西门子SIPLACE S-27 HM用户手册.pdf - 第202页

7 Station extensions User Manual S IPLACE S-27 H M 7.11 Component s ensor Software version SR.503.xx07/2003 US Edition 202 7.1 1 Component se nsor 7.1 1.1 Function The com ponent sen sor is fix ed to the u ndersi de of t…

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User Manual SIPLACE S-27 HM 7 Station extensions
Software version SR.503.xx 07/2003 US Edition 7.10 DCA camera on the 6-segment Collect&Place head
201
7.10.1 Description
With the DCA camera, the 6-segment Collect&Place head is able to optically center and place
components of the order of magnitude of 0.6 mm x 0.3 mm to 13 mm x 13 mm. The DCA package
optimizes the speed and accuracy when placing high-speed flip chips and bare die components.7
7.10.2 Technical data
7
PLEASE NOTE 7
The technical data for the DCA camera is given in section 7.9 on page 199. 7
Component range Flip-chip, bare die, components up to 13 mm x 13 mm
Component specification
Max. height
Min. lead pitch
Min. bump pitch
Min. ball/bump diameter
Min. dimensions
Max. dimensions
Max. weight
8.5 mm
0.4 mm
0.2 mm
0.11 mm
0.6 mm x 0.3 mm
13 mm x 13 mm
5 g
Programmable set-down force 2.4 to 5.0 N
Nozzle types 8 xx, 9 xx
Max. placement rate 8,750 comp/h
Angular accuracy
± 0.3 µm / 4 sigma (gantry 1)
± 0.4 µm / 4 sigma (gantry 2)
Placement accuracy ± 70 µm / 4 sigma (gantry 1)
± 80 µm / 4 sigma (gantry 2)
7 Station extensions User Manual SIPLACE S-27 HM
7.11 Component sensor Software version SR.503.xx07/2003 US Edition
202
7.11 Component sensor
7.11.1 Function
The component sensor is fixed to the underside of the casing of the 12-segment Collect&Place
head (see Fig. 7.11 - 2
). It measures the height of the nozzle and the height of the nozzle with the
component. The component height is then determined from the two values. The sensor thus also
checks that the component is actually present.
Component heights from 0.1 to 4 mm can be checked. It is also possible to determine whether
the component is in its normal position or is sticking to the nozzle on edge. This requires the dif-
ference between the height and width of the component to be at least 100 µm, i.e. component
sizes 0603 or larger.
7
Fig. 7.11 - 1 Component sensor
To the
‘head gantry distributor’
board
Infrared LED
Phototransistor
(receiver)
User Manual SIPLACE S-27 HM 7 Station extensions
Software version SR.503.xx 07/2003 US Edition 7.11 Component sensor
203
7
Fig. 7.11 - 2 Placement head with component sensor
7
The green control LED lights up if the component sensor is switched on and the invisible IR light
beam for the component height measurement (see Fig. 7.11 - 2
red strip) is not interrupted. You
can interrupt the IR beam to check that it is working correctly. The green LED must go out.
Green control LED