Utah-94-721002-System-Manual.pdf - 第58页
mä~ëã~ä~Ä póëíÉã=NMM l ñÑçêÇ =fåëíê ìãÉåíë =m ä~ëã~=qÉÅ ÜåçäçÖó== System Manual As Steel Belt 2 travels with respect to the Carriage, it causes the Wafer Support attached to it to travel along the Carriage. 6) As the Waf…
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WAFER
SUPPORT
PULLEY
WHEEL 1
(DRIVEN)
PULLEY
WHEEL 2
PULLEY
WHEEL 3
(ATTACHED TO
CARRIAGE)
PULLEY
WHEEL 4
(ATTACHED TO
WAFER SUPPORT)
STEEL
BELT 1
STEEL
BELT 2
CARRIAGE
(ATTACHED TO
STEEL BELT 1)
PHOTO
DIODE 1
PHOTO
DIODE 2
TRACK
BELT RETAINING
POST
Fig 3.11: Automatic load lock wafer transport mechanism
Before operation, the Wafer Support is fully retracted into the load lock. To load a wafer into
the process chamber the following sequence of events occurs:
1) The operator opens the load lock door, places the wafer onto the Wafer Support,
and then closes the load lock door.
2) The load lock chamber is pumped down to base pressure.
3) The pneumatically operated gate valve is opened.
4) The DC Motor drives Steel Belt 1 via Pulley Wheel 1. Note that Pulley Wheels 1 and 2
are mounted on the load lock baseplate. As Steel Belt 1 is driven, it moves the
Carriage, which is attached to it.
5) As the carriage travels, it causes Steel Belt 2 to travel around Pulley Wheels 3 and 4.
Note that Pulley Wheels 3 and 4 are attached to the carriage and Steel Belt 2 is
prevented from moving with respect to the load lock chassis by the retaining post.
Description
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As Steel Belt 2 travels with respect to the Carriage, it causes the Wafer Support
attached to it to travel along the Carriage.
6) As the Wafer Support reaches the end of its travel, a hole in Steel Belt 1 is detected
by Photo Diode 2 to stop the DC Motor.
7) The wafer is lifted from the wafer support by a wafer lift within the processing
chamber, the wafer support is withdrawn from the chamber, and the wafer is
lowered onto the processing table by the wafer lift.
8) As the Wafer Support reaches its fully retracted position within the load lock, the
hole in Steel Belt 1 is detected by Photo Diode 1 to stop the DC motor.
9) The gate valve is closed and the load lock can be vented if required.
The above sequence of events is repeated to remove the wafer from the processing chamber.
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The automatic load lock end effector (wafer support) can accommodate wafer diameters of
3” to 8”. See Section 6 (Maintenance) for the end effector wafer size adjustment procedure.
Description
UC Davis 94-721001 Issue 1: March 06 Page 3-22 of 22 Printed: 22-Mar-06, 7:29
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4.
Installation and commissioning.............................................................................4-1
4.1 Introduction.....................................................................................................................4-2
4.2 Installing the system........................................................................................................4-2
4.2.1 Unpacking................................................................................................................4-2
4.2.2 Positioning the system components.......................................................................4-3
4.2.3 Connecting the services...........................................................................................4-4
4.3 Commissioning the system .............................................................................................4-6
4.4 System adjustments.........................................................................................................4-6
4.4.1 Heater/Chillers .........................................................................................................4-6
4.4.2 Process pump purge................................................................................................4-6
Fig 4.1: 3-phase supply cable connections at the power box.................................................4-5
Installation and Commissioning
Printed: 16 March 2006 11:59 Page 4-1 of 8 Issue 4: March 05