03217917-01-01E By DEK Technical Reference Manual Vol 1_enPDFA.pdf - 第54页
5 MACHINE OVERVIEW 5.1 MODULE OVERVIEWS 54 TECHNICAL REFERENCE MANUAL Vol 1 E By DEK 04/2019 5.1.10 Machined C Chase The machined C chase is the receptacle for the stencil during printing operations. The machined C chase…
5 MACHINE OVERVIEW
5.1 MODULE OVERVIEWS
TECHNICAL REFERENCE MANUAL Vol 1 E By DEK 04/2019 53
5.1.9 Underscreen Cleaner
The understencil cleaner module automatically cleans the underside of the stencil so reducing the
build up of paste. The understencil cleaner is driven across the underside of the stencil by the cam-
era carriage.
The understencil cleaner module provides the facility to store solvent for wet cleaning cycles. The
external solvent tank may be mounted on either side or the rear of the machine.
The vacuum filtration unit removes excess paste from the stencil and solvent/print material fumes.
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2
3
1 Understencil Cleaner 3 External Solvent Tank
2 In Built Vacuum Filtration (IBVF)
Unit
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5.1 MODULE OVERVIEWS
54 TECHNICAL REFERENCE MANUAL Vol 1 E By DEK 04/2019
5.1.10 Machined C Chase
The machined C chase is the receptacle for the stencil during printing operations. The machined C
chase accommodates the standard 29" by 29" stencil size. The print stencil is clamped into place
by the machined C chase during the print cycle.
There are two methods used for achieving correct position of the stencil within the chase assembly:
●
Stencil Depth Adjuster
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Stencil Change Mechanism
There are two image scales on the stencil depth adjuster:
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Centre Justified Image Scale
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Front Justified Image Scale
5.1.11 Screen Alignment Module
The stencil alignment module enables adjustment of the machined chase to achieve optimum sten-
cil to board alignment prior to the print stroke. Actuators move the print stencil in the X, Y and theta
planes to nullify the misalignment error signal from the vision system.
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2
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5
1 Chase Clamp (Stencil Alignment) 4 Chase Clamp (Stencil Alignment)
2 Machined C Chase 5 Stencil Depth Adjuster
3 Stencil Depth Adjuster 6 Stencil Change Mechanism
5 MACHINE OVERVIEW
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TECHNICAL REFERENCE MANUAL Vol 1 E By DEK 04/2019 55
5.1.12 Adjustable Width Screen Mount (AWSM)
The AWSM is the receptacle for the stencil during printing operations. The AWSM is fully ad-
justable to accommodate the most popular of stencil sizes. The print stencil is clamped into place
by the AWSM during the print cycle. The AWSM is a machine option replacing the C Chase.
The stencil change mechanism locates the stencil within the chase assembly.
5.1.13 Screen Alignment Module
The screen alignment module enables adjustment of the AWSM to achieve optimum stencil to
board alignment prior to the print stroke. Actuators move the print stencil in the X, Y and theta
planes to nullify the misalignment error signal from the vision system.
5
4
3
2
1
1 Chase Clamp (Stencil Alignment) 4 Actuators (Stencil Alignment)
2 Adjustable Width Stencil Mount
(AWSM)
5 Stencil Change Mechanism
3 Chase Clamp (Stencil Alignment)