MIL-STD-202H.pdf - 第172页

MI L - S TD - 202 - 210 5. DETAILED REQUI RE M E N T S 5.1 Examination s and m ea s ur em en t s . E x am i nat i o ns and m eas ur em e nt s t o b e m ade bef o re and after the test, as applicable, shall be a s sp e c …

100%1 / 305
MIL-STD-202-210
FIGURE 1. Component lead and mounting examples.
7
北测(上海)电子科技有限公
联系方式:xuyj@beice-sh.com 13917165676
MIL-STD-202-210
5. DETAILED REQUIREMENTS
5.1 Examinations and measurements. Examinations and measurements to be made before and after the test, as
applicable, shall be as specified in the individual specification. After the procedure, the specimens shall be allowed to
cool and stabilize at room ambient conditions, for the time specified in the individual specification.
5.2 Internal examination. When specified, internal examination of the part shall be made after the test to check for
solder reflow or heat damage.
5.3 Summary The following details are to be specified in the individual specification:
a. The use of heat sinks or shielding is prohibited except when they are part of the component (see 4.1.2).
b. Mounting board, if different from that specified (see 4.1.4).
c. Solder, if different from that specified (see 4.2.1).
d. Flux, if applicable and if different from that specified (see 4.2.2, 4.3.1, and 4.3.3).
e. Solder terminations that are not to be tested, if applicable (see 4.3.4).
f. Special preparation of specimens if applicable (see 4.3.1).
g. Depth of immersion in the molten solder, if different from that specified (see 4.3.4.2).
h. Test condition letter (see 4.3.4).
i. Cooling time prior to final examinations and measurements (see 4.3.4 and 5.1).
j. Examinations and measurements before and after test, as applicable (see 5.1).
k. Method of internal inspection, if required (see 5.2).
8
北测(上海)电子科技有限公
联系方式:xuyj@beice-sh.com 13917165676
MIL-STD-202-210
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Supersession data. The main body and 38 parts of this revision of MIL-STD-202 replace superseded MIL-STD-
202.
6.2 Cancelled Method. Method 216 (Resistance to Solder Wave Heat) is cancelled, when specified Method 210 is
used.
216 test condition 210 test condition
A
B
C
C
D
E
Custodians: Preparing activity:
Army - CR DLA CC
Navy - EC
Air Force - 85 (Project 59GP-2015-024)
DLA - CC
Review activities:
Army - AR, AT, AV, CR4, MI, SM, TE
Navy - AS, OS, SH
Air Force - 19, 99
NSA - NS
NOTE: The activities listed above were interested in this document as of the date of this document. Since
organizations and responsibilities can change, you should verify the currency of the information above using the
ASSIST Online database at https://assist.dla.mil/
9
北测(上海)电子科技有限公
联系方式:xuyj@beice-sh.com 13917165676