00195722-0102_UM_X-Serie_SR605_EN.pdf - 第128页
3 Technical data for the machine User Manual SIPLACE X-Series 3.5 Placement head From software version SR.605.xx 07/2008 EN Edition 128 Nozzle types 9 xx 9 xx X/Y accuracy c ± 45 μ m/3 σ , ± 60 μ m/4 σ ± 41 μ m/3 σ, ± 55…
User Manual SIPLACE X-Series 3 Technical data for the machine
From software version SR.605.xx 07/2008 EN Edition 3.5 Placement head
127
then set down gently and accurately on the PCB with a blast of air. The twelve nozzles on SI-
PLACE Collect&Place heads turn about a horizontal axis, in contrast to conventional chip shoot-
ers. This does not simply save space: the small diameter means that substantially smaller
centrifugal forces occur in comparison to conventional chip shooters. This largely eliminates the
risk of components slipping during transportation.
And there is yet another benefit: the cycle time of the Collect&Place head is the same for all com-
ponents, which means that the placement rate is not dependent on the component size.
3.5.2.2 Technical data
3
12-segment Collect&Place head
with standard-component camera
type 28, 18 x 18, digital
(see Section 3.8.4
, page 158)
12-segment Collect&Place head
with high-resolution component
camera, type 29, 27 x 27, digital
(see Section 6.16
, page 450)
Range of components
a
0402 to PLCC44, BGA, µBGA, flip-
chip, TSOP, QFP, SO to SO32,
DRAM
0201
b
to flip-chip, bare die,
PLCC44, BGA, µBGA, TSOP, QFP,
SO to SO32, DRAM
Component specification
max. height
min. lead pitch
min. lead width
min. ball pitch
min. ball diameter
min. dimensions
max. dimensions
max. weight
6 mm
0.5 mm
0.2 mm
0.35 mm
0.2 mm
1.0 x 0.5 mm²
18.7 x 18.7 mm²
2 g
6 mm
0.3 mm
0.15 mm
0.25 mm
0.14 mm
0.6 x 0.3 mm²
18.7 x 18.7 mm²
2 g
Programmed power stage
1
2
3
4
5
Programmed set-down force [N]
2.4 ± 0.5
2.4 ± 0.5
3 + 1
4 + 1
5 + 1
3 Technical data for the machine User Manual SIPLACE X-Series
3.5 Placement head From software version SR.605.xx 07/2008 EN Edition
128
Nozzle types 9 xx 9 xx
X/Y accuracy
c
± 45 μm/3σ, ± 60 μm/4σ ± 41 μm/3σ, ± 55 μm/4σ
Angular accuracy ± 0.5°/3σ, ± 0.7°/4σ ± 0.5°/3σ, ± 0.7°/4σ
Component range 98% 98.5%
CO camera type 28 29
Illumination level 5 5
Possible illumination level
settings
256
5
256
5
a) Please note that the component range that can be placed is also affected by the pad geometry, the cus-
tomer-specific standards and the packaging tolerances.
b) With 0201 package
c) The accuracy value was measured using the vendor-neutral IPC standard.
User Manual SIPLACE X-Series 3 Technical data for the machine
From software version SR.605.xx 07/2008 EN Edition 3.5 Placement head
129
3.5.3 6-segment Collect&Place head for high-speed IC placement
3
Fig. 3.5 - 5 6-segment Collect&Place head - Function groups, part 1
(1) Vacuum generator
(2) Turning station, DP axis
(3) Star with 6 sleeves - star axis
(4) Forced air valve
(5) Silencer