&P12 respectively

Contact less Pickup with Dynamic profile 17 & fitting nozzles 1006/ ... & comp.-Sensor C&P20

Contact less Pickup works only out from the special ...0201 S feeder or with insert of the spacers below the paper tapes

Placement process 01005 (see body) requires

Contact less Pickup with Dynamic profile 35 (17) & fitting nozzles 905 and special sleeve and feeder & comp.-Sensor replacement function on

C&P12 of D1/D1 or D4 machine respectively

Contact less Pickup with Dynamic profile 35 & fitting nozzles 1006/ ... & comp.-Sensor C&P20

Contact less Pickup works only with insert of the spacers below the paper tapes

Are this options seperately selected so any componentshape could be processed with placement functions for 0201 placement process.

A programing overview about process reliability Editon for SIPLACE Pro 5.0 extended for 5.2

Waiting time at placement

To guarantee a floating of conductive glue below the DIE’s or drying of flux at placement it is useful

to program several x00ms waiting time down at placement.

Air kiss at placement (or return component)

The electronically of vacuum and air kiss generation allow to set the air pressure (150 default) at

placement and control in a closed loop.

Achieving 80% (typical) the machine recognize that the C&P20 or the TWIN-head has placed the

component..

The C&P 12/6 heads use this values for a time controlled operating time of the.air kiss solenoid (No

time gain in pickup)

1-50 air kiss solenoid OFF when the valve drive is started (not useful)

51-150 air kiss solenoid OFF when valve drive turned 90° (standard)

151-255 air kiss solenoid OFF when valve drive turned 180° or Z-axis come to LB top.

Component presence tests

The operation mode for the comp. presence test (presence check or height check) is defined here.

❑ Pickup (after)

Here the machine checks if a component was successfully picked up.

If it fails the comp. is immediately re-picked possibly after reject of the 1

comp.

This mode is permanent active for the comp. sensor at C&P20 head.

❑ Placement (before)

Here the machine checks if the component is on the nozzle before placement.

If it fails the placement head circle with this segment is not started or interrupted.

Kind of component presence test

with this 5 kind of component presence tests are the placement head specific component tests are programmed.

The TWIN-head could only test with Vacuum check so it ignore other programmings. Same operation for the C&P 6.

The C&P12 head work according optional equipment with vacuum or with comp. Sensor. C&P12 comp. height check for comp.’s on nozzle longer 12,5mm

and comp. height smaller approx 4,5mm. The C&P20 head work only with comp. sensor.

Normal

TWIN: Vacuum / C&P6. Vacuum / C&P12: Vacuum or C/P12 comp.sensor option: Vacuum / C&P20: comp. presence check

C&P12 only vacuum based comp. presence test (just the same TWIN & C&P 6).

Attention; for 902/900/925 and similar tiny nozzles NO vacuum test is possible to execute!

Such nozzle types require for 0603mm (0201) placement normally a comp. sensor at C&P12-head!)

Advanced

TWIN: Vacuum / C&P6: Vacuum / C&P12: Vacuum C/P12 comp.sensor option: Vac.&comp. / C&P20: comp. presence check

C&P12 comp.sensor option: only vacuum based comp. presence test at pickup; before placement also comp. sensor based presence check

Vacuum based presence test for TWIN& C&P6 C&P20 comp. sensor based comp. presence check no vacuum test for any type of nozzle.

NO vacuum

TWIN Vacuum / C&P6 ---- / C&P12 ---- C/P12 comp.sensor option: comp.pres.check / C&P20 comp. pres. check

C&P6/12 without comp.sensor NO comp. presence test. C&P12 with comp.sensor option: comp. Presence check before placement only! C&P20 comp.

sensor based comp. presence check

Comp. sensor – thickness check

TWIN Vacuum / C&P6 Vacuum / C&P12 Vacuum C/P12 comp.s. option: Vac.& comp.height check / C&P20 comp. height check

C&P12 with comp. sensor opt. vacuum test after pickup : before placement comp. height check on nozzles long & comp. height low enough . C&P20 comp.

sensor based comp. presence check.

Comp. sensor – thickness check NO vacuum

TWIN Vacuum / C&P6 ----? / C&P12 ---- C/P12 comp.sensor option: comp. height check / C&P20 comp. height check

C&P12 w. comp.sensor opt. No presence test after pickup : before placement comp. height check on nozzles long & comp. height low enough

C&P20 comp sensor based comp. height of all comp. on all nozzles.

Dipping (BGA/ FlipChip into flux)

Was Dipping selected each C&P12/6 or Twin head could dip the comp.in the Dip unit S-table (round disk) or in the Linear Dip Unit (X-table).

Dipping Vision Dipping is done before Vision. With 605 SIPLACE Vision is able to inspect dipped terminals.

Vision Dipping Dipping is done after Vision. Danger comp. may move during dipping take care on nozzle contact

Dwell time

Several x00ms remain the BGA/FlipChip comp. in flux with defined adjusted flux material thickness (40-50% Ball radius).

Component shape

Advanced Handling

A programing overview about process reliability Editon for SIPLACE Pro 5.0 extended for 5.2

Default feeder for the component shape.

Here is the default feeder of the component shape defined. Is a feeder allocated to a component so this

one has priority for use.

X-Feeder:

This feeder series is the only one fast and precise enough feeding the components for the C&P 20 head.

All types of tape, and linear feeders (Stick magazines) are available since 2007.

S-Feeder:

need on X-machines comp. tables with the mechanical, electrical S-Feeder interface.

Blue marking tick

label the default feeder of the component shape. This is to program ‘Set default’ button if more than one

feeder is available in program.

Unfortunately, you could not select default feeder for the two series, S- and X- configuration, separately.

EL Electrical Feeder:

could be continually used up to S27 or F5HM machines.

Stick magazines (4,5) / 9,5 / 10 / 15 / 30mm:

requires the linear – vibration feeder base – available for S and X- comp. table.

Other special feeder:

see therefore feeder programming over view or the respective user manual.

Component packaging:

Here is a special programming for a customized feeder allocated to a basic feeder type:

Pickup offset, Pickup tolerance, Pickup angle, Waiting time pickup could be reused calling this

‘customized feeder name.

Pickup offset

This pickup offset at X/Y orientation is considered at set up optimization and at the pickup with the placement head. For large comp. shapes which come close to the size of the field of view

this offset influence the calculation the max. possible pickup tolerance.

Moving the nozzle contact position change also the pickup offset because it is automatically considered in the feeder pickup position at SC/MC 505.xx and 6xx.

Pickup tolerance

The Pickup offset should not influence essentially the placement shadow of tiny, of identical high components. Therefore it is recommended that the material thickness of the nozzle is the

maximal allowed exceed. At the easiest this is to recognize at the nozzle programming. Measure this material thickness with 2 Cursor positions an the nozzle extent and at the vacuum

channel. To keep the reject rate in acceptable low range the pickup tolerance should not be programmed essentially lower than 0,2mm.

For larger components you could check the varity of the component position in the tape or feeder

Please Note for Comp. As wide as camera field of view: SIPLACE Pro use only 1 Pickup tolerance (the maximum one) for the calculation of overall Component shape size!

Z-offset

Is here entered a positive Z-Offset so the machine expect that the comp. higher and calculates for a dynamic profile that move not so far down with full acceleration / speed.

Pickup offset angle

This angle value is considered in the set up optimization. Enter here the pickup angle in 90° steps if the component position in the feeder deviates from the comp. shape 0° programming

position.

Do not try to correct the pickup error of a thoughtless pickup angle programming with ’Orientation’. This lead to polarity errors on symmetrical integrated circuit comp. shapes respectively a

remarkable time lost because of multiple measurements.

Pickup tolerance angle

This tolerance influence mainly the measurement time at Shield recognition if it is set to values above 10°. Than the search algorithms for the large searching area of the corner recognition

last extremely long and influence the placement rate.

Please consider for connectors that this angle tolerance is programmed with an respective large Y-pickup tolerance. Otherwise some features along the long X-dimension came out of the

search range of the Y-direction – this lead to the Error message ‘search area too small –not all features found’.

Characteristics

Waiting time

Waiting time for the comp. transport at linear feeder – as long as this waiting time runs no

pickup access is done to this feeder.

The set up optimiztion consider this time also for tape feeder allthough the station use a type

specific fix waiting time.

See also the Feeder chart – with module images and short descriptions.

---.

Packaging information

previously they where used for filling level check and Setup center. Now this is transmitted to

X-feeder and since 603 to S-feeder for feeder control.

Component Pitch

is the transport step of the components in the tape.

The programmed pitch sent for SIPLACE Pro is used at the X- and the S-Feeder for default

pitch. The operator could change this on the station if required.

Number of components on the reel

Information for filling level check and Setup center.

Fiducial (feeder position recognition fiducial)

Here are NO programmings or adjustments necessary!!!

for X- feeder

is the comp. length 1,1mm (0402) or shorter so is from the comp. shapes data a comp. pocket

geometry created. This is used for optical feeder position recognition at 8mm X-feeder of the

respective track at the first scheduling of the production recipe.

for S-feeder

Feeder pos. recognition with pocket fiducial is used for 0201 3x8mm S feeder or

3x 8mm SL feeder and for components which are 0,6mm (0201) or shorter.

Feeder pos. recognition with feeder fiducial is used for 0201 3x8mm S feeder or

3x 8mm SL Feeder and if the comp. length exceeds 0,6mm but the comp.-width is smaller

0,8mm (0603).

Feeder pos. recognition with feeder fiducial is used for 3x 8 mm Standard and 2x8mm S-

feeder if the comp. width is 0,8mm or smaller.

If S- or X-feeder have larger components NO feeder position recognition is executed.

Component shape Feeder

X- feeder speed

Here 3 different transport speed levels for

the X- Feeder could be selected & and

scheduled to the feeder.

X/Y-Pickup tolerance calculated value set by SIPLACE Pro at programming:

If one of the dimensions X

Nom

or Y

Nom

smaller 2,0mm the pickup tol. X/Y 0,5mm is set

smaller 5,0mm & both are larger 2,0 mm the pickup tol. X/Y 0,7mm is set

smaller 9,0mm & both are larger 5,0 mm the pickup tol. X/Y 0,95mm is set

smaller 35,0mm & both are larger 9,0 mm the pickup tol. X/Y 1,3mm is set

If both dimensions X

Nom

and Y

Nom

are

larger 35,0 mm the pickup tol. X/Y 1,8mm is set.

The ‘calculated default’-pickup angle tolerance is defined from SIPLACE Pro for the same

dimension steps.

A programing overview about process reliability Editon for SIPLACE Pro 5.0 extended for 5.2