Utah-94-721002-System-Manual.pdf - 第82页

mä~ëã~ä~Ä póëíÉãNMM lñÑçêÇ =fåëíêìã Éåíë= mä~ëã~ =qÉÅÜåçäçÖó == System Manual RKQKR= ^ìíçã~íáÅ=éêçÅÉëë=êìå= An automatic process run as described in this sub-section can be carried out by a user logged on as a Manager. S…

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System Manual lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== mä~ëã~ä~ÄpóëíÉãNMM
Continue button: Close the alert dialogue box – the alert banner remains displayed
on the menu bar.
Note that option buttons that are not available (i.e. Accept and Cancel due to user ‘logged
on’ status and Next when there is only one active alert) are greyed out.
The alert message usually contains an adequate description of the detected event. If it is a
service fault (water flow, purge gas etc.) then verify that the service is available to the
machine as soon as possible. Depending on the nature of the service, the system may allow
the machine to continue to operate, so that the current process can be completed.
Do not
start a new process before checking the service.
The red alerts are often due to a process setpoint being out of tolerance for too long. In these
cases, the process is halted by the system. If it is authorised to resume processing with a
parameter deviation then:
1) Check the most recent process log to find the process time remaining.
2) Construct a new process with a modified process time and check the ‘Ignore
tolerance’ option. Note that this removes
all tolerance checking. The machine should
be monitored by an operator for further deviations when operated in this condition.
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1) On the Pump Control page, select the SET BASE PRESSURE button, then enter the
required process chamber base pressure if different from the default.
2) Ensure that the Automatic load lock/transfer chamber’s lid is closed. (Automatic load
lock/transfer chamber lid open/closed status is shown in the panel adjacent to the
mimic).
3) Click on each dry pump/rotary vane pump mimic to start the pump.
4) Select the Evacuate button for the process chamber. The relevant valves will
operate and the process chamber will be pumped down.
5) Select the Evacuate button for the Automatic load lock. You will be prompted to
enter a wafer identity - either enter the identity and click OK, or click Cancel (to
pump down without a wafer in the Automatic load lock). The relevant valves will
operate and the Automatic load lock will be pumped down.
NOTE: Turning off any rotary vane pump will cause all process and pumping
actions using that pump to stop.
6) To achieve a low base pressure in the system, pump for at least 12 hours. Where
chambers or process heaters are part of the system, raise the temperatures of these
near their maximum values for the first six hours of pumping to assist out-gassing,
then return the temperature to ambient.
WARNING
PARTS OF THE EQUIPMENT MAY BE TOO HOT TO TOUCH DURING CHAMBER
HEATING.
Operating Instructions
Printed: 22-Mar-06, 10:42 Page 5-15 of 52 UC Davis 94-721001 Issue 1: March 06
mä~ëã~ä~ÄpóëíÉãNMM lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== System Manual
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An automatic process run as described in this sub-section can be carried out by a user logged
on as a Manager. See sub-section 5.4.6, page 5-17 for details of a single button automatic
process run, which can be carried out by any user.
1) Insert the wafer into the Automatic load lock. (If necessary, vent the Automatic load
lock by selecting the STOP button then the VENT button).
2) Close the Automatic load lock’s lid.
3) Select the relevant EVACUATE button. A dialogue box will be displayed allowing
entry of a Wafer Identity, if any.
4) Check that the system has pumped down to base pressure. (The process chamber
message panel should display ‘Base Pressure reached’.)
5) Ensure that the Automatic load lock is at the required pressure. (Check the relevant
panel on the Pump Control page). Green ‘ready for transfer’ indicators (WX) are
displayed on each chamber mimic when it is available for vacuum transfer.
6) Select the Process menu, then the Recipe option. Click on the Load button then
select the required recipe.
7) Click on the Run button. This will start wafer transfers and wafer processing.
NOTES:
a) You can pause the process at any time by selecting the PAUSE button.
This will cause the Step Time and the plasma power to stop with the
current step time indicated. Re-starting the process will cause the
process to continue from the time it was paused. If, during the pause
period, you change any of the process parameters, e.g. gas demand,
pressure etc., you must press the START button for the changes made to
come into effect, this will cause the step timer to continue from the time
it was paused.
b) You can stop the process at any time; the message ‘Process Complete’
will be displayed, if required, you can then run the same or another
process.
WARNING
CONTACT WITH TOXIC GASES CAN CAUSE DEATH OR SERIOUS INJURY.
WHERE ANY PROCESS GAS IS TOXIC, DO NOT TRANSFER A WAFER FROM THE
PROCESS CHAMBER TO THE LOAD LOCK UNTIL ALL PROCESS GAS HAS BEEN
PUMPED OUT.
ENSURE THAT THE AUTOMATIC VENT SEQUENCE IS ALLOWED TO COMPLETE.
IF THESE PRECAUTIONS ARE NOT CARRIED OUT, THERE COULD BE A HAZARD IN THE
LOAD LOCK.
Operating Instructions
UC Davis 94-721001 Issue 1: March 06 Page 5-16 of 52 Printed: 22-Mar-06, 10:42
System Manual lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== mä~ëã~ä~ÄpóëíÉãNMM
8) When the ‘Process Complete’ message is displayed, select the Pump Control page
and move the wafer from the process chamber to the Automatic load lock using the
same method as the transfer in.
9) Open the Automatic load lock’s lid and remove the wafer.
10) If required, the system can now be vented, see sub-section 5.4.9 page 5-20.
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A single button automatic process run allows a complete process to be run automatically. The
run starts by pumping the system down, carrying out the process and then venting the
system. The automatic process run can be carried out by a user logged on at any access level,
e.g. Manager, User etc..
Before starting an automatic process run, the rotary vane/roots/dry pumps must be started. It
is suggested that once the system is powered up, the Manager logs on, starts the pumps,
evacuates the process chamber and then re-logs on for the User or Production Operator to
carry out the automatic process run(s).
When the pumps have started and the User or Production Operator is logged on, carry out
the automatic process run using the following steps.
1) Insert the wafer into the Automatic load lock. (If necessary, vent the Automatic load
lock by selecting the STOP button then the VENT button).
2) Close the Automatic load lock’s lid.
3) In PC 2000, select the System menu and then the Recipe option. The Recipe page is
displayed.
4) Load the required recipe.
5) Select the Run button. You will be prompted enter a wafer identity; enter the wafer
identity and select the OK button. The following sequence will be automatically
carried out:
i) The automatic load lock will start to evacuate and the Process page is
displayed.
ii) When the automatic load lock reaches base pressure, the wafer will be
transferred into the process chamber.
iii) When the wafer has been transferred into the process chamber, the recipe
will start.
iv) When all of the process steps have completed, the Pump Control page is
displayed, the wafer will be transferred into the automatic load lock and
then the automatic load lock will vent.
6) When the vent sequence is completed, open the automatic load lock’s lid and
remove the wafer.
To process another wafer, repeat the above steps from Step 1). If running the same recipe,
Step 4 can be skipped otherwise load another recipe.
Operating Instructions
Printed: 22-Mar-06, 10:42 Page 5-17 of 52 UC Davis 94-721001 Issue 1: March 06