Utah-94-721002-System-Manual.pdf - 第232页

lfmq=póëíÉãë lñÑç êÇ=fåë íêìãÉåí ë=m ä~ë ã~=qÉÅÜåçäçÖó== System Manual SK= mêçÅÉëë=Ö~ëÉë= REGULA TOR 0.5 BAR T O 5 BAR (7 TO 75 P SIG) LO CA T ED ADJACENT TO THE SYSTEM SUPPL Y TO GAS POD OR INTERNAL GAS LIN E MINI MUM P…

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Nitrogen is required to vent and purge process chambers, load locks and pumps.
2 MICRON
FILTER
REGULATOR
1/4"
SWAGELOK
CONNECTOR
TO PLASMALAB
OR IONFAB
SYSTEM
TO PUMP
PURGE
CONNECTOR
0 TO 1 SLM
FLOW CONTROL
ROTAMETER
(IF REQUIRED)
Fig 5.1: Recommended nitrogen supply installation
Semiconductor grade fittings and pressure regulators, together with electropolished stainless
steel tube must be used to ensure that gas quality is not degraded. Purges to turbo pumps are
supplied by OIPT as part of the system. The customer will usually need to fit a purge to the
rotary pump. See below.
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Pipework fittings and
pressure regulators:
Semiconductor grade
Gas handling tubing: Electropolished stainless steel
Purity: At least 99.99% or higher to satisfy process
requirements.
Filtration: 2 micron filter mounted adjacent to the
system.
Regulation: 0.5 to 5 bar (7.5 to 75 psig)
Minimum pressure at input
to system:
3 bar (45 psig). Certain pumps, for example
Edwards Drystar pumps, may need up to 5 bar
(75psig) to ensure satisfactory purging. Check
with the vendor's instructions.
Rotary pump purging
It is the customer’s responsibility to ensure that a rotary pump purge
connection is fitted and used correctly. This is needed to ensure the protection
of the pumping system from the customer’s process, and may also be required
by local safety regulations. Because customers’ requirements vary, components
are not supplied automatically by OIPT. Kits of parts are available if required.
Contact OIPT for further information.
It may be safe to omit this feature on certain systems, such as Ionfab machines
running inert gas processes. However, unless the customer has written
agreement on this point from OIPT, any damage caused by the omission cannot
be covered by the system warranty.
Services Specifications
Printed: 6-Jan-06, 8:44 Page 13 of 22 Issue 16: April 05
lfmq=póëíÉãë lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== System Manual
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REGULATOR 0.5 BAR TO 5 BAR
(7 TO 75 PSIG) LOCATED
ADJACENT TO THE SYSTEM
SUPPLY TO
GAS POD
OR INTERNAL
GAS LINE
MINIMUM PRESSURE
3 BAR (45 PSIG)
ALL FITTINGS,
REGULATOR AND
FILTER TO BE
SEMICONDUCTOR
GRADE
A
LL TUBING TO BE
ELECTROPOLISHED
STAINLESS STEEL
NOTES:
Fig 6.1: Recommended process gas supply installation
Semiconductor grade fittings and pressure regulators, together with electropolished stainless
steel tube must be used to ensure that gas quality is not degraded.
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Pipework fittings and pressure
regulators:
Semiconductor grade
Gas handling tubing: Electropolished stainless steel
Purity: At least 99.99% or higher to satisfy
process requirements.
Filtration: A 2-micron filter is fitted to each
gas line supplied as part of the
system. For other grades of filter,
please consult OIPT.
Regulation: 0.5 to 5 bar (7.5 to 75 psig)
Minimum pressure at input to system: 2 bar (30 psig)
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The specifications for the Helium gas supply are as for those of the process gases given in sub-
sections 6 and 6.1 with the exception that the maximum pressure at the inlet to the
pressure controller must not exceed 3.5 bar (43 psig). The design of the Helium
pressure controller is such that it can be destroyed by higher pressures.
Services Specifications
Issue 16: April 05 Page 14 of 22 Printed: 6-Jan-06, 8:44
System Manual lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== lfmq=póëíÉãë
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The low vapour pressure can lead to condensation in the gas supply lines, particularly at cold
points or when the gas passes into a cooler region. This condensation can result in a build up
of liquid in the gas pipe, usually at the low points or u-bends in the gas line, often leading to
instability of gas flow, especially if liquid condenses or flows into the MFC.
The low vapour pressure can also result in very low gas pressure if the gas cylinder is very
cold, e.g. if it is kept outdoors in the winter.
Therefore, it is important to adhere to the following guidelines:
(A) It is necessary to keep the gas cylinder indoors (in an extracted gas cabinet) to avoid
loss of line pressure when the outside temperature is cold.
However, do
NOT heat the gas cylinder with a heated jacket as this can cause
condensation problems when the gas passes into the cooler gas lines. Room
temperature is warm enough to provide sufficient vapour pressure.
(B) It is important to maintain a positive temperature gradient from the cylinder to the
MFC, or at least keep them at the same temperature. The simplest method is to
position the gas cabinet close to the gas pod, minimising the chances of temperature
differences, reducing the length of the gas pipe, and hence minimising the chances
of condensation. If this is not possible, then it is necessary to heat the gas lines by
the use of heater tape.
The MFC will also need to be heated. OIPT offers a heated MFC kit for these gases.
Alternatively, heater tape can be wrapped around the MFC. However, in this case, it
may also be necessary to detach the MFC from the backing plate to avoid heat loss
through the plate, and to cover the MFC in insulation material to avoid cooling from
air flow within the gas pod (from the gas pod exhaust).
It will then be necessary to set the MFC temperature hotter than the gas line
temperature, which in turn is hotter than the gas cylinder temperature. A typical set-
up might be MFC 40 °C or above, gas line 30-40 °C, and gas cylinder at room
temperature.
(C) If condensation problems are suspected, it will be necessary to pump out the gas
lines completely, and optimise the heater tape arrangement and temperature
setpoints before refilling the gas line.
(D) For SiCl
4
it is important to use a dedicated SiCl
4
MFC as this is designed specifically for
low-pressure condensable SiCl
4
operation.
Services Specifications
Printed: 6-Jan-06, 8:44 Page 15 of 22 Issue 16: April 05