MIL-STD-202H.pdf - 第171页
MI L - S TD - 202 - 210 FIGURE 1 . Component lead a nd mounting examples . 7 北测（上海）电子科技有限公 司 联系方式：xuyj@beice-sh.com 13917165676
MIL-STD-202-210
TABLE I. Test conditions.
Solder technique
simulation
Test
condition
Temperature
(°C)
Time
(s)
Temperature ramp/
immersion and emersion
rate
Number
of
heat
cycles
Solder iron
A
350 ±10
(solder iron temp)
4 - 5
1
Dip
B
260 ±5
(solder temp)
10 ±1
25mm/s ±6 mm/s
1
Wave: Topside
board-mount product
C
260 ±5
(solder temp)
20 ±1
1
Wave: Bottomside
board-mount product
D
260 ±5
(solder temp)
10 ±1
Preheat 1°C/s-4°C/s to within
100°C of solder temp.
25 mm/s ± 6 mm/s
1
E
CANCELLED
F
CANCELLED
G
CANCELLED
Vapor phase reflow
H
215 ±5
(vapor temp)
60 ±5
1
IR/convection reflow
I
215 ±5
(component temp)
30 ±5
1°C/s-4°C/s; time above 183°C,
90 s - 120 s
3
J
235 ±5
(component temp)
30 ±5
1°C/s-4°C/s; time above 183°C,
90 s - 120 s
3
K
250 ±5
(component temp)
30 ±5
1°C/s-4°C/s; time above 183°C,
90 s - 120 s
3
Test condition E is cancelled; use test condition C.
Test condition F is cancelled; use test condition B.
Test condition G is cancelled.
6
北测（上海）电子科技有限公司
联系方式：xuyj@beice-sh.com 13917165676
MIL-STD-202-210
FIGURE 1. Component lead and mounting examples.
7
北测（上海）电子科技有限公司
联系方式：xuyj@beice-sh.com 13917165676
MIL-STD-202-210
5. DETAILED REQUIREMENTS
5.1 Examinations and measurements. Examinations and measurements to be made before and after the test, as
applicable, shall be as specified in the individual specification. After the procedure, the specimens shall be allowed to
cool and stabilize at room ambient conditions, for the time specified in the individual specification.
5.2 Internal examination. When specified, internal examination of the part shall be made after the test to check for
solder reflow or heat damage.
5.3 Summary The following details are to be specified in the individual specification:
a. The use of heat sinks or shielding is prohibited except when they are part of the component (see 4.1.2).
b. Mounting board, if different from that specified (see 4.1.4).
c. Solder, if different from that specified (see 4.2.1).
d. Flux, if applicable and if different from that specified (see 4.2.2, 4.3.1, and 4.3.3).
e. Solder terminations that are not to be tested, if applicable (see 4.3.4).
f. Special preparation of specimens if applicable (see 4.3.1).
g. Depth of immersion in the molten solder, if different from that specified (see 4.3.4.2).
h. Test condition letter (see 4.3.4).
i. Cooling time prior to final examinations and measurements (see 4.3.4 and 5.1).
j. Examinations and measurements before and after test, as applicable (see 5.1).
k. Method of internal inspection, if required (see 5.2).
8
北测（上海）电子科技有限公司
联系方式：xuyj@beice-sh.com 13917165676