MIL-STD-202H.pdf - 第163页

MI L - S TD - 202 - 210 F O R E W O R D 1. T his standard is a p pr ov ed f or us e by al l D e par t m ent s a nd A genc i es of t he D e par t m en t of Def ense. 2. T his entire stan dar d has bee n r ev i s ed. T hi …

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INCH-POUND
MIL-STD-202-210
18 April 2015
SUPERSEDING
MIL-STD-202G
w/CHANGE 2 (IN PART)
28 June 2013
(see 6.1)
DEPARTMENT OF DEFENSE
TEST METHOD STANDARD
METHOD 210, RESISTANCE TO SOLDERING HEAT
AMSC N/A FSC 59GP
北测（上海）电子科技有限公司
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MIL-STD-202-210
FOREWORD
1. This standard is approved for use by all Departments and Agencies of the Department of Defense.
2. This entire standard has been revised. This revision has resulted in many changes to the format, but the most
significant one is the splitting the document into test methods. See MIL-STD-202 for the change summary.
3. Comments, suggestions, or questions on this document should be emailed to std202@dla.mil or addressed to:
Commander, Defense Logistics Agency, DLA Land and Maritime, ATTN: VAT, P.O. Box 3990, Columbus, OH
43218–3990. Since contact information can change, you may want to verify the currency of this address
information using the ASSIST Online database at https://assist.dla.mil.
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北测（上海）电子科技有限公司
联系方式：xuyj@beice-sh.com 13917165676
MIL-STD-202-210
CONTENTS
PARAGRAPH PAGE
FOREWORD…………………………………………………………. ii
1. SCOPE 1
1.1 Purpose………………………………………….……..…………. 1
2. APPLICABLE DOCUMENTS 1
2.1 Non-Government publications……………………….………… 1
3. DEFINTIONS 1
4. GENERAL REQUIREMENTS 1
4.1 Apparatus………………………..……………….………………. 1
4.1.1 Solder pot.………………………..……………….………………. 1
4.1.2 Heat sinks or shielding.………………………….………………. 1
4.1.3 Fixtures.……………………...…..……………….………………. 1
4.1.4 Mounting board.…….…………..……………….………………. 2
4.1.5 Solder iron ……………….……..……………….………………. 2
4.1.6 Reflow chambers…….……..……..…………….………………. 2
4.1.7 Temperature measurement.…………….…………..…………. 2
4.2 Materials ………………………..……………….…………….…. 2
4.2.1 Solder………………..……………………………………………. 2
4.2.2 Flux………………………………………………………………… 2
4.2.3 VPR fluid……………………………..…………………………… 2
4.3 Procedure…………………..………………..…………………… 2
4.3.1 Special preparation of specimens…..………………….……… 2
4.3.2 Preparation of solder bath..……………………………..……… 2
4.3.3 Application of flux………………………………………………… 2
4.3.4 Test conditions…………………………………………………… 3
4.3.4.1 Test condition A: Solder iron…………………………………... 3
4.3.4.2 Test condition B: Solder dip …………………………………... 3
4.3.4.3 Test condition C: Wave solder - topside board
mount component.……………………………………..………... 4
4.3.4.4 Test condition D: Wave solder - bottomside board
mount product.……………………..…………………..………... 4
4.3.4.5 Test condition H: Vapor phase reflow soldering……..……… 5
4.3.4.6 Test conditions I, J, K: Infared/convection reflow soldering... 5
5. DETAILED REQUIREMENTS 8
5.1 Length of test……………………………………..………………. 8
5.2. Measurements……………………………………..…..…………. 8
5.3 Summary……………………………………………………….… 8
6. NOTES 9
6.1 Supersession data………………………………………………. 9
6.2 Cancelled method…………………………………………….….. 9
FIGURE PAGE
1. Component lead and mounting examples.…………………….……...… 7
TABLE PAGE
1. Test conditions ……………………..………………………………………. 6
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北测（上海）电子科技有限公司
联系方式：xuyj@beice-sh.com 13917165676