IPC-TM-650 EN 2022 试验方法--.pdf - 第735页

photolithographic processes such that a minimum of twelve good specimens are yielded at the end of 3.4.5. On the ‘ ‘Test Surface,’’ etch f our conductors 3 .2 m m [0.126 in] w ide, 5.7 mm [0.224 in] pitch, 230 - 250 mm […

1 Scope

This test method describes the procedure for

establishing the service temperature for metal-clad flexible

base material (laminate) as described in IPC-4204 as well as

cover materials and adhesive bonding films (unsupported

adhesive and supported bond plies) as described in IPC-

4203. For purposes of this test method, cover material

consist of coverlay and coverfilm but include cover-

coat materials. Properties evaluated after thermal aging in this

test are: visual, peel strength and dielectric strength.

2 Applicable Documents

2.1 IPC

Terms and Definitions for Interconnecting and

Packaging Electronic Circuits

Test Methods Manual

2.4.9 Peel Strength, Flexible Dielectric Materials

2.4.13 Solder Float Resistance Flexible Printed Wiring

Materials

Adhesive Coated Dielectric Films for Use as Cover

Sheets for Flexible Printed Circuitry and Flexible Adhesive

Bonding Films

Metal Foil for Printed Board Applications

2.2 ASTM International

Standard Test Method for Dielectric Break-

down Voltage and Dielectric Strength of Solid Electrical Insu-

lating Materials at Commercial Power Frequencies

3 Bond Strength Test Procedure

3.1 Specimen Preparation for Metal-Clad Flexible Base

Material (Laminate)

3.1.1

Prepare twelve specimens according to the procedure

outlined for method A of IPC TM-650, method 2.4.9, using

appropriate photolithographic processes. Etch four conduc-

tors 3.2 mm [0.126 in] wide, 5.7 mm [0.224 in] pitch, 230 -

250 mm [9 - 10 in] long on a nominal 25 mm [1 in] wide strip

of flexible base dielectric (see Figure 1).

Single-clad or double-clad flexible base material

tested in the format supplied. If the flexible base material

under test is double-clad, prepare a separate set of speci-

mens for each side. It is permissible to leave the unetched

copper on the non-test side (see Notes 6.1 and 6.2).

3.2 Specimen Preparation for Cover Material

3.2.1

Single-clad base material be produced from

specimens of the cover materials. Cover material

bonded to the shiny side of 34.3 µm [1.35 mil] copper foil,

type CU-E1-1S or CU-E7-1S per IPC-4562 (CU-E1-1S

be the referee material). Copper foil cleaning be per the

manufacturer’s normal cleaning procedure. The referee clean-

ing procedure

be per Table 1.

3.2.2

Prepare twelve specimens according to the procedure

outlined for method A of IPC TM-650, method 2.4.9, using

appropriate photolithographic processes. Etch four conduc-

tors 3.2 mm [0.126 in] wide, 5.7 mm [0.224 in] pitch, 230 -

250 mm [9 - 10 in] long on a nominal 25 mm [1 in] wide strip

of flexible base dielectric (see Figure 1).

3.3 Specimen Preparation for Adhesive Bonding Film

3.3.1

Metal-clad flexible base material be produced

from specimens of the adhesive bonding film being evaluated.

Adhesive bonding film

be bonded to the shiny side of

34.3 µm [1350 µin] ED copper foil, type CU-E1-1S or RA

copper foil, CU-E7-1S per IPC-4562 (CU-E1-1S

be the

referee material). Adhesive bonding film

be bonded

between the copper foil and CU-E1-1S as support material as

illustrated in Figure 2. Copper foil cleaning

be per the

manufacturer’s normal cleaning procedure. The referee clean-

ing procedure

be per Table 1, the same as detailed in

IPC-4203.

Prepare specimens according to the procedure outlined for

method A of IPC TM-650, method 2.4.9, using appropriate

1. www.ipc.org

2. Current and revised IPC Test Methods are available on the IPC Web site (www.ipc.org/html/testmethods.htm)

3. www.astm.org

3000 Lakeside Drive, Suite 309S

Bannockburn, IL 60015-1249

IPC-TM-650

TEST METHODS MANUAL

Number

2.6.21

Subject

Service Temperature of Metal-Clad Flexible Laminate,

Cover Material and Adhesive Bonding Films

Date

6/11

Revision

Originating Task Group

Flexible Circuits Test Methods Subcommittee

(D-15)

Association

Connecting

Electronics

Industries

shall

not

shall

IPC-T-50

IPC-TM-650

IPC-4203

IPC-4562

ASTM

D-149

shall

Material

this

Test

Methods

Manual

was

voluntarily

established

Technical

Committees

PC.

This

material

advisory

only

and

use

adaptation

，

entirely

voluntary.

IPC

disclaims

all

liability

any

kind

the

use,

application,

adaptation

this

material.

Users

are

also

wholly

responsible

for

protecting

themselves

against

all

claims

liabilities

for

patent

infringement.

Equipment

referenced

for

the

convenience

the

user

and

does

not

imply

endorsement

IPC.

Page

photolithographic processes such that a minimum of twelve

good specimens are yielded at the end of 3.4.5. On the ‘‘Test

Surface,’’ etch four conductors 3.2 mm [0.126 in] wide,

5.7 mm [0.224 in] pitch, 230 - 250 mm [9 - 10 in] long on a

nominal 25 mm [1 in] wide strip of flexible base dielectric (see

Figures 1 and 2).

3.4 Conditioning and Aging Procedure

3.4.1

Twelve specimens, as described in section 3, be

subjected to a stabilization period of a minimum of 24 hours

at 23 °C ± 2 °C [73.4 °F ± 3.6 °F] and 50% ± 5% RH.

IPC-2-6-21a

Metal Conductor (4 each)

3.2 mm

[0.126 in]

25 mm [1 in]

(nom.)

230–250 mm [9–10 in]

5.7 mm

[0.224 in]

1 Soak Clean

Use commercially available acid or alkaline

cleaners

Per supplier recommended

temperature

Per supplier recommended

time

2 Rinse Running tap water Room Temperature 3 - 5 minutes

3 Microetch

Sodium persulfate: Two liters of deionized

water, 280 grams of sodium persulfate,

25 cc sulfuric acid

Room Temperature 1 - 2 minutes

4 Rinse Running tap water Room Temperature 1 minute

5 Acid Dip

Sulfuric acid 10% by volume, dilution 1.8

liters deionized water, 200 cc sulfuric acid

96% assay

Room Temperature 45 seconds

6 Rinse Running tap water Room Temperature 1 minute

7 Rinse Deionized water Room Temperature 1 minute

8 Dry Force air dry or blot with paper towels Room Temperature 1 - 3 minutes

9 Bake Bake in clean air-circulating oven 110 ± 5 °C [230.0 ± 9.0 °F] 10 to 15 minutes

10 Lamination

*Maximum delay between bake and

lamination

be 30 minutes

*Lamination conditions (e.g., pressure, temperature, time, etc.) conform to suppliers’ recommendations.

Number

2.6.21

Subject

Service Temperature of Metal-Clad Flexible Laminate, Cover

Material and Adhesive Bonding Films

Date

6/11

Revision

IPC-TM-650

—

Figure

Construction

Specimens

for

Peel

Strength

Testing

Table

Cleaning

Process

for

Shiny

Copper

shall

Step

Process

Material

Temperature

Time

shall

Page

3.4.2

Measure the flexible base dielectric thickness and the

metal thickness of the twelve specimens by micrometer, cali-

per or similar following the stabilization period in 3.4.1. Nomi-

nal metal thickness to be tested is either 1 oz or 34.3 µm

[1350 µin] thick (preferred) or

⁄

oz or 17.1 µm [680 µin] thick.

3.4.3

On the specimens stabilized in 3.4.1, measure and

verify that the conductor widths are 3.2 mm ± 0.15 mm

[0.126 in ± 5.9 µin].

3.4.4

Examine the twelve specimens measured in 3.4.3

using normal or corrected 20/20 (also termed 6/6 or 1.0)

vision, and discard any peel strips showing the presence of

any wrinkles, cracks, blisters, or loose conductors. Twelve

specimens are required for the test, so any specimens not

meeting this criterion

be replaced.

3.4.5

Per IPC-TM-650, TM 2.4.13, Method B, subject the

specimens examined in 3.4.4 to pre-drying and then solder

float.

3.4.6

Examine the specimens subjected to solder float in

3.4.5 using normal or corrected 20/20 (also termed 6/6 or 1.0)

vision. Discard any peel strips showing the presence of any

wrinkles, cracks, blisters, or loose conductors. Verify that at

least twelve good specimens remain.

3.4.7

Place six specimens into an air-circulating oven at the

desired Service Temperature value. The oven temperature

be held at a tolerance of ± 3°C [5.4 °F]. The specimens

are to continuously remain in the oven for 1000 hours, -0

hours / +12 hours.

3.4.8

After being aged per 3.4.7, the test specimens

be cooled to room temperature at standard ambient labora-

tory conditions. After being cooled to room temperature, the

thermally aged (oven conditioned) specimens

be sub-

jected to a stabilization period of a minimum of 24 hours at

23 °C ± 2 °C [73.4 °F ± 3.6 °F] and 50% ± 5% RH.

3.4.9

After the stabilization period in 3.4.8, examine the

specimens using normal or corrected 20/20 (also termed 6/6

or 1.0) vision, and record the presence of any wrinkles,

cracks, blisters, or loose conductors, or any delamination.

3.5 Measurement of Peel Strength

3.5.1

AABUS, test specimens may have rigid reinforcement

material attached to all twelve specimens that were subjected

to the solder float in 3.4.5, including those six specimens that

were additionally subjected to thermal aging in 3.4.7. The rigid

reinforcement material

be attached prior to condi-

tioning and aging. The attachment of the rigid reinforcement

material depends on a number of factors, including the type of

peel test apparatus as described in IPC-TM-650, Method

2.4.9. If the rigid reinforcement material is to be utilized, it

should be adhered to the specimens using double-faced

adhesive tape or appropriate adhesive system to the back

side of the specimens.

If the test specimens are generated from double-clad flexible

base materials with metal remaining on the non-test side, the

additional rigid reinforcement material is unnecessary and

should not be used.

3.5.2

Measure the peel strength of the twelve conductors

per the procedures outlined in IPC TM-650, Method 2.4.9.

Specifically, peel the etched copper conductors away from

the dielectric at a 90° angle and at a 50.8 mm [2 in] per min-

ute crosshead speed.

3.6 Document and Report Results

3.6.1

Calculate the average peel strength of the six speci-

mens that were only exposed to the solder float (i.e., only as

per 3.4.5 and

exposed to the thermal aging of 3.4.7). Do

the same for the six thermally aged specimens per 3.4.7. Cal-

culate the ratio of the ‘‘thermally aged’’ average peel

strengths divided by the solder-floated only average peel

strength to determine the percentage retention of peel

strength. Record this number to ± 1% accuracy.

[Ave. of Six (6) Peel Strengths of Thermally Aged Specimens]

[Ave. of Six (6) Peel Strengths of Solder Floated-Only Specimens

x 100 = % of Peel Strength Retained

IPC-2-6-21-2

1 oz ED or RA Copper Foil Test Surface

(Shiny side toward the adhesive)

1 oz ED Copper Foil with Treated Matte

Side Inward as Support Material

Adhesive Bonding Film

Number

2.6.21

Subject

Service Temperature of Metal-Clad Flexible Laminate, Cover

Material and Adhesive Bonding Films

Date

6/11

Revision

IPC-TM-650

Figure

Use

Adhesive

Bonding

Film

Form

Test

Specimen

shall

not

shall

Page