Utah-94-721002-System-Manual.pdf - 第43页
System Manual lñÑçêÇ=få ëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== mä~ëã~ä~ Ä póëíÉã=NMM PKQ= VQJNMMJPJQN`=f`m=NUM=ÅÜ~ã ÄÉê=âáí=ïáíÜ =Ö~íÉ=î~äîÉ= The ICP chamber kit comprises the following components: Process chamber. Pumping port i…
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Emergency Off / Electrical
Fail
24V Process line 24V Chamber lid line
Interlock Fail Restore Fail Restore Fail Restore
System/Controller OFF Restart
Required
ON
ON
RF Generator OFF Powered, NOT
active
OFF Powered,
NOT active
OFF Powered, NOT
active
Process Gases OFF Powered, NOT
active
OFF Powered,
NOT active
OFF Powered, NOT
active
Automatic
Pressure
Controller Valve
CLOSED
CLOSED
**
NO
CHANGE
NO
CHANGE
CLOSED
CLOSED
Load lock
Slit Valve
HOLD
*
HOLD
HOLD
HOLD
HOLD
HOLD
Pumps OFF Pumps must be
restarted
NO
CHANGE
NO
CHANGE
OFF Pumps must
be restarted
* If closed, stays closed.
If open, will stay open until the loading arm is at its home position; then it will close.
** If ‘high pressure’ is signalled during process, APC opens and process step aborts. High pressure at
other times does not alter the APC.
Table 3.1: Consequences of open circuit interlocks
Other machine protection switches include:
a) A water flow switch. Low flow is reported to the system controller, which disables
specific devices until flow is restored.
b) Pump overload detection. If the primary pump stops because the over-current
protection switch opens, then the system aborts.
The software also monitors the position of the wafer handling mechanisms, ensuring safe
operation.
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For details of the services required for the base unit, refer to Section 2 of this manual.
Description
UC Davis 94-721001 Issue 1: March 06 Page 3-6 of 22 Printed: 22-Mar-06, 7:29
System Manual lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== mä~ëã~ä~Ä póëíÉã=NMM
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The ICP chamber kit comprises the following components:
Process chamber.
Pumping port isolation valve and automatic pressure controller suitable for use with a
turbomolecular pump.
The ICP process chamber, shown in Fig 3.2, is machined from a single aluminium block with
the minimum number of O-rings to provide the highest vacuum integrity.
SLIT VALVE
SLIT VALVE
O-RING
LOCATING
PIN
VIEW
PORT
BLANKIN
G
PLATE
Cartridge heater (if fitted)
Inserted into a hole in the
chamber base (one in each
corner)
Fig 3.2: 94-100-3-41C process chamber
The chamber is fitted with the following ports:
a) Single view port fitted with an RF shield for viewing the plasma. Note that the view
port is mounted on a blanking plate, which can be removed to provide access to the
chamber interior.
b) Pumping port.
c) Wafer transfer port to which is attached a pneumatically operated gate valve.
d) Wafer clamp port.
e) Process gas inlet port.
f) Two ports for the connection of vacuum measurement components.
The pneumatically operated gate valve, for connecting to the selected wafer insertion device,
is attached to the chamber by six claw bolts and is positioned by two locating pins (dowels).
Sealing is provided by a rectangular O-ring.
Description
Printed: 22-Mar-06, 7:29 Page 3-7 of 22 UC Davis 94-721001 Issue 1: March 06
mä~ëã~ä~Ä póëíÉã=NMM lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== System Manual
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The electrical heating kit comprises four cartridge heaters; inserted into holes at the corners
in the base of the process chamber, see Fig 3.2. Heater control is via a unit mounted on the
console, where the temperature can be set manually. A temperature in the range 50ºC to
60ºC is recommended for most processes.
WARNING
IF THE PROCESS CHAMBER TEMPERATURE IS SET TO A VALUE ABOVE 60ºC, CONTACT
WITH IT CAN CAUSE BURNS.
BEFORE OPERATING THE CHAMBER ABOVE 60ºC, ENSURE THAT EXTERNAL HEAT
SHIELDS ARE FITTED.
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This heating kit is applied to the pump-down pipe to give optimum vacuum performance and
to minimise the deposition of loosely adherent material, which might generate particulates.
Description
UC Davis 94-721001 Issue 1: March 06 Page 3-8 of 22 Printed: 22-Mar-06, 7:29