IPC-D-279 EN.pdf - 第42页

Microelectronics Packaging Handbook, Rao R. T ummala and Eugene J. R ymaszewski, Eds.; V an Nostrand Reinhold; 1988; ISBN 0-442-2057-3 Principles of Electronics Packaging, Donald P . Seraphim, Ronald C. Lasky and Che-Y u…

Substrates:

Rigid Boards and Rigid Board Assemblies

Flexible Boards and Flexible Board Assemblies

Metal Core Boards

Process Parameters:

Statistical Process Control:

Process Control and Troubleshooting

Connectors and I/O Interconnection Adhesives:

Thermally conductive

Insulative (Structural)

Electrically conductive

Films (Bonding)

Assembly Design:

Printed Board Component Mounting

Surface Mount Land Patterns (Conﬁgurations and Design

Rules)

9.2 SMT Soldering Process Technical Details

Soldering in Electronics, 2nd Edition, R. J. Klein-Wassink;

Electrochemical Publications; Ayr, Scotland; 1989; ISBN

0-9011-50-24-X

A Scientiﬁc Guide to Surface Mount Technology, Colin

Lea; Electrochemical Publications; Ayr, Scotland; 1988;

ISBN 0-901150-22-3

Solder Joint Reliability, John Lau, Editor; Van Nostrand

Reinhold; 1991; ISBN 0-442-00260-2

IPC-VT-33 Introduction to Surface Mount Assembly, video

tape, the Institute for Interconnecting and Packaging Elec-

tronic Circuits, 2215 Sanders Road, Northbrook, IL 60062-

6135, 29 min. w/hard copy.

IPC-VT-713 Surface Mount Solder Joint Evaluation - Part

1, video tape, the Institute for Interconnecting and Packag-

ing Electronic Circuits, 2215 Sanders Road, Northbrook,

IL 60062-6135, 29 min. w/hard copy.

IPC-VT-72 Surface Mount Solder Joint Evaluation - Part 2

Rectangular Chip Components, video tape, the Institute for

Interconnecting and Packaging Electronic Circuits, 2215

Sanders Road, Northbrook, IL 60062-6135, 33 min. w/hard

copy.

IPC-VT-73 Surface Mount Solder Joint Evaluation - Part 3

Bottom-Only and MELFS, video tape, the Institute for

Interconnecting and Packaging Electronic Circuits, 2215

Sanders Road, Northbrook, IL 60062-6135, 25 min. w/hard

copy.

IPC-VT-74 Surface Mount Solder Joint Evaluation - Part 4

Gull Wing Components, video tape, the Institute for Inter-

connecting and Packaging Electronic Circuits, 2215 Sand-

ers Road, Northbrook, IL 60062-6135, 27 min. w/hard

copy.

IPC-VT-75 Surface Mount Solder Joint Evaluation - Part 5

J-Lead Components, video tape, the Institute for Intercon-

necting and Packaging Electronic Circuits, 2215 Sanders

Road, Northbrook, IL 60062-6135, 23 min. w/hard copy.

IPC-VT-91 Introduction to Surface Mount Rework - Part 1,

video tape, the Institute for Interconnecting and Packaging

Electronic Circuits, 2215 Sanders Road, Northbrook, IL

60062-6135, 25 min. w/hard copy.

IPC-VT-92 Rework of Surface Mount Chip Components,

video tape, the Institute for Interconnecting and Packaging

Electronic Circuits, 2215 Sanders Road, Northbrook, IL

60062-6135, 50 min. w/hard copy.

also: IPC publications on the Soldering Process, Assembly

Acceptability, Quality, Training, Inspection, Testing,

Repair, Cleaning, Troubleshooting

9.3 SMT Solder Paste

Solder Paste Technology: Principles and Applications,

Colin Johnson and Joseph Kevra (Alpha Metals); TAB

Publications; ISBN 0-8306-3203-4; 1989

Solder Paste in Electronics Packaging, Jennie S. Hwang;

Van Nostrand Reinhold; 1989; ISBN 0-44-20754-9

also: IPC Publications on Accelerated Surface Mount

Attachment Reliability Testing, Solder Paste Performance

and Solder Paste Requirements.

9.4 SMT Cleaning

Cleaning and Contamination of Electronics Components

and Assemblies, Brian N. Ellis; ElectroChemical Publica-

tions; 1986; ISBN 0-901150-20-7

Cleaning Printed Wiring Assemblies in Today’s Environ-

ment, Les Hymes, Editor; Van Nostrand Reinhold; 1991;

ISBN 0-442-00275-0

also: IPC Publications on Aqueous and Semi-Aqueous

Cleaning, Preventing Electrically Induced Failures (Elec-

tromigration) in Printed Wiring Assemblies, Cleaning and

Cleanliness, SIR Tests and Measurements.

9.5 Solder Joint Reliability

Solder Joint Reliability, John Lau, Editor; Van Nostrand

Reinhold; 1991; ISBN 0-442-00260-2

Electronic Materials Handbook, Volume 1, Packaging,

ASM International; 1989; ISBN 0-87170-285-1 (V.1)

Cooling Techniques for Electronic Equipment, 2nd Edition,

Dave S. Steinberg; Wiley Interscience, 1991, ISBN 0-471-

52451-4. Chapter 7 addresses thermal stresses in lead

wires, solder joints and plated-through holes.

also: IPC Publications on Accelerated Surface Mount

Attachment Reliability Testing

9.6 Design of Electronic Packages and Packaging

Plastic Packaging of Microelectronic Device, Manzione,

Louis T.; Van Nostrand Reinhold; 1990; ISBN 0-442-

23494-5

IPC-D-279 July 1996

Microelectronics Packaging Handbook, Rao R. Tummala

and Eugene J. Rymaszewski, Eds.; Van Nostrand Reinhold;

1988; ISBN 0-442-2057-3

Principles of Electronics Packaging, Donald P. Seraphim,

Ronald C. Lasky and Che-Yu Li, Eds.; McGraw-Hill, 1989;

ISBN-0-07-056306-3

also: IPC design publications on Electronic Packaging,

Microwave Circuit

9.7 EMC, High Speed Transients and Electrical Over-

stress

Circuits, Interconnections, and Packaging for VLSI, Bako-

glu, H. B.; Addison Wesley; 1990; ISBN 0-201-06008-6

Decoupling and Layout of Digital Printed Circuits, R. Ken-

neth Keenan; The Keenan Corporation (TKC); September

1987.

Noise Reduction Techniques in Electronic Systems, 2nd

Edition, Henry W. Ott, Wiley Interscience, 1988, ISBN

0-471-85068-3.

Protection of Electronic Circuits from Overvoltages,

Ronald B. Standler; J. Wiley & Sons; 1989; ISBN 0-471-

61121-2

also: IPC design guideline publications on High Frequency

[Microwave on Soft Substrates], Electronic Packaging

Using High-Speed Techniques

9.8 ESD

Electrical Assessment of GaAs Digital Microcircuits,

RADC TR 88-219; October 1988, Hanka, S. A., Schuldt, S.

B., Weed, J. C., et al

Electrostatic Discharge and Electronic Equipment: A Prac-

tical Guide for Designing to Prevent ESD Problems, War-

ren Boxleitner, IEEE Press, 1989, ISBN 0-87942-244-0.

Electrostatic Discharge Control, Owen J. McAteer;

McGraw-Hill; 1990; ISBN 0-07-044838-8

Handbook of ESD Control: The Comprehensive and Sen-

sible Approach, Practical Technologies, Inc.; 1989

ESD Program Management, G. Theodore (Ted) Dangel-

mayer; (AT&T); Van Nostrand Reinhold; 1990; ISBN

0-442-23974-4

ESD from A to Z, John J. Kolyer, Donald E. Watson; Van

Nostrand Reinhold; 1990; ISBN 0-442-00347-1

Protection of Electronic Circuits from Overvoltages,

Ronald B. Standler; J. Wiley & Sons; 1989; ISBN 0-471-

61121-2

Note: see also the resources regarding EMC, above.

9.9 Scanning Acoustic Microscopy

Ultrasonic Testing of Materials, 4th (Fully Revised

English) Edition, Josef Krautkramer and Herbert Krau-

tkramer; Springer-Verlag; 1990 Translation of the 5th

Revised German (1986) Edition

9.10 Plastic Package Cracking

Characterization of Integrated Circuit Packaging Materials,

Moore and McKenna; Butterworth/Heinemann; 1993;

ISBN 0-7506-9267-7

Recommended Procedures for Handling of Moisture Sensi-

tive Plastic IC Packages, ANSI/IPC-SM-786A; IPC (Insti-

tute for Interconnecting and Packaging Electronic Circuits)

9.11 Solder Joint Metallurgy and Etching

Metallography of Tin and Tin Alloys, Pub # 580; Interna-

tional Tin Research Institute; 1982. Metallographic section-

ing, polishing and etching techniques speciﬁc to tin and its

alloys used in solder joints. Photomicrographs are pre-

sented with a note of the etch used.

Metallurgy of Soldered Joints in Electronics, Pub # 708;

International Tin Research Institute; 1990; High quality

photomicrographs on clay stock of sectioned and etched

specimens.

Solder Joint Reliability; John Lau, Editor; Van Nostrand

Reinhold; 1991; ISBN 0-442-00260-2. Chapter 6 contains

photographs of intermetallic compounds and failed joints.

ASTM E407-70, ‘‘Standard Methods for Microetching

Metals and Alloys’’

ASTM E340-68, ‘‘Standard Methods for Macroetching

Metals and Alloys’’

Metallography Principles and Procedures, LECO Corpora-

tion, 1991. Contains a reprint of ASTM E407-70 as well as

ASTM E340-68.

Soldering in SMT Technology # B9-B3741-X-X-7600;

Siemens Aktiengesellschaft; 2/1988; A primer in soldering

with color graphics; SEM photographs on clay stock of

SMT solder joints

Metals Handbook, 9th Edition, Volume 9, Metallography

and Micro-structures, ASM International, 1985, ISBN

087170-015-8 (Volume 10, Materials Characterization, and

Volume 12, Fractography, may also be of value for some

specimens)

also: IPC publications on Microsectioning

9.12 PWA Thermal Design

Thermal Design of Electronic Circuit Boards and Pack-

ages, D.J. Dean; Electrochemical Publications; 1985; ISBN

0-901150-18-5

Unitrode Switching Regulated Power Supply Design Semi-

nar Manual SEM 700, Particularly topic 4: Power Surface

Mount Assembly

Cooling Techniques for Electronic Equipment, 2nd Edition,

July 1996 IPC-D-279

Dave S. Steinberg; Wiley Interscience, 1991, ISBN 0-471-

52451-4. Chapter 8 addresses combined vibration and ther-

mal stresses.

Technology Assessment of Laminates, IPC-TA-720, IPC

Materials for High Density Electronic Packaging and Inter-

connection, National Materials Advisory Board, Commis-

sion on Engineering and Technical Systems, National

Research Council, NMAB-449, April 10, 1990

See also IPC documents on various design aspects.

9.13 Substrate Fabrication Information

Printed Circuits Handbook, 4th Edition, Coombs, C. F., Jr.;

Mc-Graw Hill, Inc.; 1996; ISBN 0-07-012754-9

See also IPC publications on High Speed, Rigid, Flexible,

Single-Sided and Double-Sided Substrates, Solder Mask,

Conformal Coat

9.14 Component Derating, Applications, Qualification

Surface Mount Technology (As It Applies to Capacitors,

Resistors and Magnetics), CARTS; 1988 Seminar Notes,

particularly Section 7.

Components Engineering and Reliability Handbook;

CARTS/Component Technology Institute, Inc.; 1991.

Component Technology and Reliability Revision 2, Fred

Watts; Sav-Soft Products; 1988; See also his Reliability

Prediction Methodologies; 1988

Component Derating, Applications, Qualiﬁcation Ionizing

Radiation Effects in MOS Devices and Circuits, T. P. Ma

and P. V. Dressendorfer, John Wiley and Sons, 1989, ISBN

0 471 84893-X

See also IPC publications on Connectors, Plastic Surface

Mount Components

See also EIA publications on various Passives

See also EIA-J publications on SQFP and TSOP

9.15 Testability, Manufacturability

The Board Designer’s Guide to Testable Logic Circuits,

Colin Maunder, Addison Wesley, 1991, ISBN 0-201-

56513-7

Design for Manufacturability, David M. Anderson, CIM

Press, 1990, ISBN 1-878072-11-0

Design for Manufacture, John Corbett, Mike Dooner, John

Meleka, and Christopher Pym, Addison-Wesley, 1992,

ISBN 0-201-41694-8.

The Design of Testable Logic Circuits, Bennetts, R. G.,

Van Nostrand Reinhold, 1984, ISBN 0-201-14403-4 (Out

of Print, December, 1991)

Design to Test: A Deﬁnitive Guide for Electronic Design,

Manufacture and Service, 2nd Edition, Jon Turino, Van

Nostrand Reinhold, 1990, ISBN 0-442-00170-3

The Effect of Product Design on Product Quality and Prod-

uct Cost , Douglas Daetz, Quality Progress, June 1987, pp

63-67.

Digital Systems Testing and Testable Design, Abramovici,

M., Breuer, M.A., Friedman, A. D., Computer Science

Press, 1990, ISBN 0-7167-8179-4

Engineering Design: Reliability, Maintainability and Test-

ability, James V. Jones, TAB Professional and Reference

Books, 1988, ISBN 0-8306-3151-8

IEEE Standard Testability Bus Deﬁnition

1149.1-1990, IEEE Standard Test-Access Port and

Boundary-Scan Architecture

P1149.1a - deﬁning the extensions/corrections to 1149.1

P1149.2, Extended Digital Serial Subset

P1149.3, Real-Time Parallel Digital Interface

P1149.4, Analog Testability Bus

P1149.5, Test and Maintenance Backplane Bus

Logic Testing and Design-For-Testability, Fujiwara, H.,

MIT Press, 1985, ISBN 0-262-06096-5

Managing Concurrent Engineering: Buying Time to Mar-

ket, Jon Turino, Van Nostrand Reinhold, 1990, ISBN

0-442-00170-3

Reliability and Maintainability Software Tools, December

1991, Robert J. Borgovini, RMST-91, Reliability Analysis

Center, Rome, NY

SMT Design for Testability, James C. Blankenhorn, SMT-

Plus

Structured Logic Testing, Eichelberger, E. B., Lindbloom,

E., Waicukauski, J.D., Williams, T.W., Prentice Hall, 1991,

ISBN 0-13-853680-5

Survey of Reliability, Maintainability, Supportability and

Testability Software Tools, Joseph A. Caroli, RL TR 91-87,

April 1991, AD-A236 148, NTIS

Testability Design and Assessment Tools, December 1991,

Richard Unkle, CRTA-TEST, Reliability Analysis Center,

Rome Laboratory, P.O. Box 4700, Rome, NY 08200

Testability Guidelines, TP-101A, Surface Mount Technol-

ogy Association (SMTA), August 1991

Testability Design, ADL-STD-70-001A, 7 March 1983,

Litton Amecom

Testability/Diagnostics Design Encyclopedia, George Neu-

mann, George Barthlenghi, et al, RADC TR 90 239, Sep-

tember 1990, AD-A230 067, NTIS

See also IPC documents on Electrical Testing,

Surface Mount Land Patterns/Conﬁgurations and Design

Rules

9.16 Vibration, Shock

Vibration Analysis for Electronic Equipment, 2nd Edition,

Dave S. Steinberg; J. Wiley & Sons 1989

IPC-D-279 July 1996