IPC-D-279 EN.pdf
IPC-D-279 Design Guidelines for Reliable Surface Mount T echnology Printed Board Assemblies IPC-D-279 July 1996 The Institute for Interconnecting and Packaging Electronic Circuits 2215 Sanders Road Northbrook, Illinois 6…
IPC-D-279
Design Guidelines for Reliable
Surface Mount Technology
Printed Board Assemblies
IPC-D-279
July 1996
The Institute for
Interconnecting
and Packaging
Electronic Circuits
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel
Fax
URL:
847 509.9700
847 509.9798
http://www.ipc.org
The Principles of
Standardization
In May 1995 the IPC’s Technical Activities Executive Committee adopted Prin-
ciples of Standardization as a guiding principle of IPC’s standardization efforts
Standards Should:
• Show relationship to DFM & DFE
• Minimize time to market
• Contain simple (simplified) language
• Just include spec information
• Focus on end product performance
• Include a feed back system on use and problems for future improvement
Standards Should Not:
• Inhibit innovation
• Increase time-to-market
• Keep people out
• Increase cycle time
• Tell you how to make something
• Contain anything that cannot be defended with data
Notice
IPC Standards and Publications are designed to serve the public interest through
eliminating misunderstandings between manufacturers and purchasers, facilitat-
ing interchangeability and improvement of products, and assisting the pur-
chaser in selecting and obtaining with minimum delay the proper product for
his particular need. Existence of such Standards and Publications shall not
in any respect preclude any member or nonmember of IPC from manufacturing
or selling products not conforming to such Standards and Publication, nor
shall the existence of such Standards and Publications preclude their voluntary
use by those other than IPC members, whether the standard is to be used
either domestically or internationally.
Recommended Standards and Publications are adopted by IPC without regard to
whether their adoption may involve patents on articles, materials, or processes.
By such action, IPC does not assume any liability to any patent owner, nor
do they assume any obligation whatever to parties adopting the Recommended
Standard or Publication. Users are also wholly responsible for protecting
themselves against all claims of liabilities for patent infringement.
The material in this standard was developed by the IPC SMT Design Reliability
Task Group (6-10b) of the Product Reliability Committee (6-10) of the Institute
for Interconnecting and Packaging Electronic Circuits.
Copyright © 1996 by the Institute for Interconnecting and Packaging Electronic Circuits. All rights reserved. Published 1996. Printed in the
United States of America.
No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission
of the publisher.
IPC-D-279
Design Guidelines for
Reliable Surface Mount
Technology Printed Board
Assemblies
Developed by the SMT Design Reliability Task Group (6-10b)
of the Product Reliability Committee (6-10) of the Institute for
Interconnecting and Packaging Electronic Circuits
Users of this standard are encouraged to participate in the
development of future revisions.
Contact:
IPC
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel 847 509.9700
Fax 847 509.9798
T
HE
I
NSTITUTE FOR
I
NTERCONNECTING
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ACKAGING
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IRCUITS