IPC-D-279 EN.pdf - 第142页
T echnical Questions The IPC staff will researc h your technical question and atte mpt to find an ap p ro priate sp ecification interpretation o r tec hnical response. Please send your t e c hnical que r y to the t echni…
ANSI/IPC-T-50 Terms and Definitions
for Interconnecting and Packaging Electronic Circuits
Definition Submission/Approval Sheet
The purpose of this form is to keep
current with terms routinely used
in the industry and their definitions.
Individuals or companies are invited
to comment. Please complete this
form and return to:
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
Fax: 847 509.9798
SUBMITTOR INFORMATION:
Name:
Company:
City:
State/Zip:
Telephone:
Date:
❑ This is a NEW term and definition being submitted.
❑ This is an ADDITION to an existing term and definition(s).
❑ This is a CHANGE to an existing definition.
Term Definition
If space not adequate, use reverse side or attach additional sheet(s).
Artwork: ❑ Not Applicable ❑ Required ❑ To be supplied
❑ Included: Electronic File Name:
Document(s) to which this term applies:
Committees affected by this term:
Office Use
IPC Office Committee 2-30
Date Received:
Comments Collated:
Returned for Action:
Revision Inclusion:
Date of Initial Review:
Comment Resolution:
Committee Action: ❑ Accepted ❑ Rejected
❑ Accept Modify
IEC Classification
Classification Code • Serial Number
Terms and Definition Committee Final Approval Authorization:
Committee 2-30 has approved the above term for release in the next revision.
Name:
Committee: Date:
IPC 2-30
T
HE
I
NSTITUTE
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NTERCONNECTING
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C
IRCUITS
Technical Questions
The IPC staff will research your technical question and attempt to find an appropriate specification interpretation or
technical response. Please send your technical query to the technical department via:
tel 847/509-9700 fax 847/509-9798
http://www.ipc.org e-mail: answers@ipc.org
IPC Technical Forums
IPC technical forums are opportunities to network on the Internet. It’s the best way to get the help you need today!
Over 2,500 people are already taking advantage of the excellent peer networking available through e-mail forums
provided by IPC. Members use them to get timely, relevant answers to their technical questions.
TechNet@ipc.org
TechNet forum is for discussion of technical help, comments or questions on IPC specifications, or other technical
inquiries. IPC also uses TechNet to announce meetings, important technical issues, surveys, etc.
ChipNet@ipc.org
ChipNet forum is for discussion of flip chip and related chip scale semiconductor packaging technologies. It is
cosponsored by the National Electronics Manufacturing Initiative (NEMI).
ComplianceNet@ipc.org
ComplianceNet forum covers environmental, safety and related regulations or issues.
DesignerCouncil@ipc.org
Designers Council forum covers information on upcoming IPC Designers Council activities as well as information,
comment,and feedback on current design issues,local chapter meetings, new chapters forming, and other design
topics.
Roadmap@ipc.org
The IPC Roadmap forum is the communication vehicle used by members of the Technical Working Groups (TWGs)
who develop the IPC National Technology Roadmap for Electronic Interconnections.
IPCsm840@ipc.org
This peer networking forum is specific to solder mask qualification and use.
ADMINISTERING YOUR SUBSCRIPTION STATUS:
All commands (such as subscribe and signoff) must be sent to listserv@ipc.org. Please DO NOT send any command to
the mail list address, (i.e.<mail list> @ipc.org), as it would be distributed to all the subscribers.
Example for subscribing: Example for signing off:
To: LISTSERV@IPC.ORG To: LISTSERV@IPC.ORG
Subject: Subject:
Message: subscribe TechNet Joseph H. Smith Message: sign off DesignerCouncil
Please note you must send messages to the mail list address ONLY from the e-mail address
to which you want to apply changes. In other words,if you want to sign off the mail list, you must send the signoff
command from the address that you want removed from the mail list. Many participants find it helpful to signoff a list
when travelling or on vacation and to resubscribe when back in the office.
How to post to a forum:
To send a message to all the people currently subscribed to the list, just send to <mail list>@ipc.org Please note, use
the mail list address that you want to reach in place of the <mail list> string in the above instructions.
Example:
To: TechNet@IPC.ORG
Subject: <your subject>
Message: <your message>
The associated e-mail message text will be distributed to everyone on the list, including the sender. Further
information on how to access previous messages sent to the forums will be provided upon subscribing.
For more information,contact Dmitriy Sklyar
tel 847/509-9700 x311 fax 847/509-9798
e-mail: sklydm@ipc.org http://www.ipc.org/html/forum.htm
IPC World Wide Web Page http://www.ipc.org
Our home page provides access to information about upcoming events, publications and videos, membership, and
industry activities and services. Visit soon and often.
Education and Training
IPC conducts local educational workshops and national conferences to help you better understand emerging
technologies. National conferences have covered Ball Grid Array and Flip Chip/Chip Scale Packaging. Some workshop
topics include:
Printed Wiring Board Fundamentals High Speed Design
Troubleshooting the PWB Manufacturing Process Design for Manufacturability
Choosing the Right Base Material Laminate Design for Assembly
Acceptability of Printed Boards Designers Certification Preparation
New Design Standards
IPC video tapes and CD-ROMs can increase your industry know-how and on the job effectiveness.
For more information on programs, contact John Riley
tel 847/509-9700 ext. 308 fax 847/509-9798
e-mail: rilejo@ipc.org http://www.ipc.org
For more information on IPC Video/CD Training, contact Mark Pritchard
tel 505/758-7937 ext. 202 fax 505/758-7938
e-mail: markp@taos.newmex.com
http://www.ipc.org
Training and Certification
IPC-A-610 Training and Certification Program
“The Acceptability of Electronic Assemblies”(ANSI/IPC-A-610) is the most widely used specification for the PWB
assembly industry. An industry consensus Training and Certification program based on the IPC-A-610 is available to
your company.
For more information,contact John Riley
tel 847/509-9700 ext. 308 fax 847/509-9798
e-mail: rilejo@ipc.org http://www.ipc.org/html/610.htm
IPC Printed Circuits Expo
IPC Printed Circuits Expo is the largest trade exhibition in North America devoted to the PWB industry. Over 90
technical presentations make up this superior technical conference.
For more information, contact Kim Behr
tel 847/509-9700 ext. 319 fax 847/509-9798
e-mail: behrki@ipc.org http://www.ipc.org
How to Get Involved
The first step is to join IPC. An application for membership can be found on page 74.
Once you become a member,the opportunities to enhance your competitiveness are vast. Join a technical committee
and
learn from our industry’s best while you help develop the standards for our industry. Participate in market research
programs which forecast the future of our industry. Participate in Capitol Hill Day and lobby your Congressmen and
Senators for better industry support. Pick from a wide variety of educational opportunities: workshops, tutorials, and
conferences. More up-to-date details on IPC opportunities can be found on our web page: http:/www.ipc.org.
For information on how to get involved, contact:
Jeanette Ferdman, Membership Manager
tel 847/509-9700 ext. 309 fax 847/509-9798
e-mail: JeanetteFerdman@ipc.org http://www.ipc.org
March 16-18, 1999
Long Beach, California
April 28-30, 1998
Long Beach, California