MIL-STD-202H.pdf - 第164页
MI L - S TD - 202 - 210 CO NT E N T S PARAGRAPH PAG E FOREW ORD … ………………………………………………………. ii 1. SCOPE 1 1.1 Purpose …… ………………… …………………. …… .. …………. 1 2. APPLICABLE D O C U M EN T S 1 2.1 Non - Govern m e nt pu bl i c at i…
MIL-STD-202-210
FOREWORD
1. This standard is approved for use by all Departments and Agencies of the Department of Defense.
2. This entire standard has been revised. This revision has resulted in many changes to the format, but the most
significant one is the splitting the document into test methods. See MIL-STD-202 for the change summary.
3. Comments, suggestions, or questions on this document should be emailed to std202@dla.mil or addressed to:
Commander, Defense Logistics Agency, DLA Land and Maritime, ATTN: VAT, P.O. Box 3990, Columbus, OH
43218–3990. Since contact information can change, you may want to verify the currency of this address
information using the ASSIST Online database at https://assist.dla.mil.
ii
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MIL-STD-202-210
CONTENTS
PARAGRAPH PAGE
FOREWORD…………………………………………………………. ii
1. SCOPE 1
1.1 Purpose………………………………………….……..…………. 1
2. APPLICABLE DOCUMENTS 1
2.1 Non-Government publications……………………….………… 1
3. DEFINTIONS 1
4. GENERAL REQUIREMENTS 1
4.1 Apparatus………………………..……………….………………. 1
4.1.1 Solder pot.………………………..……………….………………. 1
4.1.2 Heat sinks or shielding.………………………….………………. 1
4.1.3 Fixtures.……………………...…..……………….………………. 1
4.1.4 Mounting board.…….…………..……………….………………. 2
4.1.5 Solder iron ……………….……..……………….………………. 2
4.1.6 Reflow chambers…….……..……..…………….………………. 2
4.1.7 Temperature measurement.…………….…………..…………. 2
4.2 Materials ………………………..……………….…………….…. 2
4.2.1 Solder………………..……………………………………………. 2
4.2.2 Flux………………………………………………………………… 2
4.2.3 VPR fluid……………………………..…………………………… 2
4.3 Procedure…………………..………………..…………………… 2
4.3.1 Special preparation of specimens…..………………….……… 2
4.3.2 Preparation of solder bath..……………………………..……… 2
4.3.3 Application of flux………………………………………………… 2
4.3.4 Test conditions…………………………………………………… 3
4.3.4.1 Test condition A: Solder iron…………………………………... 3
4.3.4.2 Test condition B: Solder dip …………………………………... 3
4.3.4.3 Test condition C: Wave solder - topside board
mount component.……………………………………..………... 4
4.3.4.4 Test condition D: Wave solder - bottomside board
mount product.……………………..…………………..………... 4
4.3.4.5 Test condition H: Vapor phase reflow soldering……..……… 5
4.3.4.6 Test conditions I, J, K: Infared/convection reflow soldering... 5
5. DETAILED REQUIREMENTS 8
5.1 Length of test……………………………………..………………. 8
5.2. Measurements……………………………………..…..…………. 8
5.3 Summary……………………………………………………….… 8
6. NOTES 9
6.1 Supersession data………………………………………………. 9
6.2 Cancelled method…………………………………………….….. 9
FIGURE PAGE
1. Component lead and mounting examples.…………………….……...… 7
TABLE PAGE
1. Test conditions ……………………..………………………………………. 6
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北测（上海）电子科技有限公司
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MIL-STD-202-210
METHOD 210
RESISTANCE TO SOLDERING HEAT
1. SCOPE
1.1 Purpose. This test is performed to determine whether wire and other component parts can withstand the
effects of the heat to which they will be subjected during the soldering process (solder iron, solder dip, solder wave,
or solder reflow). The heat can be either conducted heat through the termination into the component part, or radiant
heat from the solder bath when in close proximity to the body of the component part, or both. The solder dip method
is used as a reasonably close simulation of the conditions encountered in wave soldering, in regard to radiated and
conducted heat. This test also is intended to evaluate the impact of reflow techniques to which components may be
exposed. The heat of soldering can cause solder reflow which may affect the electrical characteristics of the
component part and may cause mechanical damage to the materials making up the part, such as loosening of
terminations or windings, softening of insulation, opening of solder seals, and weakening of mechanical joints.
2. APPLICABLE DOCUMENTS
2.1 Non-Government publications. The following documents form a part of this document to the extent specified
herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
ASSOCIATION CONNECTING ELECTRONIC INDUSTRIES (IPC)
IPC 4101 - Specification For Base Materials For Rigid and Multilayer Printed Boards
J-STD-004 - Requirements For Soldering Fluxes
J-STD-005 - Requirements For Soldering Pastes
J-STD-006 - Requirements For Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders For
Electronic Soldering Applications
(Copies of these documents are available online at www.IPC.org)
3. DEFINTIONS
This section not applicable to this standard.
4. GENERAL REQUIREMENTS
4.1 Apparatus
4.1.1 Solder pot. A static solder pot, of sufficient size to accommodate the mounting board (see 4.1.4) and to
Immerse the terminations to the depth specified for the solder dip (without touching the bottom of the pot), shall be
used. This apparatus shall be capable of maintaining the solder at the temperature specified. The solder bath
temperature shall be measured in the center of the pot at a depth of at least .500 inch (12.7 mm), but no deeper than
1 inch (25.4 mm) below the surface of the solder.
4.1.2 Heat sinks or shielding. The use of heat sinks or shielding is prohibited except when it is a part of the
component. When applicable, heat sinks or shielding shall be specified in the individual specification, including all of
the details, such as materials, dimensions, method of attachment, and location of the necessary protection.
4.1.3 Fixtures. Fixtures, when required, shall be made of a non-solderable material designed so that they will
make minimum contact (i.e., minimum heat sink) with the component. Further, they shall not place undue stress on
the component when fixtured.
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北测（上海）电子科技有限公司
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