MIL-STD-202H.pdf - 第152页

MI L - S TD - 202 - 20 8 CO NT E N T S PARAGRAPH PAG E FOREW ORD … ………………………………………………………. ii 1. SCOPE 1 1.1 Purpose …… ………………… …………………. …… .. …………. 1 2. APPLICABLE D O C U M EN T S 1 3. DEFINTIONS 1 4. GENERAL RE Q UI R …

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MIL-STD-202-208
FOREWORD
1. This standard is approved for use by all Departments and Agencies of the Department of Defense.
2. This entire standard has been revised. This revision has resulted in many changes to the format, but the most
significant one is the splitting the document into test methods. See MIL-STD-202 for the change summary.
3. Comments, suggestions, or questions on this document should be emailed to std202@dla.mil or addressed to:
Commander, Defense Logistics Agency, DLA Land and Maritime, ATTN: VAT, P.O. Box 3990, Columbus, OH
43218–3990. Since contact information can change, you may want to verify the currency of this address
information using the ASSIST Online database at https://assist.dla.mil.
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北测（上海）电子科技有限公司
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MIL-STD-202-208
CONTENTS
PARAGRAPH PAGE
FOREWORD…………………………………………………………. ii
1. SCOPE 1
1.1 Purpose………………………………………….……..…………. 1
2. APPLICABLE DOCUMENTS 1
3. DEFINTIONS 1
4. GENERAL REQUIREMENTS 1
4.1 J-STD exceptions.………………………..……………..………. 1
4.2 Contractual agreements…………………………………………. 1
4.3 Coating durability………………………..…………….…………. 1
4.4 Test method………………………………………………………. 1
4.5 Soldering iron test method………………...……………………. 2
4.5.1 Apparatus...………………………………………………………. 2
4.5.2 Materials…………………………………………………..……… 2
4.5.3 Procedure…………………………………………………………. 2
5. DETAILED REQUIREMENTS 3
5.1 Summary……………………………………………………….… 3
6. NOTES 3
6.1 Supersession data………………………………………………. 3
FIGURE PAGE
1. Soldering iron position and process diagram………………………….… 2
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北测（上海）电子科技有限公司
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MIL-STD-202-208
METHOD 208
SOLDERABILITY
1. SCOPE
1.1 Purpose. The purpose of this test method is to determine the solderability of all terminations which are
normally joined by a soldering operation. This determination is made on the basis of the ability of these terminations
to be wetted by solder and the predictability of a suitable fillet resulting from solder application. These procedures will
verify that the pre-assembly lead finish provides a solderable surface of sufficient quality to enable satisfactory
soldering.
2. APPLICABLE DOCUMENTS
2.1 Non-Government publications. The following documents form a part of this document to the extent specified
herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
ASSOCIATION CONNECTING ELECTRONIC INDUSTRIES (IPC)
J-STD-002 - Solderability Tests For Component Leads, Terminations, Lugs, Terminals and Wires
J-STD-006 - Requirements For Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders For
Electronic Soldering Applications
Copies of these documents are available online at www.IPC.org
3. DEFINITIONS
This section not applicable to this standard.
4. GENERAL REQUIREMENTS
4.1 J-STD exceptions. The solderability test shall be performed in accordance with J-STD-002
“Solderabiilty Tests
for Component Leads, Terminations, Lugs, Terminals and Wires” and herein. The following details and exceptions
shall apply:
4.2 Contractual agreements. The contractual agreements statement in J-STD-002 shall not apply. Any
exceptions to the requirements specified in J-STD-002 and this test method shall be documented in the individual
military procurement document or approved by the procuring military activity.
4.3 Coating durability. The coating durability category (from J-STD-002
) shall be as follows:
a. Category 2 - for stranded wire (1 hour ±5 minutes steam aging with insulation removed).
b. Category 3 - for all other components (8 hours ±15 minutes steam aging).
4.4 Test method. The test method used (from J-STD-002
) shall be as follows:
a. Test A - for through-hole mount and surface mount leaded components, solid wire less than .045 inch
diameter and stranded wire 18 AWG or smaller. If not otherwise specified in the procurement document,
angle of immersion for surface mount leaded components shall be 90°.
b. Test B - for surface mount leadless components.
c. Test C - for lugs, tabs, terminals, solid wire greater than .045 inch diameter and stranded wire larger than 18
AWG.
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