SIPLACE Vision Customer_en.pdf - 第43页

Component Shapes Overview of Component Shapes Which Require Separate Grou p Descriptions Component Shape Description Rules S tudent Guide SIPLACE Vision (Customer) Edition 12/2008 EN Component Shapes 43 5.2 Component Sha…

Component Shapes

Structure of Component Shape Data Overview of Component Shapes Which Require Separate Group Descriptions

Student Guide SIPLACE Vision (Customer)

Component Shapes Edition 12/2008 EN

5.1.2 Overview of Component Shapes Which Require Separate Group Descriptions

CS type name Lead groups- separation

required?

Reason

Shield Required without exception,

due to new algorithms

SIPLACE Vision uses corner recognition or polygon circle

recognition. ICOS uses virtual leads or ball descriptions.

CCGA Not important SIPLACE Vision recognizes column leads. ICOS processes

these components as BGAs.

BGA and

CCGA

Possibly required If (to save time) not all leads have been activated or programmed

for the inspection mode (for ICOS).

Plug Possibly required SIPLACE Vision permits all types of leads. ICOS does not allow

any combination of leads.

Nonstandard Possibly required SIPLACE Vision can center lead types which would need to be

omitted for ICOS e.g. lead-ball combinations etc.; BLOP leads;

leads with notches or rounded corners.

BareDie Possibly required if the PDC

description for ICOS needs to

be used.

Chip COs were described without leads (PDC).

Where possible, replace all lead-less descriptions!

(Use as regular FDC in LC for ICOS.)

Components

with special

descriptions for

ICOS

Important e.g. 2 pin diodes (SOD 323) need to be processed with a chip or

BGA description in ICOS, so that COs which are picked up from

the side can be sorted out.

For component shapes with lead feature combinations for

SIPLACE Vision.

All COs with

white bodies

and metallic

leads on them

Important, if SIPLACE Vision

is to recognize these features.

White CO bodies must be programmed as white bodies (often as

CHIP with virtual leads on the narrow sides) in ICOS. Due to

improved camera illumination technology, SIPLACE Vision now

supports the recognition of metal surfaces on a white

background.

Component Shapes

Overview of Component Shapes Which Require Separate Group Descriptions Component Shape Description Rules

Student Guide SIPLACE Vision (Customer)

Edition 12/2008 EN Component Shapes

5.2 Component Shape Description Rules

For process reliability reasons, SIPLACE Vision checks the CO geometry more exactly than SIPLACE

ICOS. Dimension tolerances up to approx. 30% are considered acceptable; tolerances between 30-40%

could influence the measurement procedure; values above 50% will not be accepted.

General component shape description rules

In most cases, the component shapes are not symmetrical to a particular point. To guarantee uniform

programming, please observe the following rules:

 We recommend that you describe components in a horizontal position in SIPLACE Pro, not in a

vertical position:

 The coordinate system for CS descriptions in SIPLACE Vision is defined as follows:

NOTE: Observe the tolerances!

The tolerance values for lead dimensions must NOT exceed 50%, otherwise error messages

will be issued!

Horizontal: Not vertical:

View from above in SIPLACE Vision: View from side in SIPLACE Vision:

View from above in SIPLACE Pro: Do not use the view from below:

Component Shapes

Component Shape Description Rules Overview of Component Shapes Which Require Separate Group Descriptions

Student Guide SIPLACE Vision (Customer)

Component Shapes Edition 12/2008 EN

CO Height

The overall height Z (with lead 1) is used to calculate the Z-axis speed profile during (pickup and)

placement; to calculate the camera focal levels; the focus height position for the Coplanarity option and

the Z-position for the gantry positioning during placement with the TWIN head.

 To define the heights of through-hole contacts, centering and locking pins, each case must be

considered individually and requires exact knowledge of the dimensions!

CO thickness

The Z body size (CO thickness 2) must be correctly programmed for the CO sensor installed in the C&P

20 head or for the CO sensor option on the DLM 1/2 C&P 12 head. In addition, take care that the height

is described correctly, so that the combination of CO and nozzles can be brought into the correct focal

range of the CO camera. The ICOS descriptions could include body dimensions with intermediate

values, by which the tolerance levels were set relatively high (common CS for R and C). In reality, these

values are the same as the overall Z value, since the additional lead heights are within the set height

tolerance.

Z body dimensions (component center height )

The Z body dimension (component center height ) must be described correctly, to guarantee various

functions, particularly the following:

 Height measurement:

By the CO sensor on the C&P20 head or for the CO sensor option on the C&P12 head (DLM1 & 2).

 Component measurement:

So that a combination of components and nozzles can be brought into the correct focal range of the

component camera.

 Reliable pickup and optimum placement speed:

Overall height (with leads) is needed for calculating the Z-axis speed profile.

NOTE: In ICOS descriptions, the Z dimensions are not specified correctly. The tolerances were then set

appropriately larger.

Standard SMD CO

1. CO Height

2. CO thickness (for CO sensors)

Socket SMD CO

1. CO height (if the component height is programmed as

high as the socket edge, this is to be programmed as

a positive (!) Z pickup position correction (inner depth

of socket). (This may be necessary for the

precedence finder from SIPLACE PRO 6.0)

2. (2) CO thickness (for CO sensors)

Special CO in PCB cuts-outs

1. CO Height

2. CO thickness (for CO sensors)