00196504-02_UM_X-Serie_SR70X_EN.pdf - 第101页

User manual SIPLACE X-series Technical data for the machine From software version SR.70x.xx 01/2011 EN edition Performance data 101 3 T echnical dat a for the machine 3.1 Performance dat a 3 T ypes of placement head SIPL…

100%1 / 448
Operational safety User manual SIPLACE X-series
ESD guidelines From software version SR.70x.xx 01/2011 EN edition
100
→ Always place the modules on a conductive surface (table with an ESD coating, conductive
ESD foam, ESD bag or container).
→ Do not bring modules near visual display units, monitors or televisions.
→ Keep them at least 10 cm away from the screen.
2.11.4 Measurements and modifications to ESD modules
Do not take measurements on the modules unless the following conditions are fulfilled:
– the measuring device is earthed (e.g. via PE conductors) or
– you discharge the measuring head just before taking measurements with a potential-free
measuring device (e.g. by touching an unpainted metal part of the controller casing).
→ Always use an earthed soldering iron if you carry out any soldering work.
2.11.5 Dispatching ESD modules
→ Always store modules and components in conductive packaging (e.g. metallized plastic bags
or metal sleeves) and dispatch them in conductive packaging.
If the packaging is not conductive, place the modules in a conductive envelope before pack-
aging. Use conductive expanded rubber, ESD bags, domestic aluminum foil or paper, for ex-
ample. NEVER use plastic bags or film. 2
→ If the module has integral batteries, ensure that the conductive packaging does not touch or
short-circuit the battery terminals and, if necessary, first cover the terminals with insulating
tape or material.
User manual SIPLACE X-series Technical data for the machine
From software version SR.70x.xx 01/2011 EN edition Performance data
101
3 Technical data for the machine
3.1 Performance data
3
Types of placement head SIPLACE SpeedStar (C&P20)
SIPLACE MultiStar (CPP)
SIPLACE TwinStar (TH)
PLEASE NOTE The placement rate is affected by the different head combinations and positions
and by the conveyor configurations. Individual options and customer-specific
applications also affect the placement rate. On request, SIPLACE can calculate
the true output for your product on your machine configuration.
IPC value [comp./h]
According to the vendor-neutral conditions of the IPC 9850 standard published
by the Association of Connecting Electronics Industries.
SIPLACE Benchmark value [comp./h]
The SIPLACE benchmark value is measured during the machine acceptance
tests. It corresponds to the conditions set out in the SIPLACE scope of service
and supply.
Theoretical maximum output value [comp./h]
The theoretical maximum output value is calculated from the most favorable
conditions for each machine type and setting, and corresponds to the theoreti-
cal conditions normally used in the industry.
SIPLACE X4I placement machine (I-placement mode)
For the definition of the placement performance values see the note above.
Number of gantries 4
Machine Placement area 1 Placement area 2 IPC value Benchmark value Theoretical value
X4I-A C&P20 / C&P20 C&P20 / C&P20 102,000 120,000 135,500
C&P20 / C&P20 CPP / CPP
a
91,500 107,000 123,750
CPP / CPP
a
CPP / CPP
a
81,000 94,000 112,000
SIPLACE X4 placement machine
For the definition of the placement performance values see the note above.
Number of gantries 4
Machine Placement area 1 Placement area 2 IPC value Benchmark value Theoretical value
X4-A C&P20 / C&P20 C&P20 / C&P20 82,000 90,000 124,000
C&P20 / C&P20 CPP / CPP
a
75,000 85,000 118,000
CPP / CPP
a
CPP / CPP
a
68,000 80,000 112,000
X4-B C&P20 / C&P20 CPP / TH
b
61,900 68,600 93,000
CPP / CPP
a
CPP / TH
b
54,900 63,600 87,000
X4-C C&P20 / C&P20 TH / TH 48,000 52,500 75,000
CPP / CPP
a
TH / TH 41,000 47,500 69,000
X4-D CPP / TH
b
TH / TH 27,900 31,100 44,000
X4-E TH / TH TH / TH 14,000 15,000 26,000
Technical data for the machine User manual SIPLACE X-series
Performance data From software version SR.70x.xx 01/2011 EN edition
102
3
3
3
3
3
3
3
3
SIPLACE X3 placement machine
For the definition of the placement performance values see the note on page 101.
Number of gantries 3
Machine Placement area 1 Placement area 2 IPC value Benchmark value Theoretical value
X3-A C&P20 / C&P20 C&P20 62,700 69,500 93,000
C&P20 / C&P20 CPP
a
59,200 66,500 90,000
CPP / CPP
a
CPP
a
52,200 61,500 84,000
X3-B C&P20 / C&P20 TH 45,300 50,000 68,500
CPP / CPP
a
TH 38,300 45,000 62,500
X3-C CPP / TH
b
TH 25,200 28,600 37,500
X3-D TH / TH TH 11,300 12,500 19,500
SIPLACE X2 placement machine
For the definition of the placement performance values see the note on page 101
.
Number of gantries 2
Machine Placement area 1 Placement area 2 IPC value Benchmark value Theoretical value
X2-A C&P20 C&P20 43,400 49,000 62,000
C&P20 CPP
a
39,900 46,000 59,000
CPP
a
CPP
a
36,400 43,000 56,000
X2-B C&P20 TH 26,000 29,500 37,500
CPP
a
TH 22,500 26,500 34,500
X2-C TH TH 8,600 10,000 13,000
a) CPP head: low mounting position
b) CPP head: high mounting position
Placement positions 6,000 / gantry for the Collect&Place heads
2,000 / gantry for the TwinStar
Component range
a
0.4 x 0.2 mm² (01005), 0.6 x 0.3 mm² (0201)
to 85 x 85 mm² / 125 x 10 mm²,
max. 200 x 125 mm² (with restrictions)
Component height C&P20: 4 mm
CPP: 6 mm / 8.5 mm / 11.5 mm
TH: 25 mm (larger heights on request)
X/Y accuracy
b
C&P20 ± 41 μm (3), ± 55 μm (4) CO camera, type 23 (6 x 6)
CPP ± 41 μm (3), ± 55 μm (4) CO camera, type 30 (27 x 27)
CPP ± 41 μm (3), ± 55 μm (4) CO camera, type 38 (16 x 16)
CPP ± 34 μm (3), ± 45 μm (4) CO camera, type 33 (55 x 45)
TH ± 26 μm (3), ± 35 μm (4) CO camera, type 33 (55 x 45)
TH ± 22 μm (3), ± 30 μm (4) CO camera, type 25 (16 x 16)