IPC-D-279 EN.pdf - 第3页
IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies Developed by the SMT Design Reliability T ask Group (6-10b) of the Product Reliability Committee (6-10) of the Institute for Inte…
The Principles of
Standardization
In May 1995 the IPC’s Technical Activities Executive Committee adopted Prin-
ciples of Standardization as a guiding principle of IPC’s standardization efforts
Standards Should:
• Show relationship to DFM & DFE
• Minimize time to market
• Contain simple (simplified) language
• Just include spec information
• Focus on end product performance
• Include a feed back system on use and problems for future improvement
Standards Should Not:
• Inhibit innovation
• Increase time-to-market
• Keep people out
• Increase cycle time
• Tell you how to make something
• Contain anything that cannot be defended with data
Notice
IPC Standards and Publications are designed to serve the public interest through
eliminating misunderstandings between manufacturers and purchasers, facilitat-
ing interchangeability and improvement of products, and assisting the pur-
chaser in selecting and obtaining with minimum delay the proper product for
his particular need. Existence of such Standards and Publications shall not
in any respect preclude any member or nonmember of IPC from manufacturing
or selling products not conforming to such Standards and Publication, nor
shall the existence of such Standards and Publications preclude their voluntary
use by those other than IPC members, whether the standard is to be used
either domestically or internationally.
Recommended Standards and Publications are adopted by IPC without regard to
whether their adoption may involve patents on articles, materials, or processes.
By such action, IPC does not assume any liability to any patent owner, nor
do they assume any obligation whatever to parties adopting the Recommended
Standard or Publication. Users are also wholly responsible for protecting
themselves against all claims of liabilities for patent infringement.
The material in this standard was developed by the IPC SMT Design Reliability
Task Group (6-10b) of the Product Reliability Committee (6-10) of the Institute
for Interconnecting and Packaging Electronic Circuits.
Copyright © 1996 by the Institute for Interconnecting and Packaging Electronic Circuits. All rights reserved. Published 1996. Printed in the
United States of America.
No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission
of the publisher.
IPC-D-279
Design Guidelines for
Reliable Surface Mount
Technology Printed Board
Assemblies
Developed by the SMT Design Reliability Task Group (6-10b)
of the Product Reliability Committee (6-10) of the Institute for
Interconnecting and Packaging Electronic Circuits
Users of this standard are encouraged to participate in the
development of future revisions.
Contact:
IPC
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel 847 509.9700
Fax 847 509.9798
T
HE
I
NSTITUTE FOR
I
NTERCONNECTING
AND
P
ACKAGING
E
LECTRONIC
C
IRCUITS
Acknowledgment
Any Standard involving a complex
technology draws material from a
vast number of sources. While the
principal members of the SMT
Design Reliability Task Group of the
Product Reliability Committee are
shown below, it is not possible to
include all of those who assisted in the
evolution of this standard. To each of
them, the members of the IPC extend
their gratitude.
Product Reliability
Committee
SMT Design Reliability
Task Group
Technical Liaison of the
IPC Board of Directors
Chair
Werner Engelmaier
Engelmaier Assoc., Inc.
Chairs
Nick Virmani
Unisys-NASA/Goddard
Space Flight Center
and Ed Aoki
Hewlett-Packard Company
Stephen Wohlgemuth
Photocircuits
SMT Design Reliability Task Group
Amick, Patricia, McDonnell Douglas
Aerospace
Aoki, Edward Masami, Hewlett
Packard Laboratories
Barela, Phillip, Jet Propulsion
Laboratory
Bevan, Matthew, Johns Hopkins
University
Branch, Howard, Smiths Industries
Bright, Burton, Adtran Inc.
Burg, John, 3M Company
Burt, Ronald, Jet Propulsion Laboratory
Carroll, Thomas, Hughes Aircraft Co.
Clifton, Lori, Hewlett Packard Co.
Collins, Henry, Amp Inc.
Colokathis, Elaine, Exotic Plating Lab
Inc.
Croce, Samuel, Litton Aero Products
Division
Currier, Charles, Ambitech Inc.
Currier, Dal, Ambitech Inc.
DiFranza, Michele, The Mitre Corp.
Dunn, Barrie, European Space Agency
Dunn, Linda, Compaq Computer
Corporation
Engelmaier, Werner, Engelmaier
Associates Inc.
Gandhi, Mahendra, Hughes Aircraft Co.
Gonzalez, Constantino, ACME Assembly
Contract Manufacturing Engineering
Gray, Foster, Texas Instruments Inc.
Grosskopf, Curtis, IBM Corp.
Harford, Lyle, Texas Instruments Inc.
Hawken, David, IBM Corp./Endicott
Electronic Packaging
Hersey, Ralph, Lawrence Livermore
National Lab
Hinton, Phillip, Hinton PWB
Engineering
Hymes, Les, Les Hymes Associates
Johnson, Kathryn, Hexacon Electric
Company
Kotecki, George, Northrop Grumman
Corporation
Long, Andrea, Lucent Technologies Inc.
Maguire, James, Boeing Defense &
Space Group
McCluskey, Patrick, University of
Maryland
Moffitt, James, EMPF
Nelson, David, Adtran Inc.
Nicewarner, Earl, Orbital Sciences
Corporation
Officer, R. Bruce, Sanders, A Lockheed
Martin Co.
Olsen, Richard, Continental Circuits
Corp.
Payne, Ron, Olin Aerospace Company
Pepersack, Cindy, NASA/Goddard
Space Flight Center
Reddy, Srirama, AT&T Interconnect
Center of Excellence
Redinger, Vicki, EFW Inc.
Rietdorf, Bruce, Hughes Defense
Communications
Robb, Jeff, Lockheed Martin
Astronautics
Rosser, Jerald, Hughes Missile Systems
Co.
Rumps, Don, Lucent Technologies Inc.
Samples, Wesley, EFW Inc.
Saunders, Penny, NASA Johnson Space
Center
Savage, Robert, The Bergquist
Company
Smith, E. Lon, Lucent Technologies
Inc.
Solberg, Vern, Tessera Inc.
Virmani, Nick, NASA/Goddard Space
Flight Center
Wasler, David, Jet Propulsion
Laboratory
Witzman, Sorin, NORTEL
Special Note of Appreciation
A special note of appreciation goes to the following principle members of the committee who initiated and contributed
significantly to make this document possible.
Vern Solberg, Tessera
Werner Engelmaier, Engelmaier Associates
IPC-D-279 July 1996
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