Utah-94-721002-System-Manual.pdf - 第83页

System Manual lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉ ÅÜåçäçÖó== mä~ëã~ä~Ä póëíÉãNMM 8) When the ‘Process Complete’ message is displayed, select the Pump Control page and move the wafer from the process chamber to the Automatic loa…

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An automatic process run as described in this sub-section can be carried out by a user logged

on as a Manager. See sub-section 5.4.6, page 5-17 for details of a single button automatic

process run, which can be carried out by any user.

1) Insert the wafer into the Automatic load lock. (If necessary, vent the Automatic load

lock by selecting the STOP button then the VENT button).

2) Close the Automatic load lock’s lid.

3) Select the relevant EVACUATE button. A dialogue box will be displayed allowing

entry of a Wafer Identity, if any.

4) Check that the system has pumped down to base pressure. (The process chamber

message panel should display ‘Base Pressure reached’.)

5) Ensure that the Automatic load lock is at the required pressure. (Check the relevant

panel on the Pump Control page). Green ‘ready for transfer’ indicators (WX) are

displayed on each chamber mimic when it is available for vacuum transfer.

6) Select the Process menu, then the Recipe option. Click on the Load button then

select the required recipe.

7) Click on the Run button. This will start wafer transfers and wafer processing.

NOTES:

a) You can pause the process at any time by selecting the PAUSE button.

This will cause the Step Time and the plasma power to stop with the

current step time indicated. Re-starting the process will cause the

process to continue from the time it was paused. If, during the pause

period, you change any of the process parameters, e.g. gas demand,

pressure etc., you must press the START button for the changes made to

come into effect, this will cause the step timer to continue from the time

it was paused.

b) You can stop the process at any time; the message ‘Process Complete’

will be displayed, if required, you can then run the same or another

process.

WARNING

CONTACT WITH TOXIC GASES CAN CAUSE DEATH OR SERIOUS INJURY.

WHERE ANY PROCESS GAS IS TOXIC, DO NOT TRANSFER A WAFER FROM THE

PROCESS CHAMBER TO THE LOAD LOCK UNTIL ALL PROCESS GAS HAS BEEN

PUMPED OUT.

ENSURE THAT THE AUTOMATIC VENT SEQUENCE IS ALLOWED TO COMPLETE.

IF THESE PRECAUTIONS ARE NOT CARRIED OUT, THERE COULD BE A HAZARD IN THE

LOAD LOCK.

Operating Instructions

UC Davis 94-721001 Issue 1: March 06 Page 5-16 of 52 Printed: 22-Mar-06, 10:42

System Manual lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== mä~ëã~ä~ÄpóëíÉãNMM

8) When the ‘Process Complete’ message is displayed, select the Pump Control page

and move the wafer from the process chamber to the Automatic load lock using the

same method as the transfer in.

9) Open the Automatic load lock’s lid and remove the wafer.

10) If required, the system can now be vented, see sub-section 5.4.9 page 5-20.

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A single button automatic process run allows a complete process to be run automatically. The

run starts by pumping the system down, carrying out the process and then venting the

system. The automatic process run can be carried out by a user logged on at any access level,

e.g. Manager, User etc..

Before starting an automatic process run, the rotary vane/roots/dry pumps must be started. It

is suggested that once the system is powered up, the Manager logs on, starts the pumps,

evacuates the process chamber and then re-logs on for the User or Production Operator to

carry out the automatic process run(s).

When the pumps have started and the User or Production Operator is logged on, carry out

the automatic process run using the following steps.

1) Insert the wafer into the Automatic load lock. (If necessary, vent the Automatic load

lock by selecting the STOP button then the VENT button).

2) Close the Automatic load lock’s lid.

3) In PC 2000, select the System menu and then the Recipe option. The Recipe page is

displayed.

4) Load the required recipe.

5) Select the Run button. You will be prompted enter a wafer identity; enter the wafer

identity and select the OK button. The following sequence will be automatically

carried out:

i) The automatic load lock will start to evacuate and the Process page is

displayed.

ii) When the automatic load lock reaches base pressure, the wafer will be

transferred into the process chamber.

iii) When the wafer has been transferred into the process chamber, the recipe

will start.

iv) When all of the process steps have completed, the Pump Control page is

displayed, the wafer will be transferred into the automatic load lock and

then the automatic load lock will vent.

6) When the vent sequence is completed, open the automatic load lock’s lid and

remove the wafer.

To process another wafer, repeat the above steps from Step 1). If running the same recipe,

Step 4 can be skipped otherwise load another recipe.

Operating Instructions

Printed: 22-Mar-06, 10:42 Page 5-17 of 52 UC Davis 94-721001 Issue 1: March 06

mä~ëã~ä~ÄpóëíÉãNMM lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== System Manual

NOTES:

a) You can pause the process at any time by selecting the PAUSE button. This will

cause the Step Time and the plasma power to stop with the current step time

indicated. Re-starting the process will cause the process to continue from the

time it was paused. If, during the pause period, you change any of the process

parameters, e.g. gas demand, pressure etc., you must press the START button

for the changes made to come into effect, this will cause the step timer to

continue from the time it was paused.

b) You can stop the process at any time; the message ‘Process Complete’ will be

displayed, if required, you can then run the same or another process.

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The production mode facility is provided to make operation of the system as simple as

possible. In this mode, the user is provided with a ‘special’ Recipe page, which allows the user

to load and run a recipe and then vent the automatic load lock.

To carry out production mode processing, use the following steps:

1) Log on as a Manager.

2) Start the external rotary vane pump/dry pumps for the process chamber and

automatic load lock.

3) Evacuate the process chamber. Do not evacuate the automatic load lock at this

stage.

4) Select the system menu, and then select the Passwords option.

5) Log on using the appropriate user name and password for the production mode. The

Production mode page is displayed. See sub-section 5.8.4, page 5-39.

6) Open the automatic load lock’s lid and place the wafer to be processed on the

transfer arm. Close the lid.

7) Select the Load button, then select the required recipe from the displayed list and

select the OK button.

8) Enter a batch identity.

9) Select the Run button. The automatic load lock will automatically pump down and

the recipe will run. Note that this button only becomes active when a recipe has

been loaded and a batch identity has been entered, and the associated indicators

are coloured green.

10) When the ‘Process Complete’ message is displayed, select the System menu and

then the Pumping option to vent the automatic load lock.

11) When the automatic load lock has finished venting, open its lid and then remove the

processed wafer.

12) You can now carry out a further process by repeating steps 6) to 11). If running the

same recipe Step 7) can be skipped, otherwise load another recipe.

13) On completion of production mode processing, log on as a Manager.

Operating Instructions

UC Davis 94-721001 Issue 1: March 06 Page 5-18 of 52 Printed: 22-Mar-06, 10:42