IPC-TM-650 EN 2022 试验方法--.pdf - 第333页

IPC-TM-650 Number Subject Date Revision Page 3 of 2 2.4.47 Flux Residue Dryness 1/95 6.0 Notes 6.1 Safety Observe all appropriate precautions on MSDS for chemicals involved in this test method.

100%1 / 824
IPC-TM-650
Number
Subject Date
Revision
Page 2 of 2
2.4.47
Flux
Residue
Dryness
1/95
to
the
center
of
the
depression
in
one
of
the
cleaned
copper
test
pieces
(5.1).
Note:
This
may
conveniently
be
done,
if
solder
wire
is
used,
by
forming
the
wire
into
a
tight
spiral.
5.
1.4
.2
If
the
flux
under
test
is
in
solid
or
paste
form
—
weigh
between
0.035g
and
0.040g
of
the
solid
or
paste
flux
and
add
this
to
the
solder
in
the
depression
of
the
test
piece.
5.1.
4
.3
If
the
flux
under
test
is
in
liquid
form
—
first
determine
it's
non-volatile
matter
content
by
the
use
of
the
method
described
in
ISO
9455:
Part
1
or
Part
2.
Then
add
the
appro¬
priate
volume
of
the
liquid
flux,
to
contain
between
0.035g
and
0.040g
of
non-volatile
matter,
to
the
solder
in
the
depression
of
the
test
piece.
Evaporate
the
solvent
at
60℃
for
1
0
minutes
in
the
drying
oven
(5.3).
Note:
If
the
liquid
flux
has
low
non-volatile
content,
it
may
be
necessary
to
add
the
flux
in
two
increments,
carrying
out
the
evaporation
procedure
after
each
addition.
5.1.5
For
flux
cored
solder
samples.
Degrease
the
surface
of
a
suitable
length
of
the
cored
solder
sample,
using
a
cloth
dampened
with
the
solvent
(4.3).
Weigh
1
.00
+/-0.05g
of
the
degreased
sample,
form
it
into
a
small
flat
coil
and
place
it
in
the
center
of
the
depression
in
one
of
the
cleaned
copper
test
pieces
(5.1).
5.1.6
For
solder
paste
samples.
Weigh
0.50
+/-0.05g
of
the
solder
paste
sample
into
the
center
of
the
depression
in
one
of
the
cleaned
copper
test
pieces
(5.1).
5.2
Heating
the
test
piece.
5.2.1
Using
the
tongs
(4.1
1),
or
other
suitable
means,
care¬
fully
lower
the
prepared
test
piece
from
7.1
onto
the
surface
of
the
molten
solder,
maintained
at
235
+/-5℃
in
the
solder
bath
(4.8).
5.2.2
Allow
the
test
piece
to
float
on
the
solder
bath
until
the
solder
melts
and
leave
the
test
piece
in
this
position
for
a
fur¬
ther
5
seconds.
Remove
the
test
piece
carefully
from
the
bath
and
allow
it
to
cool,
in
air,
in
a
horizontal
position
for
30
min¬
utes.
(4.4)
.
Lightly
brush
the
chalked
surface
with
the
soft
brush
(4.12).
5.4
Evaluation
If
the
chalk
powder
is
easily
removed
by
brushing,
the
flux
is
deemed
to
be
"not
tacky."
If
the
chalk
powder
cannot
be
removed
by
brushing,
or
can
be
removed
only
with
difficulty,
the
flux
is
deemed
to
be
“tacky.”
5.3
Examination
of
the
test
piece.
Dust
the
surface
of
the
flux
residue
on
the
test
piece
liberally
with
the
powdered
chalk
IPC-TM-650
Number
Subject Date
Revision
Page 3 of 2
2.4.47
Flux
Residue
Dryness
1/95
6.0
Notes
6.1
Safety
Observe
all
appropriate
precautions
on
MSDS
for
chemicals
involved
in
this
test
method.
J-STD-006
The Institute for Interconnecting and Packaging Electronic Circuits
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Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
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Page 1 of 2
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
test
method
provides
a
measurement
of
the
spitting
characteristics
of
flux-cored
wire
and
ribbon
sol¬
der.
2
.0
Applicable
Documents
Requirements
and
Test
Methods
for
Electronic
Grade
Solder
Alloys
and
Fluxed
and
Non-fluxed
Solid
Solders
for
Electronic
Soldering
Applications
3
.0
Test
Specimen
One
five
meter
length
of
the
J
-STD-
006
flux-cored
wire
or
ribbon
solder
(may
be
cut
into
several
smaller
lengths
for
convenient
handling).
4
.0
Apparatus
4.1
One
laboratory
stand
with
soldering
iron
support
clamp
and
metal
support
ring
or
tray
with
a
suitable
hole
in
center.
4.2
One
20
by
20
cm
piece
of
aluminum
foil
with
1
1
±
0.5
mm
diameter
hole
in
center.
4.3
One
small
metal
tray
with
suitable
hole
in
center,
for
catching
molten
solder
running
down
off
of
the
soldering
iron
tip.
4.4
One
soldering
iron
with
a
clean
chisel
point
which
has
been
coated
with
solder
and
wiped
clean.
5
.0
Test
Procedure
5.1
Preparation
for
Test
5.1.1
Using
additional
pieces
of
solder
identical
to
the
test
specimen,
determine
the
flux
content
of
the
flux
cored
solder
in
accordance
with
IPC-TM-650,
Test
Method
2.3.34.1
and
expressed
in
percentage
units
(%F).
5.1.2
Set
up
test
configuration
as
shown
in
figure
1
.
The
soldering
iron
should
be
positioned
so
that
its
tip
extends
approximately
6
mm
through
the
aluminum
foil.
Number
2.4.48
Subject
Spitting
of
Flux-Cored
Wire
Solder
Date
Revision
1/95
Originating
Task
Group
Solder
Alloy
Task
Group
(5-24c)
5.1.4
Weight
the
solder
sample
(W1).
5.1
.5
Turn
on
soldering
iron
and
allow
the
tip
temperature
to
stabilize.
5.2
Test
5.2.1
Apply
the
solder
sample
to
the
heated
soldering
iron
tip
approximately
at
an
even
rate,
1
cm
at
a
time,
keeping
the
soldering
iron
tip
temperature
steady.
5.3
Evaluation
5.3.1
Weight
the
stub(s)
of
the
solder
specimen
not
melted
in
the
test
(W2).
5.3.2
Weight
the
aluminum
foil
containing
the
spattered
flux
(P2).
5.3.3
Calculate
the
percent
weight
of
spattered
flux
as
fol¬
lows:
Percent
by
weight
of
spattered
flux
二
(P2-P1)
F
x
(W1
-
W2)
6
.0
Notes
6・1
Safety
Observe
all
appropriate
safety
precautions.
5.1.3
Weight
the
aluminum
foil
(P1)
and
place
it
on
the
labo¬
ratory
stand
tray/ring
so
that
the
11
mm
hole
is
centered
around
the
tip
of
the
soldering
iron.