IPC-TM-650 EN 2022 试验方法--.pdf - 第408页
Number 2.4.53 Subject Dye and Pull Test Method (Formerly Known as Dye and Pry) Date 8/2017 Revision Page 7 of 1 1 Figure 14 Mirrored Dye Indication Following Pull - Board Side Figure 15 Mirrored Dye Indication Following …
Number
2.4.53
Subject
Dye and Pull Test Method (Formerly Known as Dye and Pry)
Date
8/2017
Revision
Page 6 of 11
Figure
11
Example
of
a
Pull
Tester
Stage
and
Clamps
Note:
These
photographs
are
for
reference
only
and
should
not
be
construed
as
implying
that
a
measurement
is
being
made
in
accord
with
this
method.
Figure
13
Example
Showing
Ball
Grid
Array
(BGA)/
Part
(Top)
and
Remaining
Board
(Bottom)
Figure
10
Example
of
Pull
Method
to
Remove
the
BGA
From
the
Board
Note:
These
photographs
are
for
reference
only
and
should
not
be
construed
as
implying
that
a
measurement
is
being
made
in
accord
with
this
method.
Figure
12
Typical
Pull-Test
Fixture
With
Stage
Clamps
Note:
These
photographs
are
for
reference
only
and
should
not
be
construed
as
implying
that
a
measurement
is
being
made
in
accord
with
this
method.
IPC-TM-650
—
7
*
»
M
m
.
B
-
f
Jj
>
>
•••
------
c
m
Number
2.4.53
Subject
Dye and Pull Test Method (Formerly Known as Dye and Pry)
Date
8/2017
Revision
Page 7 of 11
Figure
14
Mirrored
Dye
Indication
Following
Pull
-
Board
Side
Figure
15
Mirrored
Dye
Indication
Following
Pull
-
Part
Side
Figure
16
Examples
of
Board
Showing
Laminate
Fractures
(Pad
Cratering)
Note
the
faint
(pink
stain)
red
dye
indication.
IPC-TM-650
—
1 2
A
B
C
D
IPC-2-4-53-19
1
2
5
3
6
7
9
8
10
4
Number
2.4.53
Subject
Dye and Pull Test Method (Formerly Known as Dye and Pry)
Date
8/2017
Revision
Page 8 of 11
Figure
17
Example
of
Separation
Surfaces
After
Component
Removal
1.
Board
side
2.
Part
side
Figure
19
Example
of
Dye
and
Pull
Location
Type
2
3
4
5
6
BGA
substrate
7
8
9
10
Copper
pad
on
BGA
BGA
solder
sphere
Copper
pad
on
board
Board
laminate
Figure
18
Examples
of
Head
on
Pillow
(HoP)
Failures
A.
Optical;
IC
carrier
side
on
top
and
board
side
on
bottom
B.
X-ray
image
C.
Post
dye
and
pull;
IC
carrier
side
D.
Post
dye
and
pull;
board
side
IPC-TM-650
—
X
X
X
X
X
1
2
3
4
5
e
e
e
e
e
p
p
p
p
p