00195722-0102_UM_X-Serie_SR605_EN.pdf - 第176页

3 Technical data for the machine User Manual SIPLACE X-Series 3.9 X feeder modules for the component trolley from the SIPLAC E X-series From software version SR.605.xx 07/2008 EN Edition 176 3.9.2.9 88 mm X t ape feeder …

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User Manual SIPLACE X-Series 3 Technical data for the machine
From software version SR.605.xx 07/2008 EN Edition 3.9 X feeder modules for the component trolley from the SIPLACE X-series
175
3.9.2.8 72 mm X tape feeder module
3
Fig. 3.9 - 10 72 mm X tape feeder module
3
3
3
72 mm X tape feeder module Item no. 00141277-xx
72 mm X tape feeder module with splice sensor Item no. 00141297-xx
Width 81.6
Feeder module locations filled 7
Conveyor increment From 4 mm to 80 mm in 4 mm increments
Changeover time for the component tape < 45 s
Changeover time for the pre-set feeder module
on the machine
≤ 8 s
3 Technical data for the machine User Manual SIPLACE X-Series
3.9 X feeder modules for the component trolley from the SIPLACE X-series From software version SR.605.xx 07/2008 EN Edition
176
3.9.2.9 88 mm X tape feeder module
3
Fig. 3.9 - 11 88 mm X tape feeder module
3
3
3
88 mm X tape feeder module Item no. 00141278-xx
88 mm X tape feeder module with splice sensor Item no. 00141298-xx
Width 105.2 mm
Feeder module locations filled 9
Conveyor increment From 4 mm to 96 mm in 4 mm increments
Changeover time for the component tape < 45 s
Changeover time for the pre-set feeder module
on the machine
≤ 8 s
User Manual SIPLACE X-Series 3 Technical data for the machine
From software version SR.605.xx 07/2008 EN Edition 3.9 X feeder modules for the component trolley from the SIPLACE X-series
177
3.9.3 X linear dipping unit (LDU X)
Item no. 00117011-xx Linear dip module for flux / LDU-X
Item no. dip plates see Section 3.9.3.3
, page 179
3
Fig. 3.9 - 12 Linear Dipping Unit (LDU X)
(1) LDU X
(2) Dip plate
(3) Flux container
(4) Display panel (4 lines each with 20 characters)
(5) Operator panel with 6 membrane keys
(6) LED for status displays
(7) EMERGENCY OFF button
3.9.3.1 Description
The X linear dipping unit (item 1 in Fig. 3.9 - 12) is used to wet flip-chip and CSP components with
flux. The flux container item 3 in Fig. 3.9 - 12
) slides with a linear movement over the dip plate
(item 2 in Fig. 3.9 - 12
) and applies the flux at a defined layer thickness in the depression in the
dip plate. The parameters for wetting a component with flux are prescribed in SIPLACE Pro. The