Utah-94-721002-System-Manual.pdf - 第44页

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The ICP chamber kit comprises the following components:

Process chamber.

Pumping port isolation valve and automatic pressure controller suitable for use with a

turbomolecular pump.

The ICP process chamber, shown in Fig 3.2, is machined from a single aluminium block with

the minimum number of O-rings to provide the highest vacuum integrity.

SLIT VALVE

O-RING

LOCATING

VIEW

PORT

BLANKIN

PLATE

Cartridge heater (if fitted)

Inserted into a hole in the

chamber base (one in each

corner)

Fig 3.2: 94-100-3-41C process chamber

The chamber is fitted with the following ports:

a) Single view port fitted with an RF shield for viewing the plasma. Note that the view

port is mounted on a blanking plate, which can be removed to provide access to the

chamber interior.

b) Pumping port.

c) Wafer transfer port to which is attached a pneumatically operated gate valve.

d) Wafer clamp port.

e) Process gas inlet port.

f) Two ports for the connection of vacuum measurement components.

The pneumatically operated gate valve, for connecting to the selected wafer insertion device,

is attached to the chamber by six claw bolts and is positioned by two locating pins (dowels).

Sealing is provided by a rectangular O-ring.

Description

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The electrical heating kit comprises four cartridge heaters; inserted into holes at the corners

in the base of the process chamber, see Fig 3.2. Heater control is via a unit mounted on the

console, where the temperature can be set manually. A temperature in the range 50ºC to

60ºC is recommended for most processes.

WARNING

IF THE PROCESS CHAMBER TEMPERATURE IS SET TO A VALUE ABOVE 60ºC, CONTACT

WITH IT CAN CAUSE BURNS.

BEFORE OPERATING THE CHAMBER ABOVE 60ºC, ENSURE THAT EXTERNAL HEAT

SHIELDS ARE FITTED.

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This heating kit is applied to the pump-down pipe to give optimum vacuum performance and

to minimise the deposition of loosely adherent material, which might generate particulates.

Description

UC Davis 94-721001 Issue 1: March 06 Page 3-8 of 22 Printed: 22-Mar-06, 7:29

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The helium-assisted lower electrode, shown in Fig 3.3, is fabricated from aluminium. The

electrode is fitted with an integral dark space shield.

The lower electrode is heated by an embedded 1250W element and cooled by liquid nitrogen

flowing through embedded tubing.

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The wafer is lifted clear of the table (15mm) for transferring into a load lock or transfer

chamber by the wafer lift assembly. Compressed air flowing into the air cylinder forces its

piston and plunger upwards. The plunger contacts the base of the bellows which is connected

to a push rod. The 3-pin wafer support, mounted on top of the push rod, rises lifting the

wafer clear of the table. The push rod is lowered by the force exerted by the return spring.

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The wafer clamp comprises a clamping ring attached to a lifting mechanism, and a clamping

plate. The clamping plate, attached to the clamping ring via three pillars and screws,

comprises an aluminium annulus with a quartz circular insert.

The wafer clamp is raised and lowered by two air cylinders, attached to the outside of the

process chamber; one located at each side of the wafer clamp. The piston of each air cylinder

is attached to a push rod, which passes through the base of the process chamber. Within the

process chamber, a circular plate mounted on the top of the push rod, is attached to the

wafer clamp by three M5 setscrews and compression springs. Rotating the setscrews changes

the compression of the springs and consequently the clamping force exerted on the wafer.

See Section 6 for the clamping force adjustment procedure.

Note that clamping plates are available with inserts for various sized wafers. Before loading a

wafer into the process chamber, ensure that the correct clamping plate is fitted. See Section 6

for the clamping plate changeover procedure.

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In some systems, the table top plate is fixed to the table by a ring of cap-head bolts. If your

system has a table of this type, refer to the following text and note.

The bolt heads are concealed behind screw covers, which require a special tool (supplied with

the system) for removal. (Tool part number: MD91D21726.)

NOTES:

1) When re-fixing the table top, do not over-tighten the bolts which will cause

the table top to bow. Check with a straight edge after tightening: if the table

top is not flat, release the bolt tensions until it is.

2) The screw covers (MD91D21723) are aluminium. When removing the covers,

it is recommended to use a little iso-propyl alcohol (IPA) to prevent the

thread from jamming.

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The purpose of helium backing is to set the temperature of the wafer close to that of the

temperature-controlled table by heat transfer. Helium is fed from a number of small holes in

the table underneath the wafer (which is clamped to the table) from where it flows radially

Description

Printed: 22-Mar-06, 7:29 Page 3-9 of 22 UC Davis 94-721001 Issue 1: March 06