N7201A654E.pdf - 第18页

NPM- TT2 EJM1EE-MB-01 T-01 What if Troubleshooting 1-1-2 Placement er ror 2 1-1-2 -3 Problem Cause Check/Solution Referen ce Wrong placement Nozzle error Supply unit (feeder or tray) setting error or defect Pickup co ndi…

NPM-TT2 EJM1EE-MB-01T-01

1-1-2-2

Problem Cause

Check/Solution Reference

What if

Nozzle error

Error in setting the

height of the placed

component

(interference with the

placed component)

Pickup condition

error

Tape splicing error

Supply unit (feeder

or tray) setting

error or defect

PCB support setting

error

recognition mark

recognition error

Component data

error

Placement

condition error

Solder printing

condition error

(screen printer)

Recognition error

(misalignment, tilt)

1.Check the recognition image

(center and tilt) and an image of

an electrode. Adjust if necessary.

2.If the cover glass of the line

camera is contaminated, wipe it off.

recognition mark

recognition error

Solder printing

condition error

(screen printer)

DGS

Programming

Manual

1.Adjust if the recognition mark

setting (coordinate, shape and

imensions) s incorrect.

2.Correct the PCB stop position if

is aligned.

(e.g., check the length f the

placed component extending ff

the board)

Check the printing condition and

adjust the screen printer.

See 1-1-1-2

[Pickup error, Stand pickup]

1-1-1-1 to 1-1-1-2

See [Cannot pickup]

See 1-1-2-1 to 1-1-2-2

[Misaligned placement]

Component

missing

Misaligned

placement

NPM-TT2 EJM1EE-MB-01T-01

What if

Troubleshooting

1-1-2

Placement error 2

1-1-2-3

Problem Cause

Check/Solution Reference

Wrong placement

Nozzle error

Supply unit (feeder

or tray) setting

error or defect

Pickup condition

error

PCB support

recognition mark

recognition error

Component data

error

Placement

condition error

Solder printing

condition error

(screen printer)

Component

ejection error

PCB recognition

mark data error

Error in setting the

length of the placed

component extending

off the board

The PCB

recognition mark is

contaminated

PCB recognition

error

DGS

Programming

Manual

Operating

procedure

4-1-2

1.Check the setting value

(applicable value: 0.13 to

0.14MPa) of the cleaning blow

pressure. If it is not within the

value, modify the pressure.

2.Check the nozzle contamination.

If contaminated, clean the nozzle.

Check the length of the placed

component extending off the

board.

Maintenance

4-1-1, 6-4

See 1-1-1-2

[Pickup error, Stand pickup]

1-1-1-1 to 1-1-1-2

See [Cannot pickup]

1-1-1-1 to 1-1-1-2

See [Cannot pickup]

Check for misfeeding of

components, and be sure to mount

correct components.

Operating

procedure

2-4-1

See 1-1-2-1 to 1-1-2-2

[Misaligned placement]

Check and adjust the PCB

recognition data (shape set) as

necessary.

Turn OFF the servo switch,

remove the PCB, and clean the

recognition mark.

NPM-TT2 EJM1EE-MB-01T-01

What if

Troubleshooting

1-1-3

Transfer error

1-1-3-1

Problem Cause

Check/Solution Reference

What if

The PCB detection

sensor on the

conveyor does not

detect the PCB.

(There is a cutout or

a slit at a detection

point.)

Error in setting the

length of the placed

component extending

off the board

The PCB detection

sensor on the

upstream process

conveyor does not

detect the PCB.

Two PCBs are

loaded.

The PCB stays on

the conveyor.

The PCB stays on

the entrance of the

upstream process.

PCB transfer error

A belt or a guide is

contaminated.

The PCB detection

sensor on the

conveyor detects

the PCB although it

does not exist.

PCB loading error

The PCB request

signal of the

downstream

process does not

turn OFF within

the PCB unloading

waiting time

PCB unloading

error

Operating

procedure

4-1-2

Maintenance

6-5

Maintenance

6-9

Maintenance

6-9

Check the slit size of the PCB.

(Use within the limit of the notch

allowable dimension.)

1.Check the alignment of the

conveyor coupling to the

downstream process. If

necessary, adjust it.

2.Check the belt or the guide. If it is

contaminated, wipe it off.

Check the length of the placed

component extending off the

board.

Clean the belt or the guide.

Check the sensor for

contamination. If contaminated

wipe it off.

Check the PCB unloading signal

(BA signal) of the upstream

process. Adjust as necessary.

1.Check the alignment of the

conveyor coupling to the

upstream process. If necessary,

adjust the alignment.

2.Check the belt or the guide. If it is

contaminated, wipe it off.

Check the sensor for

contamination.

If contaminated wipe it off.

Check the PCB request signal

(READY signal) of the downstream

Process output.

Check the PCB unloading waiting

time. Adjust if necessary.