IPC-TM-650 EN 2022 试验方法--.pdf - 第741页
IPC-TM-650 Number Subject Date Revision Page 3 of 3 7/93 2.6.23 Test Procedure for Steam Ager Temperature Repeatability 6.0 Notes 6.1 Care should be exercised when interpreting analysis results. Cp may not be meaningful …
Note:
IPC-TM-650
Number
Subject Date
Revision
Page 2 of 3
2.6.23
Test
Procedure
for
Steam
Ager
Temperature
Repeatability
7/93
Each
thermocouple
shall
be
secured
using
positive
mechani¬
cal
means.
For
example,
the
thermocouple
wire
could
be
wound
around
a
piano
wire
secured
across
the
width
of
the
ager.
The
natural
airflow
within
the
ager
should
be
preserved.
Extra
baffles
or
wire
mesh
screens
should
not
be
included
for
this
test,
if
not
used
during
regular
solderability
testing.
Venting
should
be
preserved
as
it
is
during
normal
testing.
The
end
of
the
thermocouple,
including
the
weld
bead
and
exposed
wires,
should
be
oriented
vertically
(pointing
upward)
to
prevent
water
drops
from
collecting
on
them.
5.3
Performing
the
Test
Turn
on
the
ager
and
allow
to
stabilize
until
measurement
procedures
used
during
regular
testing
indicate
stability
has
been
achieved.
Four
hours
is
usually
required
in
most
agers
to
achieve
stability,
and
this
,,warmup^^
time
should
be
included
in
the
production
part
test
procedure.
Start
the
test,
logging
temperature
every
15
minutes
for
8
hours,
(if
the
data
clearly
indicates
that
the
natural
variability
within
the
chamber
varies
more
quickly,
the
sampling
fre¬
quency
can
be
increased
as
necessary)
When
logging
temperatures,
all
thermocouples
should
be
measured
simultaneously,
or
within
2
minutes
maximum.
Temperatures
shall
be
recorded
in
degrees
Celsius.
Measure
temperature
to
the
nearest
0.1
degree.
The
steam
agers
shall
not
be
disturbed
during
the
test,
except
for
routine
maintenance
or
inspection
procedures;
as
used
during
normal
testing.
The
ager
shall
be
tested
without
other
components
inside.
5.4
Test
Conditions
Test
the
temperature
stability
at
the
temperature
set
point
used
for
solderability
testing.
5.5
Data
Analysis
5.5.1
Record
the
following
data
for
each
test.
a.
Ager
manufacturer
and
model
number
b.
Temperature
indicator
type,
date
of
calibration
c.
Test
date
d.
Sampling
frequency
e.
Total
vent
area
on
chamber
lid
[sq.cm]
f.
Total
chamber
cross-sectional
surface
area
[sq.cm]
g.
Total
volume
of
air
in
chamber
[cu.cm]
h.
Set
point
temperature
i.
Test
location
i.
in
hood
ii.
on
table
against
wall
iii.
on
table
in
open
room
j.
Location
of
room
air
conditioning
vents
(include
sketch)
k.
Notes
on
any
special
conditions
during
test
I.
Distance
from
thermocouples
to
water
level
m.
Location
of
thermocouples
inside
ager
(include
sketch)
n.
Room
temperature
when
testing
5.5.2
Test
Data
Prepare
a
matrix
of
test
data,
showing
temperature
of
each
thermocouple
at
each
sampling
interval.
5.5.3
Control
Charts
Prepare
X-bar
and
R
charts
with
appropriate
control
limits.
A
control
limit
calculation
form
is
shown
in
Appendix
1.
Further
instructions
on
preparation
of
control
charts
can
be
found
in
I
PC-
PC-90
or
ANSI/ASQC
Z1.1, Z1.2,
and
Z1.3.
Subgroups
shall
consist
of
all
thermocouples
placed
in
the
ager
(8
or
10),
and
which
are
measured
simultaneously
during
the
test.
The
charts
shall
be
considered
out
of
control
if
any
of
the
fol¬
lowing
applies:
a.
any
one
data
point
is
beyond
the
control
limits
b.
any
2
or
3
consecutive
points
are
near
a
control
limit
(outer
third)
c.
a
run
of
8
or
more
points
is
above
or
below
the
center
line
d.
a
run
of
6
or
more
points
is
increasing
or
decreasing
5.5.4
Process
Capability
Histogram
Prepare
a
process
capability
histogram,
using
data
ranges
of
1/2℃
or
less.
Estimate
the
mean
and
standard
deviation
of
the
data.
5.5.5
Process
Capability
Index
Calculate
the
process
capability
index,
Cp
using
the
equation
shown
below
(from
IPC-PC-90
example
7.5.
6.2)
for
specification
limits
of
±1℃
[±1.8°F],
±2℃
[±3.6°F],
±3℃[±5.4°F]
and
±4℃[±7.2°F].
Cp
=
USL-LSL
-
6S
Where,
Cp
二
capability
index
USL
=
upper
specification
limit
LSL
=
lower
specification
limit
S
=
process
standard
deviation
Include
a
plot
of
Cp
against
specification
tolerance
range.
IPC-TM-650
Number
Subject Date
Revision
Page 3 of 3
7/93
2.6.23
Test
Procedure
for
Steam
Ager
Temperature
Repeatability
6.0
Notes
6.1
Care
should
be
exercised
when
interpreting
analysis
results.
Cp
may
not
be
meaningful
if
the
X-bar
or
R
charts
are
out
of
control,
or
the
process
capability
histogram
is
grossly
non-normal.
Consult
IPC-PC-90
or
ANSI/ASQC
Z1
.1
,
Z1
.2
and
Z1
.3
for
further
details.
IPC-3408
Note:
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 3
r
ASSOCIATION
CONNECTING
/
ELECTRONICS
INDUSTRIES
221
5
Sanders
Road
Northbrook,
IL
60062-6135
IPC-TM-650
TEST
METHODS
MANUAL
1
Scope
The
purpose
of
these
tests
is
to
characterize
changes
in
individual
interconnection
resistances
as
a
function
of
exposure
time
in
various
environmental
aging
conditions
for
both
flex
to
PWB
and
flex
to
indium-tin-oxide
(ITO)
coated
glass
bonds.
2
Applicable
Documents
General
Requirements
for
Anisotropically
Conduc¬
tive
Adhesive
Films
3
Test
Specimens
3.1
0.2
mm
line/space
test
boards
0.2
mm
line/space
flex
test
circuits
4
Apparatus
4.1
ITO
coated
soda-lime
glass
test
slides,
20
ohms/sq.
mm
4.2
Polypropylene
trays
for
sample
storage
in
chamber
4.3
Instrumentation
to
permit
four-probe
resistance
mea¬
surement
4.5
Required
environmental
test
chamber(s):
a)
Thermal
aging,
100℃
b)
Thermal
cycling,
-55℃
to
>125℃,
five
hour
period
c)
Humidity
aging,
60℃/95%
RH
5
Procedure
5.1
Sample
Preparation
5.1.1
Cut
the
flex
test
circuits
to
the
appropriate
length
(see
Figure
1
and
Figure
2).
If
flex
board
samples
are
being
pre¬
pared,
all
traces
on
the
flex
should
be
shorted
together
on
one
end.
5.1.2
Use
of
new
PCB
is
recommended.
If
new
boards
are
being
used,
there
should
be
no
need
for
any
special
cleaning
procedure.
If
used
boards
are
to
be
used,
they
should
be
inspected
to
ensure
that:
Number
2.6.24
Subject
Junction
Stability
Under
Environmental
Conditions
Date
11/98
Revision
Originating
Task
Group
SMT
Mounting
Adhesives
Task
Group
(5-24d)
a)
Protective
metalization
(Au
or
Pb-Sn)
is
intact.
b)
FR-4
isn't
significantly
discolored
from
prior
high
tempera¬
ture
exposure.
c)
The
board
is
free
of
any
residue
from
previous
tests.
5.1.3
Refer
to
5.2
for
proper
bonding
procedure.
5.2
Sample
Procedure
5.2.1
Prepare
at
least
three
test
samples
for
each
test
con¬
dition
to
be
run.
For
the
flex
board
case,
it
is
possible
to
mount
two
test
samples
on
each
board.
Refer
to
I
PC-3408
for
proper
bonding
procedure.
5.2.2
After
bonding
is
completed,
each
sample
should
be
identified
by
a
test
number.
Test
numbers
should
be
written
on
the
test
substrate
using
an
indelible
marker.
5.2.3
Clamp
the
unbonded
end
of
the
flexible
circuit
to
the
matching
board
traces
to
make
electrical
contact,
with
an
elastomeric
compliant
layer
behind
the
flex
to
maintain
uniform
contact
force.
5.2.4
Initial
interconnection
resistances
should
be
measured
and
recorded.
The
recommended
measurement
technique
is
illustrated
in
Figure
3.
This
technique
can
be
used
with
either
test
sample
type.
This
technique
doesn't
allow
for
the
measurement
of
the
first
and
last
circuit
trace.
There
are
1
5
measurements
to
be
made
on
each
sample.
5.2.5
Samples
should
be
placed
in
the
polypropylene
trays,
and
the
trays
placed
in
the
appropriate
chamber.
The
time
and
date
should
be
noted
for
the
purpose
of
computing
elapsed
time.
5.2.6
Samples
should
be
removed
from
the
chambers
for
resistance
measurement
after
24-hour,
one-week,
three-
week,
and
six-week
time
points.
All
environmental
tests
are
considered
complete
after
six
weeks.
Samples
should
be
allowed
to
equilibrate
at
ambient
conditions
for
at
least
30
minutes
prior
to
measurement.
5.2.7
All
resistance
data
should
be
tabulated
and/or
graphed
to
facilitate
proper
interpretation
of
the
results.