IPC-D-279 EN.pdf - 第43页

Dave S. Steinberg; W iley Interscience, 1991, ISBN 0-471- 52451-4. Chapter 8 addresses combined vibration and ther - mal stresses. T echnology Assessment of Laminates, IPC-T A-720, IPC Materials for High Density Electron…

Microelectronics Packaging Handbook, Rao R. Tummala

and Eugene J. Rymaszewski, Eds.; Van Nostrand Reinhold;

1988; ISBN 0-442-2057-3

Principles of Electronics Packaging, Donald P. Seraphim,

Ronald C. Lasky and Che-Yu Li, Eds.; McGraw-Hill, 1989;

ISBN-0-07-056306-3

also: IPC design publications on Electronic Packaging,

Microwave Circuit

9.7 EMC, High Speed Transients and Electrical Over-

stress

Circuits, Interconnections, and Packaging for VLSI, Bako-

glu, H. B.; Addison Wesley; 1990; ISBN 0-201-06008-6

Decoupling and Layout of Digital Printed Circuits, R. Ken-

neth Keenan; The Keenan Corporation (TKC); September

1987.

Noise Reduction Techniques in Electronic Systems, 2nd

Edition, Henry W. Ott, Wiley Interscience, 1988, ISBN

0-471-85068-3.

Protection of Electronic Circuits from Overvoltages,

Ronald B. Standler; J. Wiley & Sons; 1989; ISBN 0-471-

61121-2

also: IPC design guideline publications on High Frequency

[Microwave on Soft Substrates], Electronic Packaging

Using High-Speed Techniques

9.8 ESD

Electrical Assessment of GaAs Digital Microcircuits,

RADC TR 88-219; October 1988, Hanka, S. A., Schuldt, S.

B., Weed, J. C., et al

Electrostatic Discharge and Electronic Equipment: A Prac-

tical Guide for Designing to Prevent ESD Problems, War-

ren Boxleitner, IEEE Press, 1989, ISBN 0-87942-244-0.

Electrostatic Discharge Control, Owen J. McAteer;

McGraw-Hill; 1990; ISBN 0-07-044838-8

Handbook of ESD Control: The Comprehensive and Sen-

sible Approach, Practical Technologies, Inc.; 1989

ESD Program Management, G. Theodore (Ted) Dangel-

mayer; (AT&T); Van Nostrand Reinhold; 1990; ISBN

0-442-23974-4

ESD from A to Z, John J. Kolyer, Donald E. Watson; Van

Nostrand Reinhold; 1990; ISBN 0-442-00347-1

Protection of Electronic Circuits from Overvoltages,

Ronald B. Standler; J. Wiley & Sons; 1989; ISBN 0-471-

61121-2

Note: see also the resources regarding EMC, above.

9.9 Scanning Acoustic Microscopy

Ultrasonic Testing of Materials, 4th (Fully Revised

English) Edition, Josef Krautkramer and Herbert Krau-

tkramer; Springer-Verlag; 1990 Translation of the 5th

Revised German (1986) Edition

9.10 Plastic Package Cracking

Characterization of Integrated Circuit Packaging Materials,

Moore and McKenna; Butterworth/Heinemann; 1993;

ISBN 0-7506-9267-7

Recommended Procedures for Handling of Moisture Sensi-

tive Plastic IC Packages, ANSI/IPC-SM-786A; IPC (Insti-

tute for Interconnecting and Packaging Electronic Circuits)

9.11 Solder Joint Metallurgy and Etching

Metallography of Tin and Tin Alloys, Pub # 580; Interna-

tional Tin Research Institute; 1982. Metallographic section-

ing, polishing and etching techniques speciﬁc to tin and its

alloys used in solder joints. Photomicrographs are pre-

sented with a note of the etch used.

Metallurgy of Soldered Joints in Electronics, Pub # 708;

International Tin Research Institute; 1990; High quality

photomicrographs on clay stock of sectioned and etched

specimens.

Solder Joint Reliability; John Lau, Editor; Van Nostrand

Reinhold; 1991; ISBN 0-442-00260-2. Chapter 6 contains

photographs of intermetallic compounds and failed joints.

ASTM E407-70, ‘‘Standard Methods for Microetching

Metals and Alloys’’

ASTM E340-68, ‘‘Standard Methods for Macroetching

Metals and Alloys’’

Metallography Principles and Procedures, LECO Corpora-

tion, 1991. Contains a reprint of ASTM E407-70 as well as

ASTM E340-68.

Soldering in SMT Technology # B9-B3741-X-X-7600;

Siemens Aktiengesellschaft; 2/1988; A primer in soldering

with color graphics; SEM photographs on clay stock of

SMT solder joints

Metals Handbook, 9th Edition, Volume 9, Metallography

and Micro-structures, ASM International, 1985, ISBN

087170-015-8 (Volume 10, Materials Characterization, and

Volume 12, Fractography, may also be of value for some

specimens)

also: IPC publications on Microsectioning

9.12 PWA Thermal Design

Thermal Design of Electronic Circuit Boards and Pack-

ages, D.J. Dean; Electrochemical Publications; 1985; ISBN

0-901150-18-5

Unitrode Switching Regulated Power Supply Design Semi-

nar Manual SEM 700, Particularly topic 4: Power Surface

Mount Assembly

Cooling Techniques for Electronic Equipment, 2nd Edition,

July 1996 IPC-D-279

Dave S. Steinberg; Wiley Interscience, 1991, ISBN 0-471-

52451-4. Chapter 8 addresses combined vibration and ther-

mal stresses.

Technology Assessment of Laminates, IPC-TA-720, IPC

Materials for High Density Electronic Packaging and Inter-

connection, National Materials Advisory Board, Commis-

sion on Engineering and Technical Systems, National

Research Council, NMAB-449, April 10, 1990

See also IPC documents on various design aspects.

9.13 Substrate Fabrication Information

Printed Circuits Handbook, 4th Edition, Coombs, C. F., Jr.;

Mc-Graw Hill, Inc.; 1996; ISBN 0-07-012754-9

See also IPC publications on High Speed, Rigid, Flexible,

Single-Sided and Double-Sided Substrates, Solder Mask,

Conformal Coat

9.14 Component Derating, Applications, Qualification

Surface Mount Technology (As It Applies to Capacitors,

Resistors and Magnetics), CARTS; 1988 Seminar Notes,

particularly Section 7.

Components Engineering and Reliability Handbook;

CARTS/Component Technology Institute, Inc.; 1991.

Component Technology and Reliability Revision 2, Fred

Watts; Sav-Soft Products; 1988; See also his Reliability

Prediction Methodologies; 1988

Component Derating, Applications, Qualiﬁcation Ionizing

Radiation Effects in MOS Devices and Circuits, T. P. Ma

and P. V. Dressendorfer, John Wiley and Sons, 1989, ISBN

0 471 84893-X

See also IPC publications on Connectors, Plastic Surface

Mount Components

See also EIA publications on various Passives

See also EIA-J publications on SQFP and TSOP

9.15 Testability, Manufacturability

The Board Designer’s Guide to Testable Logic Circuits,

Colin Maunder, Addison Wesley, 1991, ISBN 0-201-

56513-7

Design for Manufacturability, David M. Anderson, CIM

Press, 1990, ISBN 1-878072-11-0

Design for Manufacture, John Corbett, Mike Dooner, John

Meleka, and Christopher Pym, Addison-Wesley, 1992,

ISBN 0-201-41694-8.

The Design of Testable Logic Circuits, Bennetts, R. G.,

Van Nostrand Reinhold, 1984, ISBN 0-201-14403-4 (Out

of Print, December, 1991)

Design to Test: A Deﬁnitive Guide for Electronic Design,

Manufacture and Service, 2nd Edition, Jon Turino, Van

Nostrand Reinhold, 1990, ISBN 0-442-00170-3

The Effect of Product Design on Product Quality and Prod-

uct Cost , Douglas Daetz, Quality Progress, June 1987, pp

63-67.

Digital Systems Testing and Testable Design, Abramovici,

M., Breuer, M.A., Friedman, A. D., Computer Science

Press, 1990, ISBN 0-7167-8179-4

Engineering Design: Reliability, Maintainability and Test-

ability, James V. Jones, TAB Professional and Reference

Books, 1988, ISBN 0-8306-3151-8

IEEE Standard Testability Bus Deﬁnition

1149.1-1990, IEEE Standard Test-Access Port and

Boundary-Scan Architecture

P1149.1a - deﬁning the extensions/corrections to 1149.1

P1149.2, Extended Digital Serial Subset

P1149.3, Real-Time Parallel Digital Interface

P1149.4, Analog Testability Bus

P1149.5, Test and Maintenance Backplane Bus

Logic Testing and Design-For-Testability, Fujiwara, H.,

MIT Press, 1985, ISBN 0-262-06096-5

Managing Concurrent Engineering: Buying Time to Mar-

ket, Jon Turino, Van Nostrand Reinhold, 1990, ISBN

0-442-00170-3

Reliability and Maintainability Software Tools, December

1991, Robert J. Borgovini, RMST-91, Reliability Analysis

Center, Rome, NY

SMT Design for Testability, James C. Blankenhorn, SMT-

Plus

Structured Logic Testing, Eichelberger, E. B., Lindbloom,

E., Waicukauski, J.D., Williams, T.W., Prentice Hall, 1991,

ISBN 0-13-853680-5

Survey of Reliability, Maintainability, Supportability and

Testability Software Tools, Joseph A. Caroli, RL TR 91-87,

April 1991, AD-A236 148, NTIS

Testability Design and Assessment Tools, December 1991,

Richard Unkle, CRTA-TEST, Reliability Analysis Center,

Rome Laboratory, P.O. Box 4700, Rome, NY 08200

Testability Guidelines, TP-101A, Surface Mount Technol-

ogy Association (SMTA), August 1991

Testability Design, ADL-STD-70-001A, 7 March 1983,

Litton Amecom

Testability/Diagnostics Design Encyclopedia, George Neu-

mann, George Barthlenghi, et al, RADC TR 90 239, Sep-

tember 1990, AD-A230 067, NTIS

See also IPC documents on Electrical Testing,

Surface Mount Land Patterns/Conﬁgurations and Design

Rules

9.16 Vibration, Shock

Vibration Analysis for Electronic Equipment, 2nd Edition,

Dave S. Steinberg; J. Wiley & Sons 1989

IPC-D-279 July 1996

Cooling Techniques for Electronic Equipment, 2nd Edition,

Dave S. Steinberg; Wiley Interscience, 1991, ISBN 0-471-

52451-4. Chapter 8 addresses combined vibration and ther-

mal stresses.

Shock and Vibration, 3rd Edition, Cyril M. Harris, Editor,

McGraw-Hill, 1987 ISBN 0-070026801-0

Structural Analysis of Printed Circuit Board Systems, Peter

A. Engel, Springer-Verlag, 1993, ISBN 0-387-97939-5 or

3-540-97939-5

9.17 Accelerated Life Testing

Electronic Materials Handbook, Volume 1, Packaging,

ASM International; 1989; ISBN 0-87170-285-1 (V.1)

Applied Life Data Analysis, Nelson, W., John Wiley &

Sons, NY, 1982 ISBN 0-070026801-0

Accelerated Testing: Statistical Models, Test Plans, and

Data Analyses, Wayne Nelson; John Wiley & Sons, 1990;

ISBN 0471-552-775

Accelerated Testing Handbook, Technology Associates,

1987

Applied Reliability, Tobias, P. A., and Trindade, D., Van

Nostrand Reinhold, 1985, ISBN-0-442-28310-5

‘‘How to Plan and Analyze Accelerated Tests’’, 1900.

ASQC Basic References in Quality Control: Statistical

Techniques, Order Entry Dept., American Society for Qual-

ity Control, 310 Wisconsin Avenue, Milwaukee, WI 53203

(800) 952-6587

‘‘How to Analyze Reliability Data’’, Volume 6, 1983,

ASQC as above.

See also IPC publication on Accelerated Reliability Testing

of Surface Mount Solder Attachments

9.18 Solder, Solderability, Soldered Assembly Quality

See ANSI/IPC J-STD publications on various Solder, Sol-

derability, Solder Assembly Quality

9.19 Solder Mask and Conformal Coating

Contamination Effects on Electronic Products, Carl J. Taut-

scher, Marcel Dekker, 1991

Electronic Materials Handbook, Volume 1, Packaging,

Merrill L. Minges, Technical Chairman, ASM Interna-

tional, 1989; see particularly sections 6, 7 and 9.

See also IPC documents on Solder Mask, Conformal Coat-

ing, SIR, IR, Cleaning, Surface Mount Land Patterns/

Conﬁgurations and Design Rules

9.20 General Reliability

AT&T Reliability Manual, Klinger, Nakada and Menendez

Editors, VNR, 1990, ISBN 0-442-31848-0.

Handbook of Reliability Engineering and Management,

2nd Edition Ireson, Coombs and Moss, Editors, McGraw-

Hill, 1996, ISBN 0-07-012750-6

Practical Reliability Engineering, 3rd Edition, Patrick D. T.

O’Connor, John Wiley & Sons, 1995, ISBN 0-471-96025

Handbook of Electromechanical Product Design, P. L. Hur-

ricks, Longman Scientiﬁc & Technical, 1994, ISBN 0-470-

04083-3

July 1996 IPC-D-279