IPC-D-279 EN.pdf - 第140页
Standard Improvement Form IPC-D-279 The purpose of this form is to provide the T echnical Committee of IPC with input from the industry regarding usage of the subject standard. Individuals or companies are invited to sub…
MLCC Multilayer Chip Capacitor
MOS Metal Oxide Semiconductor
MTTF Mean Time to Failure
NASA* National Aeronautics and Space Adminstra-
tion
NBC* Nuclear, Biological, Chemical (Warfare)
NF* Noise Figure
NPO* Capacitor Temperature Characteristic
NSMD* Non-Solder Mask Defined
NTF No Trouble Found
PBGA Plastic Ball Grid Array
PC* Polycarbonate
PET* Polyethylene terephtalate
PGA Pin Grid Array
PIND* Particle Inpact Noise Detection
PLA* Programmable Logic Array
PLCC Plastic Leaded Chip Carrier
P/P Pick and Place
PPO* Polyphenylene Oxide
PS* Polystyrene
PSMC Plastic Surface Mount Component
PTFE* Polytetrafluoroethylene
PTH Plated Through Hole
PTV Plated (Through Hole) Vias
PWA Printed Wiring Assembly
PWB Printed Wiring Board
PUR* Polyurethane
PVC* Polyvinyl chloride
PVDF* Polyvinyldiene Fluoride
QFD* Quality Function Deployment
R Rosin (Flux)
RAM Random Access Memory
RFI* Radio Frequency Interference
RH Relative Humidity
RMA Rosin, mildly activated
ROM Read Only Memory
SAW* Surface Acoustic Wave
SCR* Silicon Controlled Rectifier
SEB* Single Event Burnout
SEGR* Single Event Gate Rupture
SEL* Single Event Latchup
SEM* Scanning Electron Microscope
SEP* Single Event Phenomen(a, on)
SES* Single Event Snapback
SEU* Single Event Upset
SIR Surface Insulation Resistance
SM Surface Mount, Solder Mask
SMD Surface Mount Device, Solder Mask
Defined
SMT Surface Mount Technology
SOIC Small Outline Integrated Circuit (package)
SOT Small Outline Transistor (package)
TAB Tape Automated Bonding
T
a
* Ambient Temperature
T
BL
* Temperature rise, boundary layer
T
CA
* Temperature rise, cooling agent
TCR Temperature Coefficient of Resistance
TFC* Thin Film Cracking
T
g
Glass Transition Temperature
TH Through Hole
T
j
Junction Temperature
T
m
* Melting Temperature
TML* Total Mass Loss (outgassing)
T
P
* Temperature rise, inside device package
TQFP Thin Quad Flat Pack(age)
TSOP Thin Small Outline Package
TTM Time to Market
T
TW
Temperature rise, thermal wake
U/S* Ultrasonic
UUT* Unit Under Test
UV Ultraviolet
VCM* Volatile Condensible Material
VHSIC* Very High Speed Integrated Circuit
XFP Extra Fine Pitch
X7R* Capacitor Temperature Characteristic
Z5U* Capacitor Temperature Characteristic
IPC-D-279 July 1996
128
Standard Improvement Form IPC-D-279
The purpose of this form is to provide the
Technical Committee of IPC with input
from the industry regarding usage of
the subject standard.
Individuals or companies are invited to
submit comments to IPC. All comments
will be collected and dispersed to the
appropriate committee(s).
If you can provide input, please complete
this form and return to:
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
Fax 847 509.9798
1. I recommend changes to the following:
Requirement, paragraph number
Test Method number , paragraph number
The referenced paragraph number has proven to be:
Unclear Too Rigid In Error
Other
2. Recommendations for correction:
3. Other suggestions for document improvement:
Submitted by:
Name Telephone
Company
Address
City/State/Zip Date
ANSI/IPC-T-50 Terms and Definitions
for Interconnecting and Packaging Electronic Circuits
Definition Submission/Approval Sheet
The purpose of this form is to keep
current with terms routinely used
in the industry and their definitions.
Individuals or companies are invited
to comment. Please complete this
form and return to:
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
Fax: 847 509.9798
SUBMITTOR INFORMATION:
Name:
Company:
City:
State/Zip:
Telephone:
Date:
❑ This is a NEW term and definition being submitted.
❑ This is an ADDITION to an existing term and definition(s).
❑ This is a CHANGE to an existing definition.
Term Definition
If space not adequate, use reverse side or attach additional sheet(s).
Artwork: ❑ Not Applicable ❑ Required ❑ To be supplied
❑ Included: Electronic File Name:
Document(s) to which this term applies:
Committees affected by this term:
Office Use
IPC Office Committee 2-30
Date Received:
Comments Collated:
Returned for Action:
Revision Inclusion:
Date of Initial Review:
Comment Resolution:
Committee Action: ❑ Accepted ❑ Rejected
❑ Accept Modify
IEC Classification
Classification Code • Serial Number
Terms and Definition Committee Final Approval Authorization:
Committee 2-30 has approved the above term for release in the next revision.
Name:
Committee: Date:
IPC 2-30
T
HE
I
NSTITUTE
FOR
I
NTERCONNECTING
AND
P
ACKAGING
E
LECTRONIC
C
IRCUITS